JPS641561A - Led head - Google Patents
Led headInfo
- Publication number
- JPS641561A JPS641561A JP19171487A JP19171487A JPS641561A JP S641561 A JPS641561 A JP S641561A JP 19171487 A JP19171487 A JP 19171487A JP 19171487 A JP19171487 A JP 19171487A JP S641561 A JPS641561 A JP S641561A
- Authority
- JP
- Japan
- Prior art keywords
- chips
- circuit board
- printed circuit
- led array
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Abstract
PURPOSE:To reduce the number of connection processes and to enhance reliability, by directly bonding a carrier film having LED array chips preliminarily connected thereto or the bump parts of the LED chips to the connection patterns on a printed circuit board. CONSTITUTION:LSI chips 2 and LED array chips 3 are mounted and arranged on a printed circuit board 1. At this time, the LSI chips 2 and the LED array chips 3 are directly bonded to the connection patterns 1a on the printed circuit board 1 under pressure in reverse relationship through the bump parts 2a, 3a thereof to be connected thereto. In this case, the light emitting surfaces 3b of the LED array chips 3 are present on an under side. By this method, the connection of an electronic circuit is performed and a groove 5 is provided to the printed circuit board 1 directly under the light emitting surfaces 3b of the LED array chips 3 and light is condensed by the condensing lens 4 mounted to the back surface of the printed circuit board 1 through the groove 5. Since the chips are directly connected to the printed circuit board through the bump parts 3a, the number of connection processes can be reduced and not only reliability but also positional accuracy can be enhanced.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62-191714A JPH011561A (en) | 1987-01-23 | 1987-07-31 | LED head |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62-14887 | 1987-01-23 | ||
JP1488787 | 1987-01-23 | ||
JP62-191714A JPH011561A (en) | 1987-01-23 | 1987-07-31 | LED head |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS641561A true JPS641561A (en) | 1989-01-05 |
JPH011561A JPH011561A (en) | 1989-01-05 |
Family
ID=
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA2171458A1 (en) | Multi-chip module | |
EP0248314A3 (en) | Soldering of electronic components | |
KR970001928B1 (en) | Process for flip-chip connection of a semiconductor chip | |
DE3767067D1 (en) | CONNECTOR WITH CONTACT MODULES FOR A SUBSTRATE, FOR EXAMPLE FOR AN IC CHIP CARRIER. | |
WO2003017324A3 (en) | Structure and method for fabrication of a leadless chip carrier with embedded inductor | |
MY116972A (en) | High performance, low cost multi-chip module package | |
MY125460A (en) | Semiconductor device | |
TW336340B (en) | Flexible thin film ball grid array containing solder mask | |
JP2007511914A (en) | Economy, miniaturized construction and connection technology for light emitting diodes and other photoelectric modules | |
KR890005830A (en) | Semiconductor device and manufacturing method thereof | |
DE3881929D1 (en) | CONNECTION METHOD FOR INTEGRATED CIRCUIT CHIPS. | |
GB2165092B (en) | Solid-state imager chip mounting | |
JPS641561A (en) | Led head | |
ES2010412A6 (en) | Thermal expansion mismatch forgivable printed wiring board for ceramic leadless chip carrier. | |
JPH0730055A (en) | Multichip module-mounted printed wiring board | |
ES295772Y (en) | A FLAT CAPSULE FOR INTEGRATED CIRCUIT MEMORY PADS, SPECIAL APPLICATION TO AVIATION CIRCUITS | |
JPS6489356A (en) | Hybrid integrated circuit | |
JPS6450551A (en) | Ic package structure | |
TW330339B (en) | A semiconductor assembly | |
GB2244176B (en) | Method and apparatus for forming a conductive pattern on an integrated circuit | |
JPH0313758U (en) | ||
JPS5778146A (en) | Integrated circuit device | |
CA2355615A1 (en) | Multi-chip module | |
JPS6457760A (en) | Optical semiconductor device | |
JPH01166566U (en) |