JPS6419127U - - Google Patents
Info
- Publication number
- JPS6419127U JPS6419127U JP11368587U JP11368587U JPS6419127U JP S6419127 U JPS6419127 U JP S6419127U JP 11368587 U JP11368587 U JP 11368587U JP 11368587 U JP11368587 U JP 11368587U JP S6419127 U JPS6419127 U JP S6419127U
- Authority
- JP
- Japan
- Prior art keywords
- cream
- solder
- dispensing device
- dispenser
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006071 cream Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の系統説明図、第２図は動作順
序を表した本考案のフローチヤート図、、第３図
は構成物の関連を表した本考案のブロツク図であ
る。
１……デイスペンサー、２……センサー、３…
…精密レギユレータ、４……制御部、５……クリ
ーム、ハンダ、６……パイプ、７……吐出部先端
。
FIG. 1 is a system explanatory diagram of the present invention, FIG. 2 is a flowchart of the present invention showing the order of operation, and FIG. 3 is a block diagram of the present invention showing the relationship of components. 1...dispenser, 2...sensor, 3...
... Precision regulator, 4 ... Control section, 5 ... Cream, solder, 6 ... Pipe, 7 ... Discharge part tip.
Claims (1)
ーと前記デイスペンサーと連結し、時間と加圧力
をコントロールでき、前記デイスペンサー内部に
圧力を加える精密レギユレータからなる微少クリ
ーム、ハンダ吐出装置において、前記デイスペン
サーの吐出部先端下部にクリーム、ハンダの吐出
量を感知するセンサーを配設したことを特徴とす
る微少クリーム、ハンダ吐出装置。 A minute cream/solder dispensing device that is connected to a dispenser containing cream solder and a precision regulator that can control time and pressure and applies pressure inside the dispenser. A micro cream and solder dispensing device characterized by having a sensor arranged at the lower part of the tip to detect the amount of cream and solder dispensed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11368587U JPS6419127U (en) | 1987-07-24 | 1987-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11368587U JPS6419127U (en) | 1987-07-24 | 1987-07-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6419127U true JPS6419127U (en) | 1989-01-31 |
Family
ID=31353741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11368587U Pending JPS6419127U (en) | 1987-07-24 | 1987-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6419127U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015230973A (en) * | 2014-06-05 | 2015-12-21 | 株式会社鈴野製作所 | Solder coating device |
-
1987
- 1987-07-24 JP JP11368587U patent/JPS6419127U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015230973A (en) * | 2014-06-05 | 2015-12-21 | 株式会社鈴野製作所 | Solder coating device |