JPS6418740U - - Google Patents
Info
- Publication number
- JPS6418740U JPS6418740U JP11290287U JP11290287U JPS6418740U JP S6418740 U JPS6418740 U JP S6418740U JP 11290287 U JP11290287 U JP 11290287U JP 11290287 U JP11290287 U JP 11290287U JP S6418740 U JPS6418740 U JP S6418740U
- Authority
- JP
- Japan
- Prior art keywords
- collector
- tip
- main body
- closing
- scooping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000078 claw Anatomy 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 239000008188 pellet Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11290287U JPS6418740U (enExample) | 1987-07-22 | 1987-07-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11290287U JPS6418740U (enExample) | 1987-07-22 | 1987-07-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6418740U true JPS6418740U (enExample) | 1989-01-30 |
Family
ID=31352262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11290287U Pending JPS6418740U (enExample) | 1987-07-22 | 1987-07-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6418740U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100381976B1 (ko) * | 2001-01-10 | 2003-05-09 | 세미시스 주식회사 | 반도체 마킹장비의 스트립 이송장치 |
-
1987
- 1987-07-22 JP JP11290287U patent/JPS6418740U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100381976B1 (ko) * | 2001-01-10 | 2003-05-09 | 세미시스 주식회사 | 반도체 마킹장비의 스트립 이송장치 |