JPS642393A - Manufacture of conductive circuit substrate - Google Patents
Manufacture of conductive circuit substrateInfo
- Publication number
- JPS642393A JPS642393A JP15866887A JP15866887A JPS642393A JP S642393 A JPS642393 A JP S642393A JP 15866887 A JP15866887 A JP 15866887A JP 15866887 A JP15866887 A JP 15866887A JP S642393 A JPS642393 A JP S642393A
- Authority
- JP
- Japan
- Prior art keywords
- film
- thin
- working electrode
- thickness
- high molecular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE:To obtain a thin-film circuit pattern with excellent workability by bringing a high molecular thin-film in specified thickness into contact onto a working electrode in a conductive circuit pattern, interposing an electrolyte containing metallic ions between the working electrode and a counter electrode and forming a metallic layer in predetermined thickness up to its midway of the high molecular thin-film through conduction. CONSTITUTION:Copper in approximately 0.1mum thickness is evaporated onto a glass substrate, a working electrode in a specified shape pattern in approximately 10mum line width is acquired through etching, and a polyethylene-polyvinyl alcohol copolymer is applied onto the working electrode at a ratio of 70:30. The thickness of the high molecular thin-film is specified previously within a range of 10-100mum at that time, and the thin-film is dried for two hr at 130 deg.C. The working electrode and an-oppositely faced platinum electrode are admitted into an electrolytic cell filled with a 1.5M tin chloride aqueous solution, and a metallic layer within the range of thickness of 0.01-3mum toward the inside is shaped into the thin-film through conduction. The thin-film is peeled from the substrate and washed sufficiently, and the metallic layer is plated previously with copper.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62-158668A JPH012393A (en) | 1987-06-25 | Method for manufacturing conductive circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62-158668A JPH012393A (en) | 1987-06-25 | Method for manufacturing conductive circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS642393A true JPS642393A (en) | 1989-01-06 |
JPH012393A JPH012393A (en) | 1989-01-06 |
Family
ID=
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012097319A (en) * | 2010-11-01 | 2012-05-24 | Eamex Co | Method for producing polyelectrolyte complex |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012097319A (en) * | 2010-11-01 | 2012-05-24 | Eamex Co | Method for producing polyelectrolyte complex |
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