JPS6416635U - - Google Patents
Info
- Publication number
- JPS6416635U JPS6416635U JP11147087U JP11147087U JPS6416635U JP S6416635 U JPS6416635 U JP S6416635U JP 11147087 U JP11147087 U JP 11147087U JP 11147087 U JP11147087 U JP 11147087U JP S6416635 U JPS6416635 U JP S6416635U
- Authority
- JP
- Japan
- Prior art keywords
- pin
- lead frame
- movable
- lower mold
- relative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11147087U JPH0543475Y2 (de) | 1987-07-20 | 1987-07-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11147087U JPH0543475Y2 (de) | 1987-07-20 | 1987-07-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6416635U true JPS6416635U (de) | 1989-01-27 |
JPH0543475Y2 JPH0543475Y2 (de) | 1993-11-02 |
Family
ID=31349543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11147087U Expired - Lifetime JPH0543475Y2 (de) | 1987-07-20 | 1987-07-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0543475Y2 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108604578B (zh) | 2016-02-09 | 2021-07-16 | 三菱电机株式会社 | 电力用半导体装置及其制造方法 |
-
1987
- 1987-07-20 JP JP11147087U patent/JPH0543475Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0543475Y2 (de) | 1993-11-02 |
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