JPS6423600A - Plastic molding housing for electronic device - Google Patents

Plastic molding housing for electronic device

Info

Publication number
JPS6423600A
JPS6423600A JP62179000A JP17900087A JPS6423600A JP S6423600 A JPS6423600 A JP S6423600A JP 62179000 A JP62179000 A JP 62179000A JP 17900087 A JP17900087 A JP 17900087A JP S6423600 A JPS6423600 A JP S6423600A
Authority
JP
Japan
Prior art keywords
resin
deforming temperature
carbon
thermal deforming
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62179000A
Other languages
Japanese (ja)
Other versions
JP2653791B2 (en
Inventor
Makoto Iida
Kenichi Waratani
Masao Goto
Akiichi Ota
Susumu Iwai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62179000A priority Critical patent/JP2653791B2/en
Priority to EP88111613A priority patent/EP0306671A1/en
Priority to CN88106014A priority patent/CN1020983C/en
Priority to KR1019880009039A priority patent/KR910007665B1/en
Publication of JPS6423600A publication Critical patent/JPS6423600A/en
Priority to US07/769,348 priority patent/US6156427A/en
Application granted granted Critical
Publication of JP2653791B2 publication Critical patent/JP2653791B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PURPOSE:To increase an initial shielding effect and to reduce a decrease due to a heating cycle by filling at least two types of conductive fiber having different diameter in a thermoplastic resin having specific thermal deforming temperature. CONSTITUTION:Conductive fibers (a), (b) presented in resin 1 are engaged in three-dimensions to form a conductive circuit having a network structure. Thus, the shielding function of an electromagnetic wave is presented. The resin 1 includes ABS(acrylonitrile-butadiene-styrene copolymer), PPE(polyphenylene ether), etc., and particularly employs a thermoplastic resin having 80 deg.C or higher of thermal deforming temperature as high heat resistance. If the thermal deforming temperature exceeds 210 deg.C, the fluidity, i.e., the moldability of the resin extremely drops. Accordingly, the thermal deforming temperature is preferably 80-210 deg.C. The fibers 2, 3 employ metal fiber having ductility like carbon, copper, stainless steel or brass. In order to reduce the resistance of the carbon, it is effective to employ carbon metal-plated, for example, with nickel or the like.
JP62179000A 1987-07-20 1987-07-20 Plastics molded housing for electronic devices Expired - Lifetime JP2653791B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP62179000A JP2653791B2 (en) 1987-07-20 1987-07-20 Plastics molded housing for electronic devices
EP88111613A EP0306671A1 (en) 1987-07-20 1988-07-19 Electroconductive resin composition for moulding, and shield moulded therefrom
CN88106014A CN1020983C (en) 1987-07-20 1988-07-20 Electroconductive resin composition for molding and its application
KR1019880009039A KR910007665B1 (en) 1987-07-20 1988-07-20 Electroconductive resin composition for moulding and shield moulded there from
US07/769,348 US6156427A (en) 1987-07-20 1991-10-02 Electroconductive resin composition for molding and electromagnetic wave interference shield structure molded from the composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62179000A JP2653791B2 (en) 1987-07-20 1987-07-20 Plastics molded housing for electronic devices

Publications (2)

Publication Number Publication Date
JPS6423600A true JPS6423600A (en) 1989-01-26
JP2653791B2 JP2653791B2 (en) 1997-09-17

Family

ID=16058362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62179000A Expired - Lifetime JP2653791B2 (en) 1987-07-20 1987-07-20 Plastics molded housing for electronic devices

Country Status (1)

Country Link
JP (1) JP2653791B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0621683A (en) * 1992-06-30 1994-01-28 Yazaki Corp Electromagnetic shield and manufacture thereof
WO2006042209A2 (en) * 2004-10-08 2006-04-20 Parker Hannifin Corp. Electromagnetic interference shielding enclosure molded from fiber reinforced thermoplastic

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5873198A (en) * 1981-10-26 1983-05-02 太平洋工業株式会社 Radio wave shielding housing
JPS58150203A (en) * 1981-12-30 1983-09-06 エヌ・ヴイ・ベカルト・エス・エイ Prastic product with conductive fiber
JPS63250198A (en) * 1987-04-07 1988-10-18 株式会社日立製作所 Electronic equipment electromagnetic wave shielding structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5873198A (en) * 1981-10-26 1983-05-02 太平洋工業株式会社 Radio wave shielding housing
JPS58150203A (en) * 1981-12-30 1983-09-06 エヌ・ヴイ・ベカルト・エス・エイ Prastic product with conductive fiber
JPS63250198A (en) * 1987-04-07 1988-10-18 株式会社日立製作所 Electronic equipment electromagnetic wave shielding structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0621683A (en) * 1992-06-30 1994-01-28 Yazaki Corp Electromagnetic shield and manufacture thereof
WO2006042209A2 (en) * 2004-10-08 2006-04-20 Parker Hannifin Corp. Electromagnetic interference shielding enclosure molded from fiber reinforced thermoplastic
WO2006042209A3 (en) * 2004-10-08 2006-07-13 Parker Hannifin Corp Electromagnetic interference shielding enclosure molded from fiber reinforced thermoplastic

Also Published As

Publication number Publication date
JP2653791B2 (en) 1997-09-17

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