JPS6420740U - - Google Patents
Info
- Publication number
- JPS6420740U JPS6420740U JP1987115961U JP11596187U JPS6420740U JP S6420740 U JPS6420740 U JP S6420740U JP 1987115961 U JP1987115961 U JP 1987115961U JP 11596187 U JP11596187 U JP 11596187U JP S6420740 U JPS6420740 U JP S6420740U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation case
- circuit board
- power semiconductor
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 238000005266 casting Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987115961U JPS6420740U (ro) | 1987-07-29 | 1987-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987115961U JPS6420740U (ro) | 1987-07-29 | 1987-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6420740U true JPS6420740U (ro) | 1989-02-01 |
Family
ID=31358082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987115961U Pending JPS6420740U (ro) | 1987-07-29 | 1987-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6420740U (ro) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02131350U (ro) * | 1989-04-05 | 1990-10-31 |
-
1987
- 1987-07-29 JP JP1987115961U patent/JPS6420740U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02131350U (ro) * | 1989-04-05 | 1990-10-31 |