JPS6423600A - Plastic molding housing for electronic device - Google Patents
Plastic molding housing for electronic deviceInfo
- Publication number
- JPS6423600A JPS6423600A JP62179000A JP17900087A JPS6423600A JP S6423600 A JPS6423600 A JP S6423600A JP 62179000 A JP62179000 A JP 62179000A JP 17900087 A JP17900087 A JP 17900087A JP S6423600 A JPS6423600 A JP S6423600A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- deforming temperature
- carbon
- thermal deforming
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
PURPOSE:To increase an initial shielding effect and to reduce a decrease due to a heating cycle by filling at least two types of conductive fiber having different diameter in a thermoplastic resin having specific thermal deforming temperature. CONSTITUTION:Conductive fibers (a), (b) presented in resin 1 are engaged in three-dimensions to form a conductive circuit having a network structure. Thus, the shielding function of an electromagnetic wave is presented. The resin 1 includes ABS(acrylonitrile-butadiene-styrene copolymer), PPE(polyphenylene ether), etc., and particularly employs a thermoplastic resin having 80 deg.C or higher of thermal deforming temperature as high heat resistance. If the thermal deforming temperature exceeds 210 deg.C, the fluidity, i.e., the moldability of the resin extremely drops. Accordingly, the thermal deforming temperature is preferably 80-210 deg.C. The fibers 2, 3 employ metal fiber having ductility like carbon, copper, stainless steel or brass. In order to reduce the resistance of the carbon, it is effective to employ carbon metal-plated, for example, with nickel or the like.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62179000A JP2653791B2 (en) | 1987-07-20 | 1987-07-20 | Plastics molded housing for electronic devices |
EP88111613A EP0306671A1 (en) | 1987-07-20 | 1988-07-19 | Electroconductive resin composition for moulding, and shield moulded therefrom |
CN88106014A CN1020983C (en) | 1987-07-20 | 1988-07-20 | Electroconductive resin composition for molding and its application |
KR1019880009039A KR910007665B1 (en) | 1987-07-20 | 1988-07-20 | Electroconductive resin composition for moulding and shield moulded there from |
US07/769,348 US6156427A (en) | 1987-07-20 | 1991-10-02 | Electroconductive resin composition for molding and electromagnetic wave interference shield structure molded from the composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62179000A JP2653791B2 (en) | 1987-07-20 | 1987-07-20 | Plastics molded housing for electronic devices |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6423600A true JPS6423600A (en) | 1989-01-26 |
JP2653791B2 JP2653791B2 (en) | 1997-09-17 |
Family
ID=16058362
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62179000A Expired - Lifetime JP2653791B2 (en) | 1987-07-20 | 1987-07-20 | Plastics molded housing for electronic devices |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2653791B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0621683A (en) * | 1992-06-30 | 1994-01-28 | Yazaki Corp | Electromagnetic shield and manufacture thereof |
WO2006042209A2 (en) * | 2004-10-08 | 2006-04-20 | Parker Hannifin Corp. | Electromagnetic interference shielding enclosure molded from fiber reinforced thermoplastic |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5873198A (en) * | 1981-10-26 | 1983-05-02 | 太平洋工業株式会社 | Radio wave shielding housing |
JPS58150203A (en) * | 1981-12-30 | 1983-09-06 | エヌ・ヴイ・ベカルト・エス・エイ | Prastic product with conductive fiber |
JPS63250198A (en) * | 1987-04-07 | 1988-10-18 | 株式会社日立製作所 | Electronic equipment electromagnetic wave shielding structure |
-
1987
- 1987-07-20 JP JP62179000A patent/JP2653791B2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5873198A (en) * | 1981-10-26 | 1983-05-02 | 太平洋工業株式会社 | Radio wave shielding housing |
JPS58150203A (en) * | 1981-12-30 | 1983-09-06 | エヌ・ヴイ・ベカルト・エス・エイ | Prastic product with conductive fiber |
JPS63250198A (en) * | 1987-04-07 | 1988-10-18 | 株式会社日立製作所 | Electronic equipment electromagnetic wave shielding structure |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0621683A (en) * | 1992-06-30 | 1994-01-28 | Yazaki Corp | Electromagnetic shield and manufacture thereof |
WO2006042209A2 (en) * | 2004-10-08 | 2006-04-20 | Parker Hannifin Corp. | Electromagnetic interference shielding enclosure molded from fiber reinforced thermoplastic |
WO2006042209A3 (en) * | 2004-10-08 | 2006-07-13 | Parker Hannifin Corp | Electromagnetic interference shielding enclosure molded from fiber reinforced thermoplastic |
Also Published As
Publication number | Publication date |
---|---|
JP2653791B2 (en) | 1997-09-17 |
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