JPS6416865A - Nucleating agent for forming polyamide resin - Google Patents

Nucleating agent for forming polyamide resin

Info

Publication number
JPS6416865A
JPS6416865A JP17198287A JP17198287A JPS6416865A JP S6416865 A JPS6416865 A JP S6416865A JP 17198287 A JP17198287 A JP 17198287A JP 17198287 A JP17198287 A JP 17198287A JP S6416865 A JPS6416865 A JP S6416865A
Authority
JP
Japan
Prior art keywords
polyamide resin
nucleating agent
polyamide
forming polyamide
inorganic carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17198287A
Other languages
Japanese (ja)
Other versions
JP2516021B2 (en
Inventor
Heihachiro Tada
Kunio Tamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daicel Corp
Original Assignee
Daicel Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Chemical Industries Ltd filed Critical Daicel Chemical Industries Ltd
Priority to JP62171982A priority Critical patent/JP2516021B2/en
Publication of JPS6416865A publication Critical patent/JPS6416865A/en
Application granted granted Critical
Publication of JP2516021B2 publication Critical patent/JP2516021B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PURPOSE:To produce a crystal-nucleating agent for polyamide resin which has excellent action to promote crystallization, and can increase the molding cycle without any adverse effect on mechanical properties on molding, by adhering a specific polyamide polymer to the inorganic carrier. CONSTITUTION:An inorganic carrier of 0.001-100mu, preferably 0.1-10mu particle sizes such as silica or glass fiber is coated with 5-1,000pts., preferably 10-100pts. of a polyamide melting at a temperature more than 10 deg.C higher than the polyamide resin to be molded.
JP62171982A 1987-07-09 1987-07-09 Nucleating agent for polyamide resin molding Expired - Lifetime JP2516021B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62171982A JP2516021B2 (en) 1987-07-09 1987-07-09 Nucleating agent for polyamide resin molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62171982A JP2516021B2 (en) 1987-07-09 1987-07-09 Nucleating agent for polyamide resin molding

Publications (2)

Publication Number Publication Date
JPS6416865A true JPS6416865A (en) 1989-01-20
JP2516021B2 JP2516021B2 (en) 1996-07-10

Family

ID=15933340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62171982A Expired - Lifetime JP2516021B2 (en) 1987-07-09 1987-07-09 Nucleating agent for polyamide resin molding

Country Status (1)

Country Link
JP (1) JP2516021B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004082924A1 (en) * 2003-03-17 2004-09-30 Ube Industries, Ltd. Kit of materials for laser welding and method for laser welding

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS507843A (en) * 1973-05-23 1975-01-27
JPS53106752A (en) * 1977-03-02 1978-09-18 Toho Rayon Co Ltd Reinforcing material and its composition for molding product
JPS58171802A (en) * 1982-04-02 1983-10-08 Sumitomo Bakelite Co Ltd Ferromagnetic resin compound
JPS6088070A (en) * 1983-10-20 1985-05-17 Karupu Kogyo Kk Granular resin composition
JPS6394502A (en) * 1986-10-09 1988-04-25 新技術開発事業団 Conducting filler and manufacture thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS507843A (en) * 1973-05-23 1975-01-27
JPS53106752A (en) * 1977-03-02 1978-09-18 Toho Rayon Co Ltd Reinforcing material and its composition for molding product
JPS58171802A (en) * 1982-04-02 1983-10-08 Sumitomo Bakelite Co Ltd Ferromagnetic resin compound
JPS6088070A (en) * 1983-10-20 1985-05-17 Karupu Kogyo Kk Granular resin composition
JPS6394502A (en) * 1986-10-09 1988-04-25 新技術開発事業団 Conducting filler and manufacture thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004082924A1 (en) * 2003-03-17 2004-09-30 Ube Industries, Ltd. Kit of materials for laser welding and method for laser welding

Also Published As

Publication number Publication date
JP2516021B2 (en) 1996-07-10

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