JPS6419735U - - Google Patents

Info

Publication number
JPS6419735U
JPS6419735U JP11374187U JP11374187U JPS6419735U JP S6419735 U JPS6419735 U JP S6419735U JP 11374187 U JP11374187 U JP 11374187U JP 11374187 U JP11374187 U JP 11374187U JP S6419735 U JPS6419735 U JP S6419735U
Authority
JP
Japan
Prior art keywords
fascia
exterior material
exterior
elastic member
leaf spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11374187U
Other languages
Japanese (ja)
Other versions
JPH0421953Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11374187U priority Critical patent/JPH0421953Y2/ja
Publication of JPS6419735U publication Critical patent/JPS6419735U/ja
Application granted granted Critical
Publication of JPH0421953Y2 publication Critical patent/JPH0421953Y2/ja
Expired legal-status Critical Current

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  • Finishing Walls (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本考案に係る取付構造を示す側面概
略図、第２図は、弾性部材の斜視図、第３図は、
本考案による取付構造の側面概略図である。 １……鼻隠し材、１１……下面、２……外装材
、２１……先端、２１ａ……切起片、２２……底
部、３……押え材、３３……折返し辺、３４……
係止辺、４……弾性部材、４２……板バネ部、４
３……係止爪。 FIG. 1 is a schematic side view showing the mounting structure according to the present invention, FIG. 2 is a perspective view of the elastic member, and FIG.
FIG. 3 is a schematic side view of the mounting structure according to the present invention. DESCRIPTION OF SYMBOLS 1... Fascia material, 11... Lower surface, 2... Exterior material, 21... Tip, 21a... Cut-and-raised piece, 22... Bottom, 3... Holding material, 33... Folded side, 34...
Locking side, 4...Elastic member, 42...Plate spring part, 4
3...Latching claw.

Claims (1)

【実用新案登録請求の範囲】 (1) 鼻隠し材に取着した押え材の空間内に、外
装材の上端に形成した切起片を挿入することによ
り、外装材を鼻隠し材に取付けるものであつて、 前記鼻隠し材の下面と外装材間に弾性部材を介
在させた鼻隠し材の外装材取付構造。 (2) 前記弾性部材は上方に湾曲した板バネ部か
ら成り、該板バネ部の頂部には係止爪が立設され
ていることを特徴とする実用新案登録請求の範囲
第１項記載の鼻隠し材の外装材取付構造。[Scope of Claim for Utility Model Registration] (1) The exterior material is attached to the fascia material by inserting a cut and raised piece formed at the upper end of the exterior material into the space of the presser material attached to the fascia material. An exterior material attachment structure for a fascia material, wherein an elastic member is interposed between the lower surface of the fascia material and the exterior material. (2) The utility model according to claim 1, wherein the elastic member comprises an upwardly curved leaf spring part, and a locking pawl is provided at the top of the leaf spring part. Fascia material exterior material mounting structure.
JP11374187U 1987-07-24 1987-07-24 Expired JPH0421953Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11374187U JPH0421953Y2 (en) 1987-07-24 1987-07-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11374187U JPH0421953Y2 (en) 1987-07-24 1987-07-24

Publications (2)

Publication Number Publication Date
JPS6419735U true JPS6419735U (en) 1989-01-31
JPH0421953Y2 JPH0421953Y2 (en) 1992-05-19

Family

ID=31353848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11374187U Expired JPH0421953Y2 (en) 1987-07-24 1987-07-24

Country Status (1)

Country Link
JP (1) JPH0421953Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7387914B2 (en) 1995-07-06 2008-06-17 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7387914B2 (en) 1995-07-06 2008-06-17 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US7781896B2 (en) 1995-07-06 2010-08-24 Hitachi Chemical Co., Ltd. Semiconductor device and process for fabrication thereof

Also Published As

Publication number Publication date
JPH0421953Y2 (en) 1992-05-19

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