JPS641595A - Sealing of semiconductor device for ic card - Google Patents

Sealing of semiconductor device for ic card

Info

Publication number
JPS641595A
JPS641595A JP62157388A JP15738887A JPS641595A JP S641595 A JPS641595 A JP S641595A JP 62157388 A JP62157388 A JP 62157388A JP 15738887 A JP15738887 A JP 15738887A JP S641595 A JPS641595 A JP S641595A
Authority
JP
Japan
Prior art keywords
semiconductor
resin
semiconductor device
mold
setting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62157388A
Other languages
Japanese (ja)
Other versions
JPH011595A (en
Inventor
Masahiro Fuse
Hajime Kisanuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP62157388A priority Critical patent/JPS641595A/en
Publication of JPH011595A publication Critical patent/JPH011595A/en
Publication of JPS641595A publication Critical patent/JPS641595A/en
Pending legal-status Critical Current

Links

Landscapes

  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To seal a semiconductor device and improve protecting performance from the environmental effect by setting the resin put into the mold contained a semiconductor.
CONSTITUTION: The semiconductor device 13 on the tape carrier 15 is placed in the mold 17 and fluid resin is put into the mold to fully cover the semiconductor 13 with enough thickness of the resin 12. After setting of the resin 12, the semiconductor with tape carrier is taken out. The semiconductor module 10 containing the semiconductor device 13 covered with uniform thickness resin by the method is improved in moisture-proof and mechanical strength of the connection part between the semiconductor and metal lead frame.
COPYRIGHT: (C)1989,JPO
JP62157388A 1987-06-24 1987-06-24 Sealing of semiconductor device for ic card Pending JPS641595A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62157388A JPS641595A (en) 1987-06-24 1987-06-24 Sealing of semiconductor device for ic card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62157388A JPS641595A (en) 1987-06-24 1987-06-24 Sealing of semiconductor device for ic card

Publications (2)

Publication Number Publication Date
JPH011595A JPH011595A (en) 1989-01-05
JPS641595A true JPS641595A (en) 1989-01-05

Family

ID=15648549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62157388A Pending JPS641595A (en) 1987-06-24 1987-06-24 Sealing of semiconductor device for ic card

Country Status (1)

Country Link
JP (1) JPS641595A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH038353A (en) * 1989-06-06 1991-01-16 Toowa Kk Film carrier and molding method using same
WO2015008059A1 (en) * 2013-07-15 2015-01-22 Novalia Ltd Circuit sheet arrangement

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH038353A (en) * 1989-06-06 1991-01-16 Toowa Kk Film carrier and molding method using same
WO2015008059A1 (en) * 2013-07-15 2015-01-22 Novalia Ltd Circuit sheet arrangement
CN105474389A (en) * 2013-07-15 2016-04-06 诺瓦利亚公司 Circuit sheet arrangement

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