JPS6416311U - - Google Patents
Info
- Publication number
- JPS6416311U JPS6416311U JP11005787U JP11005787U JPS6416311U JP S6416311 U JPS6416311 U JP S6416311U JP 11005787 U JP11005787 U JP 11005787U JP 11005787 U JP11005787 U JP 11005787U JP S6416311 U JPS6416311 U JP S6416311U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- wafer suction
- suction chuck
- slicing machine
- blade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000012431 wafers Nutrition 0.000 claims 4
- 238000007664 blowing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 2
Landscapes
- Feeding Of Workpieces (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
第1図乃至第3図は本考案の実施例の要部を示
す図面であり、第1図はブレードの側面からみた
ウエハー吸着チヤツクと吹付ノズルとを示す側面
図、第2図は第1図のX―X線に沿つた拡大正面
図であり一部を断面で示し、かつ第1図及び第3
図に図示しない空圧ラインを示す空圧回路図が付
加されており、第3図は第1図のX―X線方向で
みたスライシングマシンの要部を示す正面図aと
インゴツトの動作b及びウエハー吸着チヤツクの
動作cをそれぞれ示すダイヤグラムとを示す。第
4図は従来のスライシングマシンの吸着チヤツク
を取除いた第1図と同様な側面図、第5図は第4
図のX′―X′線に沿つた部分拡大断面図である
。
1……ブレード、6……ウエハー吸着チヤツク
、7……吹付ノズル、8……ウエハー。
1 to 3 are drawings showing essential parts of an embodiment of the present invention, in which FIG. 1 is a side view showing the wafer suction chuck and spray nozzle seen from the side of the blade, and FIG. 2 is the same as that shown in FIG. It is an enlarged front view along the X-X line of
A pneumatic circuit diagram showing pneumatic lines not shown is added to the figure, and Fig. 3 is a front view a showing the main parts of the slicing machine as seen in the X-X direction of Fig. 1, and a diagram showing the ingot operation b and A diagram showing the operation c of the wafer suction chuck is shown. Figure 4 is a side view similar to Figure 1 with the suction chuck of a conventional slicing machine removed, and Figure 5 is a side view of the conventional slicing machine with the suction chuck removed.
FIG. 2 is a partially enlarged sectional view taken along the line X'-X' in the figure. 1...blade, 6...wafer suction chuck, 7...spray nozzle, 8...wafer.
Claims (1)
めのウエハー吸着チヤツクに支持されかつウエハ
ー吸着部と干渉しない位置でブレードとウエハー
との間の隙間に向けて圧縮空気を吹付ける吹付ノ
ズルを設けたことを特徴とするスライシングマシ
ン。 It is characterized by being supported by a wafer suction chuck for recovering sliced wafers and provided with a blowing nozzle that blows compressed air toward the gap between the blade and the wafer at a position that does not interfere with the wafer suction part. slicing machine.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11005787U JPS6416311U (en) | 1987-07-20 | 1987-07-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11005787U JPS6416311U (en) | 1987-07-20 | 1987-07-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6416311U true JPS6416311U (en) | 1989-01-26 |
Family
ID=31346870
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11005787U Pending JPS6416311U (en) | 1987-07-20 | 1987-07-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6416311U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06166021A (en) * | 1992-11-27 | 1994-06-14 | Shin Etsu Handotai Co Ltd | Internal saw slicing machine |
-
1987
- 1987-07-20 JP JP11005787U patent/JPS6416311U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06166021A (en) * | 1992-11-27 | 1994-06-14 | Shin Etsu Handotai Co Ltd | Internal saw slicing machine |
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