JPS6422051U - - Google Patents
Info
- Publication number
- JPS6422051U JPS6422051U JP11733887U JP11733887U JPS6422051U JP S6422051 U JPS6422051 U JP S6422051U JP 11733887 U JP11733887 U JP 11733887U JP 11733887 U JP11733887 U JP 11733887U JP S6422051 U JPS6422051 U JP S6422051U
- Authority
- JP
- Japan
- Prior art keywords
- power module
- mounting member
- metal fitting
- mounting
- presser metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 1
Description
第１図は本考案の一実施例の概略構成図を示し
、同図Ａはその正面図、同図Ｂはその側面図、第
２図は本考案の他の実施例の概略構成図を示し、
同図Ａはその正面図、同図Ｂはその平面図、第３
図は従来のパワーモジユール取付機構の概略構成
図を示し、同図Ａはその正面図、同図Ｂはその側
面図である。
１……パワーモジユール、３……押え金具、４
……押え金具止めネジ、５……取付板または冷却
フイン、６……板バネ、１０，２０……パワーモ
ジユール取付機構。
Figure 1 shows a schematic diagram of an embodiment of the present invention, Figure A is a front view thereof, Figure B is a side view thereof, and Figure 2 is a schematic diagram of another embodiment of the invention. ,
Figure A is its front view, figure B is its top view, and the third
The figures show schematic configuration diagrams of a conventional power module mounting mechanism, with figure A being a front view thereof and figure B being a side view thereof. 1... Power module, 3... Presser fitting, 4
... Presser metal fitting screw, 5... Mounting plate or cooling fin, 6... Leaf spring, 10, 20... Power module mounting mechanism.
Claims (1)
ーモジユールにおいて、前記パワーモジユールを
前記取付部材上に押える押え金具と、前記押え金
具を前記取付部材に緊定する緊定部材とを備える
ことを特徴とするパワーモジユール取付け機構。 ２ 実用新案登録請求の範囲第１項に記載のパワ
ーモジユール取付装置において、パワーモジユー
ルと取付部材との間に安定した押圧力を付与する
板バネを押え金具と前記パワーモジユールとの間
に設けることを特徴とするパワーモジユール取付
機構。[Claims for Utility Model Registration] 1. A plurality of power modules mounted side by side on a mounting member, a presser metal fitting that presses the power module onto the mounting member, and a presser metal fitting that tightens the presser metal fitting to the mounting member. A power module mounting mechanism characterized by comprising a tensioning member. 2 Utility Model Registration Scope of Claims In the power module mounting device as set forth in claim 1, a plate spring that applies a stable pressing force between the power module and the mounting member is placed between the holding fitting and the power module. A power module mounting mechanism characterized by being provided in.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11733887U JPS6422051U (en) | 1987-07-30 | 1987-07-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11733887U JPS6422051U (en) | 1987-07-30 | 1987-07-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6422051U true JPS6422051U (en) | 1989-02-03 |
Family
ID=31360710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11733887U Pending JPS6422051U (en) | 1987-07-30 | 1987-07-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6422051U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009158631A (en) * | 2007-12-26 | 2009-07-16 | Keihin Corp | Power drive unit |
| JP2009158632A (en) * | 2007-12-26 | 2009-07-16 | Keihin Corp | Power drive unit |
| JP2012054262A (en) * | 2010-08-31 | 2012-03-15 | Mitsubishi Electric Corp | Semiconductor device |
| US8889511B2 (en) | 2003-05-20 | 2014-11-18 | Fairchild Semiconductor Corporation | Methods of manufacturing power semiconductor devices with trenched shielded split gate transistor |
| JP2015133429A (en) * | 2014-01-14 | 2015-07-23 | 富士通株式会社 | Fixing device and electronic device |
-
1987
- 1987-07-30 JP JP11733887U patent/JPS6422051U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8889511B2 (en) | 2003-05-20 | 2014-11-18 | Fairchild Semiconductor Corporation | Methods of manufacturing power semiconductor devices with trenched shielded split gate transistor |
| US8936985B2 (en) | 2003-05-20 | 2015-01-20 | Fairchild Semiconductor Corporation | Methods related to power semiconductor devices with thick bottom oxide layers |
| JP2009158631A (en) * | 2007-12-26 | 2009-07-16 | Keihin Corp | Power drive unit |
| JP2009158632A (en) * | 2007-12-26 | 2009-07-16 | Keihin Corp | Power drive unit |
| JP2012054262A (en) * | 2010-08-31 | 2012-03-15 | Mitsubishi Electric Corp | Semiconductor device |
| JP2015133429A (en) * | 2014-01-14 | 2015-07-23 | 富士通株式会社 | Fixing device and electronic device |
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