JPS6418773U - - Google Patents
Info
- Publication number
- JPS6418773U JPS6418773U JP11336687U JP11336687U JPS6418773U JP S6418773 U JPS6418773 U JP S6418773U JP 11336687 U JP11336687 U JP 11336687U JP 11336687 U JP11336687 U JP 11336687U JP S6418773 U JPS6418773 U JP S6418773U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- multilayer printed
- pad
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11336687U JPS6418773U (de) | 1987-07-23 | 1987-07-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11336687U JPS6418773U (de) | 1987-07-23 | 1987-07-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6418773U true JPS6418773U (de) | 1989-01-30 |
Family
ID=31353137
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11336687U Pending JPS6418773U (de) | 1987-07-23 | 1987-07-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6418773U (de) |
-
1987
- 1987-07-23 JP JP11336687U patent/JPS6418773U/ja active Pending
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