JPS6424843U - - Google Patents
Info
- Publication number
- JPS6424843U JPS6424843U JP1987118560U JP11856087U JPS6424843U JP S6424843 U JPS6424843 U JP S6424843U JP 1987118560 U JP1987118560 U JP 1987118560U JP 11856087 U JP11856087 U JP 11856087U JP S6424843 U JPS6424843 U JP S6424843U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- wiring
- multilayer wiring
- top layer
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05556—Shape in side view
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987118560U JPS6424843U (US06649357-20031118-C00005.png) | 1987-08-01 | 1987-08-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987118560U JPS6424843U (US06649357-20031118-C00005.png) | 1987-08-01 | 1987-08-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6424843U true JPS6424843U (US06649357-20031118-C00005.png) | 1989-02-10 |
Family
ID=31363009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987118560U Pending JPS6424843U (US06649357-20031118-C00005.png) | 1987-08-01 | 1987-08-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6424843U (US06649357-20031118-C00005.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02306635A (ja) * | 1989-05-22 | 1990-12-20 | Fujitsu Ltd | 半導体装置 |
-
1987
- 1987-08-01 JP JP1987118560U patent/JPS6424843U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02306635A (ja) * | 1989-05-22 | 1990-12-20 | Fujitsu Ltd | 半導体装置 |
