JPS642464U - - Google Patents

Info

Publication number

JPS642464U

JPS642464U JP9650087U JP9650087U JPS642464U JP S642464 U JPS642464 U JP S642464U JP 9650087 U JP9650087 U JP 9650087U JP 9650087 U JP9650087 U JP 9650087U JP S642464 U JPS642464 U JP S642464U

Authority

JP

Japan

Prior art keywords

conductive layer

circuit board

thermal conductivity

reflow soldering

soldered

Prior art date

1987-06-25

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000005476 soldering Methods 0.000 claims description 6
• 239000000758 substrate Substances 0.000 claims description 6
• 239000000463 material Substances 0.000 claims 6
• 239000004020 conductor Substances 0.000 claims 1
• 238000010438 heat treatment Methods 0.000 claims 1
• 238000010615 ring circuit Methods 0.000 claims 1
• 229910000679 solder Inorganic materials 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 2