JPS641561A - Led head - Google Patents

Led head

Info

Publication number
JPS641561A
JPS641561A JP19171487A JP19171487A JPS641561A JP S641561 A JPS641561 A JP S641561A JP 19171487 A JP19171487 A JP 19171487A JP 19171487 A JP19171487 A JP 19171487A JP S641561 A JPS641561 A JP S641561A
Authority
JP
Japan
Prior art keywords
chips
circuit board
printed circuit
led array
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19171487A
Other languages
Japanese (ja)
Other versions
JPH011561A (en
Inventor
Masaru Kawazumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62-191714A priority Critical patent/JPH011561A/en
Priority claimed from JP62-191714A external-priority patent/JPH011561A/en
Publication of JPS641561A publication Critical patent/JPS641561A/en
Publication of JPH011561A publication Critical patent/JPH011561A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)

Abstract

PURPOSE:To reduce the number of connection processes and to enhance reliability, by directly bonding a carrier film having LED array chips preliminarily connected thereto or the bump parts of the LED chips to the connection patterns on a printed circuit board. CONSTITUTION:LSI chips 2 and LED array chips 3 are mounted and arranged on a printed circuit board 1. At this time, the LSI chips 2 and the LED array chips 3 are directly bonded to the connection patterns 1a on the printed circuit board 1 under pressure in reverse relationship through the bump parts 2a, 3a thereof to be connected thereto. In this case, the light emitting surfaces 3b of the LED array chips 3 are present on an under side. By this method, the connection of an electronic circuit is performed and a groove 5 is provided to the printed circuit board 1 directly under the light emitting surfaces 3b of the LED array chips 3 and light is condensed by the condensing lens 4 mounted to the back surface of the printed circuit board 1 through the groove 5. Since the chips are directly connected to the printed circuit board through the bump parts 3a, the number of connection processes can be reduced and not only reliability but also positional accuracy can be enhanced.
JP62-191714A 1987-01-23 1987-07-31 LED head Pending JPH011561A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62-191714A JPH011561A (en) 1987-01-23 1987-07-31 LED head

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62-14887 1987-01-23
JP1488787 1987-01-23
JP62-191714A JPH011561A (en) 1987-01-23 1987-07-31 LED head

Publications (2)

Publication Number Publication Date
JPS641561A true JPS641561A (en) 1989-01-05
JPH011561A JPH011561A (en) 1989-01-05

Family

ID=

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