JPS6422040U - - Google Patents
Info
- Publication number
- JPS6422040U JPS6422040U JP11735087U JP11735087U JPS6422040U JP S6422040 U JPS6422040 U JP S6422040U JP 11735087 U JP11735087 U JP 11735087U JP 11735087 U JP11735087 U JP 11735087U JP S6422040 U JPS6422040 U JP S6422040U
- Authority
- JP
- Japan
- Prior art keywords
- package
- lid
- package body
- plastic molded
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
図面は、本考案のプラスチツクモールドＩＣパ
ツケージの一実施例を示す分解斜視図である。
１……パツケージ本体、２……リードフレーム
、３……ＩＣチツプ、４……蓋体、５，５′……
貫通孔、６……封止用樹脂。
The drawing is an exploded perspective view showing an embodiment of the plastic molded IC package of the present invention. 1...Package body, 2...Lead frame, 3...IC chip, 4...Lid, 5, 5'...
Through hole, 6...Sealing resin.
補正 昭６２．１０．２８
図面の簡単な説明を次のように補正する。
明細書の第７頁第１５行目の「図面」を「第１
図」と補正する。Amendment October 28, 1982 The brief description of the drawing is amended as follows. “Drawings” on page 7, line 15 of the specification
Correct it to ``Figure''.
Claims (1)
本のリードフレームが突設された、プラスチツク
成形体からなる箱形のパツケージ本体の前記内側
底面に、ＩＣチツプを実装するとともに、前記Ｉ
Ｃチツプの上を封止用樹脂で気密に覆い、かつ前
記パツケージ本体上端縁に蓋体を載置してなるプ
ラスチツクモールドＩＣパツケージにおいて、前
記パツケージ本体あるいは蓋体に２つの貫通孔が
穿設されており、前記封止用樹脂が、この貫通孔
のうち１つを孔からパツケージ本体と蓋体で形成
された中空内部の空気を抜きながら、もう１つの
孔を通して注入されたものであることを特徴とす
るプラスチツクモールドＩＣパツケージ。 An IC chip is mounted on the inner bottom surface of a box-shaped package body made of a plastic molded body with a conductor circuit formed on the inner bottom surface and a plurality of lead frames protruding from the side surfaces.
In a plastic molded IC package in which the top of a C chip is airtightly covered with a sealing resin and a lid is placed on the upper edge of the package body, two through holes are formed in the package body or the lid. and that the sealing resin was injected through one of the through holes while removing air from the hollow inside formed by the package body and the lid. Characteristic plastic molded IC package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11735087U JPS6422040U (en) | 1987-07-30 | 1987-07-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11735087U JPS6422040U (en) | 1987-07-30 | 1987-07-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6422040U true JPS6422040U (en) | 1989-02-03 |
Family
ID=31360733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11735087U Pending JPS6422040U (en) | 1987-07-30 | 1987-07-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6422040U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS552627U (en) * | 1978-06-20 | 1980-01-09 |
-
1987
- 1987-07-30 JP JP11735087U patent/JPS6422040U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS552627U (en) * | 1978-06-20 | 1980-01-09 |
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