JPS6425045A - Evaluating method of resin sealed semiconductor device - Google Patents
Evaluating method of resin sealed semiconductor deviceInfo
- Publication number
- JPS6425045A JPS6425045A JP62182704A JP18270487A JPS6425045A JP S6425045 A JPS6425045 A JP S6425045A JP 62182704 A JP62182704 A JP 62182704A JP 18270487 A JP18270487 A JP 18270487A JP S6425045 A JPS6425045 A JP S6425045A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- sealed semiconductor
- sealing resin
- resin
- contrast medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Analysing Materials By The Use Of Radiation (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE:To ensure the observation of defects in a sealing resin, by infiltrating a contrast medium into the sealing resin of a resin sealed semiconductor device by pressurization, and thereafter observing the resin sealed semiconductor device with a fluoroscopic apparatus. CONSTITUTION:A resin sealed semiconductor device 1 is inputted into a contrast medium such as angiography agent 7, which is contained in a container 8 and prevents the transmission of X rays. Then pressure 9 is applied, and the contrast medium 7 is made to infiltrate into a sealing resin 4 of the semiconductor device 1. Thereafter the X rays 6 are projected. The inside of the sealing resin 4 is observed with a fluoroscopic apparatus. When cracks, voids or the like are present in the sealing resin 4, the contrast medium 7, i.e. the angiography agent, is inputted into said defect 5. The X rays 6 are shielded, and a shade is formed. When the defect is overlapped with a frame and the like, the direction of the semiconductor 1 is changed, and the defect 5 can be observed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62182704A JPS6425045A (en) | 1987-07-21 | 1987-07-21 | Evaluating method of resin sealed semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62182704A JPS6425045A (en) | 1987-07-21 | 1987-07-21 | Evaluating method of resin sealed semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6425045A true JPS6425045A (en) | 1989-01-27 |
Family
ID=16122978
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62182704A Pending JPS6425045A (en) | 1987-07-21 | 1987-07-21 | Evaluating method of resin sealed semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6425045A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012233751A (en) * | 2011-04-28 | 2012-11-29 | Polyplastics Co | X-ray contrast medium for use with resin, structural change detecting method and internal structure determining method |
CN102944567A (en) * | 2012-11-29 | 2013-02-27 | 中国航空综合技术研究所 | X-ray radiography detecting method for plastic package electron components |
-
1987
- 1987-07-21 JP JP62182704A patent/JPS6425045A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012233751A (en) * | 2011-04-28 | 2012-11-29 | Polyplastics Co | X-ray contrast medium for use with resin, structural change detecting method and internal structure determining method |
CN102944567A (en) * | 2012-11-29 | 2013-02-27 | 中国航空综合技术研究所 | X-ray radiography detecting method for plastic package electron components |
CN102944567B (en) * | 2012-11-29 | 2014-09-17 | 中国航空综合技术研究所 | X-ray radiography detecting method for plastic package electron components |
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