JPS641560B2 - - Google Patents
Info
- Publication number
- JPS641560B2 JPS641560B2 JP19155483A JP19155483A JPS641560B2 JP S641560 B2 JPS641560 B2 JP S641560B2 JP 19155483 A JP19155483 A JP 19155483A JP 19155483 A JP19155483 A JP 19155483A JP S641560 B2 JPS641560 B2 JP S641560B2
- Authority
- JP
- Japan
- Prior art keywords
- fluororesin
- mold
- coating
- plating film
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 73
- 239000002245 particle Substances 0.000 claims description 48
- 229920005989 resin Polymers 0.000 claims description 36
- 239000011347 resin Substances 0.000 claims description 36
- 238000000576 coating method Methods 0.000 claims description 33
- 239000011248 coating agent Substances 0.000 claims description 32
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 239000011159 matrix material Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 13
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 11
- 239000011247 coating layer Substances 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- PEVRKKOYEFPFMN-UHFFFAOYSA-N 1,1,2,3,3,3-hexafluoroprop-1-ene;1,1,2,2-tetrafluoroethene Chemical group FC(F)=C(F)F.FC(F)=C(F)C(F)(F)F PEVRKKOYEFPFMN-UHFFFAOYSA-N 0.000 claims description 2
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 claims description 2
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 2
- 229920006026 co-polymeric resin Polymers 0.000 claims description 2
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 claims description 2
- AHFMSNDOYCFEPH-UHFFFAOYSA-N 1,2-difluoroethane Chemical compound FCCF AHFMSNDOYCFEPH-UHFFFAOYSA-N 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000000047 product Substances 0.000 description 18
- 239000006082 mold release agent Substances 0.000 description 9
- 238000000465 moulding Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229920003023 plastic Polymers 0.000 description 7
- 239000004033 plastic Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 239000012190 activator Substances 0.000 description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 5
- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- 229910000521 B alloy Inorganic materials 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical group FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229920000592 inorganic polymer Polymers 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- XIKYYQJBTPYKSG-UHFFFAOYSA-N nickel Chemical compound [Ni].[Ni] XIKYYQJBTPYKSG-UHFFFAOYSA-N 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/60—Releasing, lubricating or separating agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
本発明はプラスチツク成形品等を成形するため
に用いる金型などに形成される剥離性被膜の製造
方法に関し、特に型離れ性の優れた金型などを形
成するのに好適な剥離性被膜の製造方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing a releasable coating formed on a mold used for molding plastic molded products, etc., and particularly for forming a mold etc. with excellent mold release properties. The present invention relates to a method for producing a suitable peelable coating.
従来、プラスチツク成形品等の金型は、耐摩耗
性、剥離性などを向上させる目的から、その表面
(成形品が成形されることになる成形品形成空間
に面する表面、以下、“キヤビテイ面”と称す
る。)に硬質クロムめつき被膜や無電解ニツケル
めつき被膜を形成することが行なわれている。し
かし、これら金型を用いて実際にプラスチツク成
形品等を成形する場合、離型時に成形品が金型キ
ヤビテイ面に粘着し、離型し難くなる場合があ
る。例えば、エチレン―酢酸ビニル共重合樹脂成
形品を得るため硬質クロムめつき被膜をキヤビテ
イ面に施した金型で成形する場合、しばしば樹脂
が粘着し、きれいに型離れできない場合が生じ
る。このため、成形毎に離型剤をていねいにかつ
十分塗布する防護策が講じられているが、このよ
うに離型剤を成型毎にていねいに塗布する作業は
非常に面倒である上、樹脂が金型キヤビテイ面に
粘付着した場合は、成形後いちいち付着樹脂を取
り去り、清掃しなければならず、作業性に多大の
支障をきたしていた。また、金型に樹脂が粘付着
することにより、金型の消耗が早まる等の問題を
有していた。 Conventionally, molds for plastic molded products, etc. have had their surfaces (the surface facing the molded product forming space where the molded product will be molded, hereinafter referred to as the "cavity surface") for the purpose of improving wear resistance, peelability, etc. hard chromium plating film or electroless nickel plating film is being formed. However, when a plastic molded product or the like is actually molded using these molds, the molded product may adhere to the mold cavity surface during mold release, making it difficult to release the mold. For example, when molding an ethylene-vinyl acetate copolymer resin molded product using a mold with a hard chrome plating coating applied to the cavity surface, the resin often sticks and the mold cannot be removed cleanly. For this reason, protective measures have been taken to carefully and thoroughly apply mold release agent after each molding process, but this process of carefully applying mold release agent after each molding process is extremely troublesome, and the resin may If adhesive adheres to the mold cavity surface, the adhered resin must be removed and cleaned after each molding, which greatly impedes workability. In addition, the resin adheres to the mold, causing problems such as premature wear of the mold.
本発明は上記事情を改善するためになされたも
ので、金型のキヤビテイ面などの剥離性被膜を形
成すべき物体の表面に4フツ化エチレン樹脂等の
フツ素樹脂粒子を共析するめつき被膜を形成する
と共に、めつき後めつき被膜表面にフツ素樹脂粒
子を新たに供給し、次いで表面に露頭するフツ素
樹脂粒子及び表面に新たに供給したフツ素樹脂を
軟化もしくは溶融してめつき被膜表面の一部もし
くは全部をフツ素樹脂で被覆することにより、密
着の優れたフツ素樹脂被膜が形成されて、非常に
優れた剥離性乃至型離れ性を有し、例えば金型に
適用した場合には、離型剤を用いずとも、或いは
離型剤を用いる場合でも簡単な塗布で、プラスチ
ツク等の成形品を確実に離型することができ、作
業性の改善を計ることができると共に、金型の消
耗が少なく、その耐久性が非常に高い金型を形成
することができる剥離性被膜の製造方法を提供す
るものである。 The present invention has been made to improve the above-mentioned situation, and is a plating coating in which particles of a fluororesin such as tetrafluoroethylene resin are eutectoid on the surface of an object on which a peelable coating is to be formed, such as the cavity surface of a mold. At the same time, after plating, fluororesin particles are newly supplied to the surface of the plating film, and then the fluororesin particles exposed on the surface and the fluororesin newly supplied to the surface are softened or melted and plated. By coating part or all of the surface of the coating with fluororesin, a fluororesin coating with excellent adhesion is formed and has excellent peeling and mold release properties, making it suitable for use in molds, for example. In some cases, molded products such as plastics can be reliably released from the mold without using a mold release agent, or even if a mold release agent is used, by simple application, it is possible to improve workability and improve workability. The present invention provides a method for producing a releasable coating, which allows the formation of a mold with very high durability and less wear and tear on the mold.
以下、本発明につき金型に剥離性被膜を形成す
る場合を例にして図面を参照しつつ詳しく説明す
る。 Hereinafter, the present invention will be described in detail with reference to the drawings, taking as an example the case where a releasable coating is formed on a mold.
本発明が適用される金型は、酢酸ビニル樹脂、
ポリエステル樹脂、ポリウレタン樹脂、ポリ塩化
ビニル樹脂、ポリエチレン樹脂、ポリプロピレン
樹脂などのプラスチツク成形品、ゴム成形品、ガ
ラス成形品、その他の成形品を成形する金型とし
て、或いは食品用金型、医薬用金型等として使用
するものであり、射出成形用、押出成形用、吹込
成形用、圧縮成形用、或いは鋳造用等のいずれの
用途にも採用し得る。金型素材としてはスチー
ル、銅合金等、その目的に応じて適宜な材質を選
定でき、成形品の形状に応じた所望の形状に製作
することができる。 The mold to which the present invention is applied includes vinyl acetate resin,
As a mold for molding plastic molded products such as polyester resin, polyurethane resin, polyvinyl chloride resin, polyethylene resin, polypropylene resin, rubber molded products, glass molded products, and other molded products, or as food molds and pharmaceutical molds. It is used as a mold, etc., and can be employed for any purpose such as injection molding, extrusion molding, blow molding, compression molding, or casting. As the mold material, an appropriate material such as steel or copper alloy can be selected according to the purpose, and the mold can be manufactured into a desired shape according to the shape of the molded product.
本発明は、このように所望の形状に形成された
金型本体に対し、その成形品形成空間に面する表
面(キヤビテイ面)にフツ素樹脂粒子を均一に共
析させためつき被膜を形成し、更にその上にフツ
素樹脂被覆層を形成するものである。これを第1
図及び第2図によつて説明すると、1が金型本
体、2がキヤビテイ面、3がこのキヤビテイ面2
上に形成されたフツ素樹脂粒子共析めつき被膜
で、4がめつき被膜3の金属マトリツクス、5が
フツ素樹脂粒子であり、6はめつき被膜3の表面
に露頭した粒子5′とめつき被膜3に新たに供給
されたフツ素樹脂とを加熱溶融することによつて
形成されたフツ素樹脂被覆層である。なお、金型
が例えば雄型、雌型の2個よりなる場合、そのい
ずれかに対してもそのキヤビテイ面に上記フツ素
樹脂粒子共析めつき被膜を形成し、更にフツ素樹
脂被覆層を形成することが好ましい。 The present invention forms a tamping film by uniformly eutectoiding fluororesin particles on the surface (cavity surface) facing the molded product forming space on the mold body formed in the desired shape. Furthermore, a fluororesin coating layer is formed thereon. This is the first
To explain with reference to the figure and FIG. 2, 1 is the mold body, 2 is the cavity surface, and 3 is the cavity surface 2.
In the fluororesin particle eutectoid plating film formed on the surface, 4 is the metal matrix of the plating film 3, 5 is the fluorocarbon resin particle, and 6 is the metal matrix of the plating film 3, and 6 is the metal matrix of the plating film 3, and 6 is the metal matrix of the plating film 3, and the plating film has particles 5' exposed on the surface of the plating film 3. This is a fluororesin coating layer formed by heating and melting the newly supplied fluororesin. In addition, when the mold consists of two molds, for example, a male mold and a female mold, the above-mentioned fluororesin particle eutectoid plating film is formed on the cavity surface of either of them, and a fluororesin coating layer is further applied. It is preferable to form.
本発明においては、フツ素樹脂粒子として4フ
ツ化エチレン樹脂、4フツ化エチレン―6フツ化
プロピレン共重合樹脂、3フツ化塩化エチレン樹
脂、フツ化ビニリデン樹脂、フツ化ビニル樹脂、
等を単独で又はこれらを混合して用いることがで
きる。この場合粒子径は150μm以下、特に0.3〜
20μmとすることが好ましい。また、必要により
前記フツ素樹脂粒子に加えて他の無機もしくは有
機高分子微粒子を共析させることもできる。 In the present invention, the fluororesin particles include tetrafluoroethylene resin, tetrafluoroethylene-hexafluoropropylene copolymer resin, trifluorochloroethylene resin, vinylidene fluoride resin, vinyl fluoride resin,
These can be used alone or in combination. In this case, the particle size is less than 150 μm, especially from 0.3 to
The thickness is preferably 20 μm. Further, if necessary, other inorganic or organic polymer fine particles can be eutectoid in addition to the fluororesin particles.
めつき被膜のマトリツクスとしては特に制限は
なく、金型の用途等に応じて銅、銀、亜鉛、錫な
どの適宜な金属を選定することができるが、ニツ
ケル、それにニツケル―コバルト合金、ニツケル
―リン合金、ニツケル―ホウ素合金等のニツケル
合金が耐熱性、表面硬度等に優れていることから
好適に採用される。 There are no particular restrictions on the matrix of the plating film, and appropriate metals such as copper, silver, zinc, and tin can be selected depending on the purpose of the mold, but nickel, nickel-cobalt alloy, and nickel- Nickel alloys such as phosphorus alloys and nickel-boron alloys are preferably used because they have excellent heat resistance, surface hardness, and the like.
前記フツ素樹脂粒子共析めつき被膜の形成法と
しては、電気めつき法によつても無電解めつき法
によつても差支えなく、従来公知のめつき法が採
用でき、例えば、4フツ化エチレン樹脂等のフツ
素樹脂の粒子を必要によりカチオン活性剤、ノニ
オン活性剤、両性活性剤等の活性剤の存在下に、
或いは、これら活性剤を例えばカチオンとノニオ
ン活性剤を併用するなどして所望のめつき液中に
分散させてめつきする方法が採用される。 The method for forming the fluororesin particle eutectoid plating film may be an electroplating method or an electroless plating method, and conventionally known plating methods can be adopted. Particles of fluororesin such as ethylene resin are treated in the presence of an activator such as a cationic activator, a nonionic activator, or an amphoteric activator, if necessary.
Alternatively, a method for plating may be adopted in which these activators are dispersed in a desired plating solution using a combination of cationic and nonionic activators, for example.
なお、フツ素樹脂粒子のめつき液中への懸濁量
は250g/以下、特に30〜100g/とすること
が好ましく、本発明においては金型キヤビテイ面
に形成するめつき被膜中のフツ素樹脂粒子共析量
は特に制限されないが、めつき被膜に対して5〜
30容量%、特に10〜30容量%になるようにするこ
とが好ましい。 The amount of fluororesin particles suspended in the plating solution is preferably 250g/or less, particularly 30 to 100g/.In the present invention, the fluororesin particles in the plating film formed on the mold cavity surface The amount of eutectoid particles is not particularly limited, but it is 5 to 5 for the plating film.
It is preferable to adjust the amount to 30% by volume, especially 10 to 30% by volume.
また、前記めつき液中に光沢剤を添加し、金型
キヤビテイ面に形成する共析めつき被膜のマトリ
ツクスを光沢析出物とすることにより、金型の型
離れ性を一層向上させることができ、かつマトリ
ツクスの機械的強度を顕著に増大させることがで
きる。例えばニツケルめつきの場合、めつき被膜
のビツカース硬度を400以上とすることにより、
優れた効果を与える。 Furthermore, by adding a brightening agent to the plating solution and making the matrix of the eutectoid plating film formed on the mold cavity surface a glossy precipitate, the mold releasability of the mold can be further improved. , and the mechanical strength of the matrix can be significantly increased. For example, in the case of nickel plating, by setting the Vickers hardness of the plating film to 400 or more,
Gives an excellent effect.
上述したようにフツ素樹脂粒子の共析めつき被
膜は所望のめつき液にフツ素樹脂粒子を均一に懸
濁させ、通常のめつき条件においてめつきを行な
うことにより形成されるが、共析めつき被膜の形
成後、この被膜上にクロムめつき被覆層を形成し
てもよく、例えばフツ素樹脂粒子を共析させた光
沢ニツケルめつき被膜上にクロムめつき被膜を形
成することができる。なお、この場合、クロムめ
つき被膜は光沢ニツケルめつき被膜表面に露呈し
たフツ素樹脂粒子上には形成されず、光沢ニツケ
ルめつき被膜マトリツクス上にのみ形成される。
また、第3図に示すように金型本体1のキヤビテ
イ面2に所望の下地めつき被膜7を形成した上
に、フツ素樹脂粒子共析めつき被膜4を形成する
こともできる。 As mentioned above, the eutectoid plating film of fluororesin particles is formed by uniformly suspending the fluororesin particles in a desired plating solution and plating under normal plating conditions. After the formation of the deposited coating, a chromium-plated coating layer may be formed on this coating. For example, it is possible to form a chromium-plated coating on a glossy nickel-plated coating on which fluororesin particles are eutectoid. can. In this case, the chrome plating film is not formed on the fluororesin particles exposed on the surface of the bright nickel plating film, but is formed only on the bright nickel plating film matrix.
Further, as shown in FIG. 3, a desired base plating film 7 may be formed on the cavity surface 2 of the mold body 1, and then a fluororesin particle eutectoid plating film 4 may be formed.
本発明においては、このような4フツ化エチレ
ン樹脂等のフツ素樹脂粒子を共析させためつき被
膜の表面に更に新たなフツ素樹脂粒子を供給し、
次いでめつき被膜の表面に露頭するフツ素樹脂粒
子及びこのめつき被膜上に供給されたフツ素樹脂
を加熱軟化もしくは溶融して、第2図に示すよう
に、金型本体1のキヤビテイ面2に形成するフツ
素樹脂粒子5を軟化もしくは溶融させ、被膜3表
面の一部もしくは全部にフツ素樹脂被覆層6を形
成するものである。このようにめつき被膜表面
(共析めつき被膜表面又は共析めつき被膜後更に
他の最終めつき被膜を形成させる場合はこの最終
めつき被膜表面)の一部もしくは全部を共析めつ
き被膜表面に露頭するフツ素樹脂粒子及びこの共
析めつき被膜表面に別に供給されたフツ素樹脂の
軟化溶融によりフツ素樹脂で覆うことによつて、
金型の型離れ性を非常に優れたものにすることが
でき、しかも前記共析めつき被膜表面に別にフツ
素樹脂粒子を供給し、同時に軟化、溶融すること
によりめつき被膜表面に密着性の高いフツ素樹脂
被膜をより厚く形成することができる。 In the present invention, fluororesin particles such as tetrafluoroethylene resin are eutectoided, and new fluororesin particles are supplied to the surface of the taming coating.
Next, the fluororesin particles exposed on the surface of the plating film and the fluororesin supplied on the plating film are heated and softened or melted to form the cavity surface 2 of the mold body 1, as shown in FIG. The fluororesin particles 5 formed on the surface of the coating 3 are softened or melted to form a fluororesin coating layer 6 on part or all of the surface of the coating 3. In this way, part or all of the surface of the plating film (the surface of the eutectoid plating film, or the surface of the final plating film if another final plating film is formed after the eutectoid plating film) is eutectoid plating. By covering the fluororesin particles exposed on the coating surface and the fluororesin separately supplied to the surface of the eutectoid plating coating with a fluororesin,
The release property of the mold can be made very good, and the adhesion to the surface of the plating film is improved by separately supplying fluororesin particles to the surface of the eutectoid plating film and softening and melting them at the same time. It is possible to form a thicker fluororesin coating with a high
本発明の採用により得られた金型の効果につき
更に具体的に説明すると、エチレン―酢酸ビニル
共重合樹脂成形用金型(スチール製)のキヤビテ
イ面に下記組成のめつき液を用い、下記条件でめ
つきすることにより、4フツ化エチレン樹脂粒子
が均等に共析した光沢ニツケルめつき被膜を
50μm形成した。 To explain in more detail the effect of the mold obtained by adopting the present invention, a plating solution having the following composition was used on the cavity surface of an ethylene-vinyl acetate copolymer resin molding mold (made of steel) under the following conditions. By plating, a glossy nickel plating film in which tetrafluoroethylene resin particles are evenly eutectoid is created.
A thickness of 50 μm was formed.
めつき液組成、めつき条件
NiSO4・6H2O 280g/
NiCl2・6H2O 45 〃
H3BO3 40 〃
一次光沢剤 2 〃
二次光沢剤 0.2 〃
4フツ化エチレン樹脂粒子(粒径平均0.3μm、
ダイキン工業社製)(固形分) 50 〃
PH 4.0〜4.5
めつき温度 55℃
陰極電流密度 4A/dm2
陽 極 ニツケル
撹 拌 プロペラ
なお、形成されためつき被膜中には約15容量%
のポリテトラフルオロエチレン(4フツ化エチレ
ン樹脂)の粒子が共析されており、また被膜のビ
ツカース硬度は580であつた。Plating solution composition, plating conditions NiSO 4・6H 2 O 280g/ NiCl 2・6H 2 O 45 〃 H 3 BO 3 40 〃 Primary brightener 2 〃 Secondary brightener 0.2 〃 Tetrafluoroethylene resin particles (particle size Average 0.3μm,
(manufactured by Daikin Industries, Ltd.) (solid content) 50 〃 PH 4.0 to 4.5 Plating temperature 55℃ Cathode current density 4A/dm 2 anode Nickel stirring propeller Approximately 15% by volume is contained in the formed plating film
Particles of polytetrafluoroethylene (tetrafluoroethylene resin) were eutectoid, and the film had a Vickers hardness of 580.
次に、共析めつき被膜上に更に4フツ化エチレ
ン樹脂を供給し、370℃の加熱炉に20分間入れ、
共析めつき被膜表面に露頭している4フツ化エチ
レン樹脂粒子及び表面に供給された4フツ化エチ
レン樹脂を溶融して、めつき被膜表面を4フツ化
エチレン樹脂で完全に被膜した。 Next, tetrafluoroethylene resin was further supplied onto the eutectoid plating film and placed in a heating furnace at 370°C for 20 minutes.
The tetrafluoroethylene resin particles exposed on the surface of the eutectoid plating film and the tetrafluoroethylene resin supplied to the surface were melted to completely coat the surface of the plating film with the tetrafluoroethylene resin.
かくして得られた金型(本発明品)と、キヤビ
テイ面に硬質クロムめつき被膜が形成されている
金型(従来品)とを使用し、実際にエチレン―酢
酸ビニル共重合樹脂の成形を行なつたが、本発明
品の場合、離型剤を用いずに連続10回の成形を行
なつてもエチレン―酢酸ビニル共重合樹脂成形品
が粘付着せず、簡単に離型できた。これに対し、
キヤビテイ面に硬質クロムめつき被膜を形成した
従来微の場合は、離型剤を用いずに成形すると樹
脂が直ちにキヤビテイ面に粘付着してきれいに離
型することができなかつた。 Using the thus obtained mold (product of the present invention) and a mold with a hard chrome plating film formed on the cavity surface (conventional product), ethylene-vinyl acetate copolymer resin was actually molded. However, in the case of the product of the present invention, the ethylene-vinyl acetate copolymer resin molded product did not stick and could be easily released from the mold even after 10 consecutive moldings without using a mold release agent. In contrast,
In the case of a conventional molding machine in which a hard chromium plating film was formed on the cavity surface, when molded without using a mold release agent, the resin immediately adhered to the cavity surface and the mold could not be released cleanly.
本発明に係る剥離性被膜の製造方法は、以上述
べたように剥離性被膜を形成すべき物体の表面に
フツ素樹脂粒子を共析させためつき被膜を形成す
ると共に、このフツ素樹脂粒子を共析させためつ
き被膜表面に露頭するフツ素樹脂粒子と前記めつ
き被膜の表面に供給したフツ素樹脂とを軟化もし
くは溶融することにより前記めつき被膜表面の一
部もしくは全部にフツ素樹脂被覆層を形成したこ
とを特徴とするものである。 As described above, the method for producing a releasable coating according to the present invention involves forming a tough coating by eutectoiding fluororesin particles on the surface of an object on which a releasable coating is to be formed, and at the same time forming a tough coating by eutectoiding fluororesin particles on the surface of an object on which a releasable coating is to be formed. By softening or melting the fluororesin particles exposed on the surface of the plating film and the fluororesin supplied to the surface of the plating film, part or all of the surface of the plating film is coated with fluororesin. It is characterized by forming layers.
従つて、本発明に係る剥離性被膜は、フツ素樹
脂の粒子を共析させためつき被膜表面にフツ素樹
脂被覆層を形成していることにより、非常に剥離
性及至型離れ性の良いものである。このため、本
発明を金型に採用し、プラスチツク等を形成する
場合、離型剤を用いずに或いは用いる場合でも少
量を簡単に塗布するだけで、十分離型することが
できる。従つて、離型剤の塗布作業、金型キヤビ
テイ面に粘付着したプラスチツク等を除去する作
業などの点で作業性の改善を計ることができる。 Therefore, the removable film according to the present invention has extremely good releasability and mold release properties because the fluorocarbon resin coating layer is formed on the surface of the fluorocarbon resin coating by eutectoiding of fluorocarbon resin particles. It is. Therefore, when the present invention is applied to a mold to form plastic or the like, it is possible to sufficiently release the mold without using a mold release agent, or even when a mold release agent is used, just by simply applying a small amount. Therefore, it is possible to improve the workability in terms of the work of applying a mold release agent, the work of removing plastics etc. stuck to the mold cavity surface, etc.
また、本発明方法は、そのキヤビテイ面にフツ
素樹脂粒子を懸濁するめつき液を用いてめつきを
行ない、更に新たにフツ素樹脂粒子を供給し、フ
ツ素樹脂粒子を加熱溶融するだけで剥離性被膜を
簡単に製造できる。また、得られるめつき被膜
は、フツ素樹脂粒子がマトリツクス中にしつかり
と埋め込まれていると共に、キヤビテイ面もしく
は下地めつき膜に対して金属マトリツクスが密着
よく強固に結合しているものである。従つて、素
材との密着性が良く、繰り返しの使用によつても
めつき被膜が剥離する不都合を防止できる。かつ
フツ素樹脂粒子はマトリツクス金属に支えられて
おり、フツ素樹脂被覆層はめつき被膜の表面側に
共析されたフツ素樹脂粒子(表面露頭粒子)と一
体であるから密着性もよく、また機械的強度も高
い上、耐摩耗性も優れ、剥離性被膜の消耗も非常
に少なく、非常に耐久性の高いものである。 In addition, the method of the present invention performs plating using a plating solution that suspends fluororesin particles on the cavity surface, and then simply supplies new fluororesin particles and heat-melts the fluororesin particles. Peelable coatings can be easily produced. Furthermore, in the resulting plating film, the fluororesin particles are firmly embedded in the matrix, and the metal matrix is tightly and firmly bonded to the cavity surface or the underlying plating film. Therefore, the adhesion to the material is good, and the inconvenience of the plating film peeling off due to repeated use can be prevented. In addition, the fluororesin particles are supported by the matrix metal, and since the fluororesin coating layer is integrated with the fluororesin particles (surface exposed particles) eutectoided on the surface side of the plating film, it has good adhesion. It has high mechanical strength, excellent abrasion resistance, very little wear of the peelable coating, and is extremely durable.
第1図は本発明方法により製造された金型の他
の一例を示す概略断面図、第2図は同例の一部を
拡大して示した断面図、第3図は本発明の方法に
より製造された金型の他の例を示す概略断面図で
ある。
1……金型本体、2……キヤビテイ面、3……
めつき被膜、4……マトリツクス、5……フツ素
樹脂粒子、6……フツ素樹脂被覆層。
FIG. 1 is a schematic cross-sectional view showing another example of a mold manufactured by the method of the present invention, FIG. FIG. 3 is a schematic cross-sectional view showing another example of a manufactured mold. 1... Mold body, 2... Cavity surface, 3...
Plating film, 4... Matrix, 5... Fluorine resin particles, 6... Fluorine resin coating layer.
Claims (1)
樹脂粒子を共析させためつき被膜を形成した後、
このめつき被膜表面にフツ素樹脂粒子を供給し、
次いでめつき被膜表面に露頭するフツ素樹脂粒子
とめつき被膜の表面に供給したフツ素樹脂とを軟
化もしくは溶融して、前記めつき被膜表面の一部
もしくは全部にフツ素樹脂被膜層を形成したこと
を特徴とする剥離性被膜の製造方法。 2 フツ素樹脂が4フツ化エチレン樹脂、4フツ
化エチレン―6フツ化プロピレン共重合樹脂、3
フツ化塩化エチレン樹脂、フツ化ビニリデン樹脂
又はフツ化ビニル樹脂である特許請求の範囲第1
項記載の方法。 3 フツ素含有化合物の粒子が共析するめつき被
膜のマトリツクスがニツケルもしくはニツケル合
金である特許請求の範囲第1項又は第2項記載の
方法。 4 剥離性被膜を形成すべき物体が金型である特
許請求の範囲第1項乃至第3項いずれか記載の方
法。[Claims] 1. After forming a tough coating by eutectoiding fluororesin particles on the surface of an object on which a peelable coating is to be formed,
Supplying fluororesin particles to the surface of this plating film,
Next, the fluororesin particles exposed on the surface of the plating coating and the fluororesin supplied to the surface of the plating coating were softened or melted to form a fluororesin coating layer on part or all of the surface of the plating coating. A method for producing a releasable film, characterized by: 2 The fluororesin is a tetrafluoroethylene resin, a tetrafluoroethylene-hexafluoropropylene copolymer resin, 3
Claim 1, which is an ethylene fluoride fluoride resin, a vinylidene fluoride resin, or a vinyl fluoride resin
The method described in section. 3. The method according to claim 1 or 2, wherein the matrix of the plating film on which the particles of the fluorine-containing compound are eutectoid is nickel or a nickel alloy. 4. The method according to any one of claims 1 to 3, wherein the object on which the releasable film is to be formed is a mold.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19155483A JPS59106918A (en) | 1983-10-13 | 1983-10-13 | Mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19155483A JPS59106918A (en) | 1983-10-13 | 1983-10-13 | Mold |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59106918A JPS59106918A (en) | 1984-06-20 |
JPS641560B2 true JPS641560B2 (en) | 1989-01-11 |
Family
ID=16276601
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19155483A Granted JPS59106918A (en) | 1983-10-13 | 1983-10-13 | Mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59106918A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6117495A (en) * | 1993-09-01 | 2000-09-12 | Polymerit | Method for forming a mold-release coating |
JP3826608B2 (en) | 1999-03-17 | 2006-09-27 | 富士写真フイルム株式会社 | Formation of water-repellent film on the surface of the liquid ejection part |
US7192620B1 (en) | 2001-09-18 | 2007-03-20 | Polymerit | Mold-release coating systems |
JP2006123201A (en) * | 2004-10-26 | 2006-05-18 | Osaka Gas Co Ltd | Member for mold used for molding polyethylenic resin and mold |
-
1983
- 1983-10-13 JP JP19155483A patent/JPS59106918A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59106918A (en) | 1984-06-20 |
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