JPS6425045A - Evaluating method of resin sealed semiconductor device - Google Patents

Evaluating method of resin sealed semiconductor device

Info

Publication number
JPS6425045A
JPS6425045A JP62182704A JP18270487A JPS6425045A JP S6425045 A JPS6425045 A JP S6425045A JP 62182704 A JP62182704 A JP 62182704A JP 18270487 A JP18270487 A JP 18270487A JP S6425045 A JPS6425045 A JP S6425045A
Authority
JP
Japan
Prior art keywords
semiconductor device
sealed semiconductor
sealing resin
resin
contrast medium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62182704A
Other languages
Japanese (ja)
Inventor
Masakazu Nakabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62182704A priority Critical patent/JPS6425045A/en
Publication of JPS6425045A publication Critical patent/JPS6425045A/en
Pending legal-status Critical Current

Links

Landscapes

  • Analysing Materials By The Use Of Radiation (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To ensure the observation of defects in a sealing resin, by infiltrating a contrast medium into the sealing resin of a resin sealed semiconductor device by pressurization, and thereafter observing the resin sealed semiconductor device with a fluoroscopic apparatus. CONSTITUTION:A resin sealed semiconductor device 1 is inputted into a contrast medium such as angiography agent 7, which is contained in a container 8 and prevents the transmission of X rays. Then pressure 9 is applied, and the contrast medium 7 is made to infiltrate into a sealing resin 4 of the semiconductor device 1. Thereafter the X rays 6 are projected. The inside of the sealing resin 4 is observed with a fluoroscopic apparatus. When cracks, voids or the like are present in the sealing resin 4, the contrast medium 7, i.e. the angiography agent, is inputted into said defect 5. The X rays 6 are shielded, and a shade is formed. When the defect is overlapped with a frame and the like, the direction of the semiconductor 1 is changed, and the defect 5 can be observed.
JP62182704A 1987-07-21 1987-07-21 Evaluating method of resin sealed semiconductor device Pending JPS6425045A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62182704A JPS6425045A (en) 1987-07-21 1987-07-21 Evaluating method of resin sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62182704A JPS6425045A (en) 1987-07-21 1987-07-21 Evaluating method of resin sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS6425045A true JPS6425045A (en) 1989-01-27

Family

ID=16122978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62182704A Pending JPS6425045A (en) 1987-07-21 1987-07-21 Evaluating method of resin sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS6425045A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012233751A (en) * 2011-04-28 2012-11-29 Polyplastics Co X-ray contrast medium for use with resin, structural change detecting method and internal structure determining method
CN102944567A (en) * 2012-11-29 2013-02-27 中国航空综合技术研究所 X-ray radiography detecting method for plastic package electron components

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012233751A (en) * 2011-04-28 2012-11-29 Polyplastics Co X-ray contrast medium for use with resin, structural change detecting method and internal structure determining method
CN102944567A (en) * 2012-11-29 2013-02-27 中国航空综合技术研究所 X-ray radiography detecting method for plastic package electron components
CN102944567B (en) * 2012-11-29 2014-09-17 中国航空综合技术研究所 X-ray radiography detecting method for plastic package electron components

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