JPS6424247A - Photosensitive resin composition - Google Patents
Photosensitive resin compositionInfo
- Publication number
- JPS6424247A JPS6424247A JP18137087A JP18137087A JPS6424247A JP S6424247 A JPS6424247 A JP S6424247A JP 18137087 A JP18137087 A JP 18137087A JP 18137087 A JP18137087 A JP 18137087A JP S6424247 A JPS6424247 A JP S6424247A
- Authority
- JP
- Japan
- Prior art keywords
- compd
- titled composition
- polymer
- formula
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
Abstract
PURPOSE:To improve the workability of the titled composition, without twisting around a peeling roll of an automatic peeling machine by incorporating a specified ethylenic unsatd. compd., a polymer capable of giving a film forming property and contg. carboxylic group, and a photopolymerization initiator and/or its precursor in the titled composition. CONSTITUTION:The compd. shown by formula I is incorporated in the titled composition in an amount of 20-90pts.wt. based on 100pts.wt. of the total amount of said compd. and the polymer, and said polymer is incorporated in the titled composition in an amount of 10-80pts.wt. based on 100pts.wt. of the total amount of the polymer and the compd. shown by formula I, and the org. halogen compd. and the photopolymerization initiator or its precursor are incorporated in the titled composition in an amount of 0.1-10pts.wt. based on 100pts.wt. of the total amount of the compd. shown by formula I and said polymer respectively. In formula I, (l), (m) and (n) are an integer of 0-2, R1 and R2 are each hydrogen atom or methyl group. Thus, the peeled piece of the titled composition is easily removed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18137087A JPS6424247A (en) | 1987-07-21 | 1987-07-21 | Photosensitive resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18137087A JPS6424247A (en) | 1987-07-21 | 1987-07-21 | Photosensitive resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6424247A true JPS6424247A (en) | 1989-01-26 |
Family
ID=16099539
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18137087A Pending JPS6424247A (en) | 1987-07-21 | 1987-07-21 | Photosensitive resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6424247A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6555290B1 (en) | 1995-04-19 | 2003-04-29 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition and photosensitive element using the same |
WO2009081925A1 (en) * | 2007-12-25 | 2009-07-02 | Asahi Kasei E-Materials Corporation | Layered photosensitive-resin product |
JP2010197831A (en) * | 2009-02-26 | 2010-09-09 | Hitachi Chem Co Ltd | Photosensitive resin composition and photosensitive element using the composition, method for forming resist pattern and method for manufacturing printed wiring board |
-
1987
- 1987-07-21 JP JP18137087A patent/JPS6424247A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6555290B1 (en) | 1995-04-19 | 2003-04-29 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition and photosensitive element using the same |
WO2009081925A1 (en) * | 2007-12-25 | 2009-07-02 | Asahi Kasei E-Materials Corporation | Layered photosensitive-resin product |
JP2010197831A (en) * | 2009-02-26 | 2010-09-09 | Hitachi Chem Co Ltd | Photosensitive resin composition and photosensitive element using the composition, method for forming resist pattern and method for manufacturing printed wiring board |
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