JPS642393A - Manufacture of conductive circuit substrate - Google Patents

Manufacture of conductive circuit substrate

Info

Publication number
JPS642393A
JPS642393A JP15866887A JP15866887A JPS642393A JP S642393 A JPS642393 A JP S642393A JP 15866887 A JP15866887 A JP 15866887A JP 15866887 A JP15866887 A JP 15866887A JP S642393 A JPS642393 A JP S642393A
Authority
JP
Japan
Prior art keywords
film
thin
working electrode
thickness
high molecular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15866887A
Other languages
Japanese (ja)
Other versions
JPH012393A (en
Inventor
Kazuhiro Tachibana
Hiroshi Suyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissha Printing Co Ltd
Original Assignee
Nissha Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissha Printing Co Ltd filed Critical Nissha Printing Co Ltd
Priority to JP62-158668A priority Critical patent/JPH012393A/en
Priority claimed from JP62-158668A external-priority patent/JPH012393A/en
Publication of JPS642393A publication Critical patent/JPS642393A/en
Publication of JPH012393A publication Critical patent/JPH012393A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To obtain a thin-film circuit pattern with excellent workability by bringing a high molecular thin-film in specified thickness into contact onto a working electrode in a conductive circuit pattern, interposing an electrolyte containing metallic ions between the working electrode and a counter electrode and forming a metallic layer in predetermined thickness up to its midway of the high molecular thin-film through conduction. CONSTITUTION:Copper in approximately 0.1mum thickness is evaporated onto a glass substrate, a working electrode in a specified shape pattern in approximately 10mum line width is acquired through etching, and a polyethylene-polyvinyl alcohol copolymer is applied onto the working electrode at a ratio of 70:30. The thickness of the high molecular thin-film is specified previously within a range of 10-100mum at that time, and the thin-film is dried for two hr at 130 deg.C. The working electrode and an-oppositely faced platinum electrode are admitted into an electrolytic cell filled with a 1.5M tin chloride aqueous solution, and a metallic layer within the range of thickness of 0.01-3mum toward the inside is shaped into the thin-film through conduction. The thin-film is peeled from the substrate and washed sufficiently, and the metallic layer is plated previously with copper.
JP62-158668A 1987-06-25 Method for manufacturing conductive circuit board Pending JPH012393A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62-158668A JPH012393A (en) 1987-06-25 Method for manufacturing conductive circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62-158668A JPH012393A (en) 1987-06-25 Method for manufacturing conductive circuit board

Publications (2)

Publication Number Publication Date
JPS642393A true JPS642393A (en) 1989-01-06
JPH012393A JPH012393A (en) 1989-01-06

Family

ID=

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012097319A (en) * 2010-11-01 2012-05-24 Eamex Co Method for producing polyelectrolyte complex

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012097319A (en) * 2010-11-01 2012-05-24 Eamex Co Method for producing polyelectrolyte complex

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