JPS64164A - Electroconductive composition - Google Patents

Electroconductive composition

Info

Publication number
JPS64164A
JPS64164A JP15492087A JP15492087A JPS64164A JP S64164 A JPS64164 A JP S64164A JP 15492087 A JP15492087 A JP 15492087A JP 15492087 A JP15492087 A JP 15492087A JP S64164 A JPS64164 A JP S64164A
Authority
JP
Japan
Prior art keywords
polymer
ethylene
examples
melt adhesive
hot melt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15492087A
Other languages
Japanese (ja)
Other versions
JPH01164A (en
Inventor
Kiyoshi Furukawa
Hiroshi Kobuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Cable Industries Ltd
Original Assignee
Mitsubishi Cable Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Cable Industries Ltd filed Critical Mitsubishi Cable Industries Ltd
Priority to JP15492087A priority Critical patent/JPS64164A/en
Publication of JPH01164A publication Critical patent/JPH01164A/en
Publication of JPS64164A publication Critical patent/JPS64164A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To obtain an electroconductive composition having hot met bondability and excelling in moldability into a thin film, by mixing a hot melt adhesive polymer with a releasable polymer of good compatibility therewith and an electroconductivity-imparting agent.
CONSTITUTION: An electroconductive composition is obtained by mixing a hot melt adhesive polymer with 5W70pts.wt. releasable polymer of good compatibility therewith and 20W255pts.wt. electroconductivity-imparting agent. Examples of said hot melt adhesive polymers which can be particularly desirably used include an ethylene/vinyl acetate copolymer, a multicomponent polymer obtained by modifying it, an ethylene/ethyl acrylate copolymer, and an ionomer obtained by ionically crosslinking it. Examples of said releasable polymers which can be particularly desirably used include an ethylene/propylene copolyerm, a tetrafluroethylene/propylene copolymer and polypropylene. Examples of said electro-conductivity-imparting agents include acetylene black, graphite and carbon fibers.
COPYRIGHT: (C)1989,JPO&Japio
JP15492087A 1987-06-22 1987-06-22 Electroconductive composition Pending JPS64164A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15492087A JPS64164A (en) 1987-06-22 1987-06-22 Electroconductive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15492087A JPS64164A (en) 1987-06-22 1987-06-22 Electroconductive composition

Publications (2)

Publication Number Publication Date
JPH01164A JPH01164A (en) 1989-01-05
JPS64164A true JPS64164A (en) 1989-01-05

Family

ID=15594842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15492087A Pending JPS64164A (en) 1987-06-22 1987-06-22 Electroconductive composition

Country Status (1)

Country Link
JP (1) JPS64164A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4953423A (en) * 1988-06-09 1990-09-04 Nissan Motor Co., Ltd. Steering wheel with shock absorber
WO2002064695A1 (en) * 2001-02-15 2002-08-22 Portola Packaging Limited Sealing composition
DE102007007617A1 (en) * 2007-02-13 2008-08-14 Tesa Ag Intrinsically heatable hot melt tacky fabrics
JP2012025929A (en) * 2010-06-25 2012-02-09 Toray Ind Inc Hot melt adhesive composition and film with hot melt adhesive
JP2015059172A (en) * 2013-09-18 2015-03-30 株式会社フジクラ Semiconductive resin composition and power cable
WO2015064652A1 (en) * 2013-10-30 2015-05-07 日本ポリエチレン株式会社 Conductive polyethylene resin composition, molded product using same, and laminate body
WO2021106576A1 (en) * 2019-11-29 2021-06-03 東洋紡株式会社 Polyolefin-based adhesive composition and laminate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5364502B2 (en) * 2009-08-28 2013-12-11 昭和電線ケーブルシステム株式会社 Semiconductive resin composition for electric wires and cables and electric wires and cables

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4953423A (en) * 1988-06-09 1990-09-04 Nissan Motor Co., Ltd. Steering wheel with shock absorber
WO2002064695A1 (en) * 2001-02-15 2002-08-22 Portola Packaging Limited Sealing composition
DE102007007617A1 (en) * 2007-02-13 2008-08-14 Tesa Ag Intrinsically heatable hot melt tacky fabrics
JP2012025929A (en) * 2010-06-25 2012-02-09 Toray Ind Inc Hot melt adhesive composition and film with hot melt adhesive
JP2015059172A (en) * 2013-09-18 2015-03-30 株式会社フジクラ Semiconductive resin composition and power cable
WO2015064652A1 (en) * 2013-10-30 2015-05-07 日本ポリエチレン株式会社 Conductive polyethylene resin composition, molded product using same, and laminate body
CN105705571A (en) * 2013-10-30 2016-06-22 日本聚乙烯株式会社 Conductive polyethylene resin composition, molded product using same, and laminate body
US20160284435A1 (en) * 2013-10-30 2016-09-29 Japan Polyethylene Corporation Electroconductive polyethylene resin composition, and molded article and laminate using the same
US9922748B2 (en) 2013-10-30 2018-03-20 Japan Polyethylene Corporation Electroconductive polyethylene resin composition, and molded article and laminate using the same
WO2021106576A1 (en) * 2019-11-29 2021-06-03 東洋紡株式会社 Polyolefin-based adhesive composition and laminate

Similar Documents

Publication Publication Date Title
GB1041065A (en) Polymeric compositions
EP0154453A3 (en) Thermoplastic elastomer composition
GB967334A (en)
GB1514959A (en) Hot melt adhesive compositions
CA2010112A1 (en) Siliconized emulsion based pressure-sensitive adhesives
ES479250A1 (en) Paper surgical tape.
JPS64164A (en) Electroconductive composition
JPS57190036A (en) Vinylidene fluoride resin composition
JPS57182373A (en) Self-adhesive for surface-protective film
JPS551379A (en) Conjugate fiber
DE50213561D1 (en) High frequency weldable and cold flexible polymer blend and their use
JPS57195135A (en) Heat-sealable resin composition
JPS5531892A (en) Vulcanizable composition of butadiene*acrylonitrile polymer with ethylene copolymer
JPS5742751A (en) Composite resin composition
JPS5322540A (en) Adhesive tapes having tear properties in transverse direction
JPS53136053A (en) Rubber composition
JPS54138796A (en) Twist-packing material
JPS56167776A (en) Adhesive resin composition
JPS5516029A (en) Hot-melt type adhesive
JPS53130743A (en) Improved composition of reinforced polyolefin
JPS5491539A (en) Adhesive
JPS531246A (en) Thermoplastic resin compositions
JPS5536261A (en) Production of impact-resistant polyamide
JPS57198764A (en) Resin composition for coating compound
JPS5653607A (en) Skin removing sheet