JPH0133296Y2 - - Google Patents
Info
- Publication number
- JPH0133296Y2 JPH0133296Y2 JP1984071077U JP7107784U JPH0133296Y2 JP H0133296 Y2 JPH0133296 Y2 JP H0133296Y2 JP 1984071077 U JP1984071077 U JP 1984071077U JP 7107784 U JP7107784 U JP 7107784U JP H0133296 Y2 JPH0133296 Y2 JP H0133296Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- fluororesin
- plating film
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 49
- 239000002245 particle Substances 0.000 claims description 37
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 12
- 229920001169 thermoplastic Polymers 0.000 claims description 10
- 239000011159 matrix material Substances 0.000 claims description 9
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 239000005060 rubber Substances 0.000 claims description 6
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 claims description 2
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 2
- 229920006026 co-polymeric resin Polymers 0.000 claims description 2
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 claims description 2
- PEVRKKOYEFPFMN-UHFFFAOYSA-N 1,1,2,3,3,3-hexafluoroprop-1-ene;1,1,2,2-tetrafluoroethene Chemical group FC(F)=C(F)F.FC(F)=C(F)C(F)(F)F PEVRKKOYEFPFMN-UHFFFAOYSA-N 0.000 claims 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 claims 1
- 229920002725 thermoplastic elastomer Polymers 0.000 claims 1
- 239000000047 product Substances 0.000 description 20
- 239000006082 mold release agent Substances 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000012190 activator Substances 0.000 description 6
- 239000011247 coating layer Substances 0.000 description 6
- 239000004416 thermosoftening plastic Substances 0.000 description 6
- 239000005038 ethylene vinyl acetate Substances 0.000 description 5
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- 238000005282 brightening Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- 229910000521 B alloy Inorganic materials 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229920000592 inorganic polymer Polymers 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- XIKYYQJBTPYKSG-UHFFFAOYSA-N nickel Chemical compound [Ni].[Ni] XIKYYQJBTPYKSG-UHFFFAOYSA-N 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Description
【考案の詳細な説明】
本考案は熱可塑性プラスチツク成形品、ゴム成
形品、ガラス成形品を成形するために用いる金型
に関し、特に型離れ性の優れた金型に関する。[Detailed Description of the Invention] The present invention relates to a mold used for molding thermoplastic plastic molded products, rubber molded products, and glass molded products, and particularly relates to a mold with excellent mold release properties.
従来、エチレン−酢酸ビニル共重合体等の熱可
塑性プラスチツク成形品の金型は、耐摩耗性、剥
離性などを向上させる目的から、その表面（成形
品が成形されることになる成形品形成空間に面す
る表面、以下、“キヤビテイ面”と称する。）に硬
質クロムめつき被膜や無電解ニツケルめつき被膜
を形成することが行なわれている。しかし、これ
ら金型を用いて実際に熱可塑性プラスチツク成形
品を成形する場合、離型時に成形品が金型キヤビ
テイ面に粘着し、離型し難くなる場合がある。例
えば、エチレン−酢酸ビニル共重合樹脂成形品を
得るため硬質クロムめつき被膜をキヤビテイ面に
施した金型で成形する場合、しばしば樹脂が粘着
し、きれいに型離れできない場合が生じる。この
ため、成形毎に離型剤をていねいにかつ充分塗布
する防護策が講じられているが、このように離型
剤を形成毎にていねいに塗布する作業は非常に面
倒である上、樹脂が金型キヤビテイ面に粘付着し
た場合は、成形後いちいち付着樹脂を取り去り、
清掃しなければならず、作業性に多大の支障をき
たしていた。また、金型に樹脂が粘付着すること
により、金型の消耗が早まる等の問題を有してい
た。 Conventionally, molds for thermoplastic molded products made of ethylene-vinyl acetate copolymer, etc. have been designed to improve wear resistance, peelability, etc. A hard chrome plating film or an electroless nickel plating film is formed on the surface facing the cavity (hereinafter referred to as the "cavity surface"). However, when a thermoplastic molded article is actually molded using these molds, the molded article may adhere to the mold cavity surface and become difficult to release from the mold. For example, when molding an ethylene-vinyl acetate copolymer resin molded article using a mold with a hard chromium plating coating applied to the cavity surface, the resin often sticks and the mold cannot be removed cleanly. For this reason, protective measures have been taken to carefully and thoroughly apply a mold release agent for each molding process, but this process of carefully applying a mold release agent for each molding process is extremely troublesome, and the resin may If the resin adheres to the mold cavity surface, remove the adhesive resin after molding, and
This required cleaning, which greatly hindered work efficiency. Furthermore, the resin adheres to the mold, causing problems such as premature wear of the mold.
本考案は上記事情を改善するためになされたも
ので、熱可塑性プラスチツク成形品、ゴム成形品
又はガラス成形品を得るための金型キヤビテイ面
に４フツ化エチレン樹脂等のフツ素樹脂粒子を共
析するめつき被膜を形成すると共に、めつき被膜
表面に露頭するフツ素樹脂粒子を軟化もしくは溶
融することによつてめつき被膜表面の一部もしく
は全部をフツ素樹脂で被覆することにより、非常
に優れた型離れ性を有し、離型剤を用いずとも、
或いは離型剤を用いる場合でも簡単な塗布で、熱
可塑性プラスチツク、ゴム又はガラスの成形品を
確実に離型することができ、作業性の改善を計る
ことができると共に、金型の消耗が少なく、その
耐久性が非常に高い金型を提供するものである。 The present invention was made to improve the above-mentioned situation, and is intended to incorporate fluororesin particles such as tetrafluoroethylene resin on the cavity surface of a mold for producing thermoplastic plastic molded products, rubber molded products, or glass molded products. In addition to forming a plating film to be analyzed, by softening or melting the fluororesin particles exposed on the surface of the plating film, a part or all of the surface of the plating film is coated with the fluororesin. It has excellent mold release properties and can be used without using a mold release agent.
Alternatively, even when a mold release agent is used, it is possible to reliably release thermoplastic, rubber or glass molded products with a simple application, improving workability and reducing wear and tear on the mold. This provides a mold with extremely high durability.
以下、本考案につき図面を参照しつつ詳しく説
明する。 Hereinafter, the present invention will be explained in detail with reference to the drawings.
本考案に係る金型は、酢酸ビニル樹脂、ポリエ
ステル樹脂、ポリ塩化ビニル樹脂、ポリエチレン
樹脂、ポリプロピレン樹脂などの熱可塑性プラス
チツク成形品、ゴム成形品、ガラス成形品を成形
する金型として使用するものであり、射出成形
用、押出成形用、吹込成形用、圧縮成形用、或い
は鋳造用等のいずれの用途にも採用し得る。金型
素材としてはスチール、銅合金等、その目的に応
じて適宜な材質を選択でき、成形品の形状に応じ
た所望の形状に製作することができる。 The mold according to the present invention is used as a mold for molding thermoplastic molded products such as vinyl acetate resin, polyester resin, polyvinyl chloride resin, polyethylene resin, and polypropylene resin, rubber molded products, and glass molded products. It can be used for any purpose such as injection molding, extrusion molding, blow molding, compression molding, or casting. As the mold material, an appropriate material such as steel or copper alloy can be selected depending on the purpose, and the mold can be manufactured into a desired shape according to the shape of the molded product.
本考案は、このように所望の形状に形成された
金型本体に対し、その成形品形成空間に面する表
面（キヤビテイ面）にフツ素樹脂粒子を均一に共
析させためつき被膜を形成すると共に、めつき後
被膜表面に露頭するフツ素樹脂粒子を軟化もしく
は溶融することによりめつき被膜表面の一部もし
くは全部をフツ素樹脂で被覆したものである。こ
れを第１図及び第２図によつて説明すると、１が
金型本体、２がキヤビテイ面、３がこのキヤビテ
イ面２上に形成されたフツ素樹脂粒子共析めつき
被膜で、４がめつき被膜３の金属マトリツクス、
５がフツ素樹脂粒子であり、６はめつき被膜３の
表面に露頭した粒子５′を加熱溶融することによ
つて形成されたフツ素樹脂被覆層である。なお、
本考案において、金型が例えば雄型、雌型の２個
よりなる場合、そのいずれに対してもそのキヤビ
テイ面に上記フツ素樹脂粒子共析めつき被膜を形
成し、更にフツ素樹脂被覆層を形成することが好
ましい。 The present invention involves uniformly eutectoidizing fluororesin particles to form a coating on the surface of the mold body formed into the desired shape (cavity surface) facing the molded product forming space. In addition, part or all of the surface of the plating film is coated with a fluororesin by softening or melting the fluororesin particles exposed on the surface of the plating film after plating. To explain this with reference to Figures 1 and 2, 1 is the mold body, 2 is the cavity surface, 3 is the fluororesin particle eutectoid plating coating formed on the cavity surface 2, and 4 is the eutectoid plating film formed on the cavity surface 2. metal matrix with coating 3;
5 is a fluororesin particle, and 6 is a fluororesin coating layer formed by heating and melting the particles 5' exposed on the surface of the plated coating 3. In addition,
In the present invention, when the mold consists of two molds, for example, a male mold and a female mold, the above-mentioned fluororesin particle eutectoid plating film is formed on the cavity surface of each mold, and a fluororesin coating layer is further formed. It is preferable to form
本考案においては、フツ素樹脂粒子として４フ
ツ化エチレン樹脂、４フツ化エチレン−６フツ化
プロピレン共重合樹脂、３フツ化塩化エチレン樹
脂、フツ化ビニリデン樹脂、フツ化ビニル樹脂等
を単独で又はこれらを混合して用いることができ
る。この場合粒子径は150μm以下、特に0.3〜
20μmとすることが好ましい。また、必要により
前記フツ素樹脂粒子に加えて他の無機もしくは有
機高分子微粒子を共析させることもできる。 In the present invention, as the fluororesin particles, tetrafluoroethylene resin, tetrafluoroethylene-hexafluoride propylene copolymer resin, trifluorochloride ethylene resin, vinylidene fluoride resin, vinyl fluoride resin, etc. are used alone or A mixture of these can be used. In this case, the particle size is less than 150 μm, especially from 0.3 to
The thickness is preferably 20 μm. Further, if necessary, in addition to the fluororesin particles, other inorganic or organic polymer fine particles can be eutectoid.
めつき被膜のマトリツクスとしては特に制限は
なく、金型の用途等に応じて銅、銀、亜鉛、錫な
ど、適宜な金属を選定することができるが、ニツ
ケル、それにニツケル−コバルト合金、ニツケル
−リン合金、ニツケル−ホウ素合金等のニツケル
合金が耐熱性、表面硬度等に優れていることから
好適に採用される。 There are no particular restrictions on the matrix of the plating film, and appropriate metals such as copper, silver, zinc, and tin can be selected depending on the purpose of the mold, but nickel, nickel-cobalt alloy, and nickel- Nickel alloys such as phosphorus alloys and nickel-boron alloys are preferably used because they have excellent heat resistance, surface hardness, and the like.
前記フツ素樹脂粒子共析めつき膜の形成法とし
ては、電気めつき法によつても無電解めつき法に
よつても差支えなく、従来公知のめつき法が採用
でき、例えば４フツ化エチレン樹脂等のフツ素樹
脂の粒子を必要によりカチオン活性剤、ノニオン
活性剤、両性活性剤等の活性剤の存在下に、或い
は、これら活性剤を例えばカチオンとノニオン活
性剤を併用するなどして所望のめつき液中に分散
させてめつきする方法が採用される。 The method for forming the fluororesin particle eutectoid plating film may be an electroplating method or an electroless plating method, and conventionally known plating methods can be adopted. Particles of fluororesin such as ethylene resin are treated in the presence of activators such as cationic activators, nonionic activators, amphoteric activators, etc., or by using these activators in combination, for example, cationic and nonionic activators. A method of plating by dispersing it in a desired plating solution is adopted.
なお、フツ素樹脂粒子のめつき液中への懸濁量
は250g／以下、特に30〜100g／とすること
が好ましく、本考案においては金型キヤビテイ面
に形成するめつき被膜中のフツ素樹脂粒子共析量
は特に制限されないが、めつき被膜に対して５〜
30容量％、特に10〜30容量％になるようにするこ
とが好ましい。 The amount of fluororesin particles suspended in the plating solution is preferably 250g/or less, particularly 30 to 100g/.In the present invention, the fluororesin particles in the plating film formed on the mold cavity surface The amount of eutectoid particles is not particularly limited, but it is 5 to 5 for the plating film.
It is preferable to adjust the amount to 30% by volume, especially 10 to 30% by volume.
また、前記めつき液中に光沢剤を添加し、金型
キヤビテイ面に形成する共析めつき被膜のマトリ
ツクスを光沢析出物とすることにより、金型の型
離れ性を一層向上させることができ、かつマトリ
ツクスの機械的強度を顕著に増大させることがで
きる。例えばニツケルめつきの場合、めつき被膜
のビツカーズ硬度を400以上とすることにより、
優れた効果を与える。 Furthermore, by adding a brightening agent to the plating solution and making the matrix of the eutectoid plating film formed on the mold cavity surface a bright precipitate, the mold releasability of the mold can be further improved. , and the mechanical strength of the matrix can be significantly increased. For example, in the case of nickel plating, by setting the Vickers hardness of the plating film to 400 or more,
Gives excellent effect.
なお、本考案においては、第３図に示すように
金型本体１のキヤビテイ面２に所望の下地めつき
被膜７を形成した上に、フツ素樹脂粒子共析めつ
き被膜４を形成することもできる。 In the present invention, as shown in FIG. 3, a desired base plating film 7 is formed on the cavity surface 2 of the mold body 1, and then a fluororesin particle eutectoid plating film 4 is formed. You can also do it.
また、フツ素樹脂粒子共析めつき被膜に対して
は研摩が可能であり、必要により研摩加工を行な
つて鏡面仕上げすることもできる。 Further, the fluororesin particle eutectoid plating coating can be polished, and if necessary, it can be polished to a mirror finish.
本考案に係る金型の効果につき更に具体的に説
明すると、エチレン−酢酸ビニル共重合樹脂成形
用金型（スチール製）のキヤビテイ面に下記組成
のめつき液を用い、下記条件でめつきすることに
より、４フツ化エチレン樹脂粒子が均等に共析し
た光沢ニツケルめつき被膜を50μm形成した。 To explain in more detail the effect of the mold according to the present invention, the cavity surface of an ethylene-vinyl acetate copolymer resin molding mold (made of steel) is plated using a plating liquid with the following composition under the following conditions. As a result, a glossy nickel plating film with a thickness of 50 μm in which tetrafluoroethylene resin particles were uniformly eutectoid was formed.
めつき液組成、めつき条件
NiSO4・6H2O 280g／
NiC2・6H2O 45 〃
H3BO3 40 〃
一次光沢剤 ２ 〃
二次光沢剤 0.2 〃
４フツ化エチレン樹脂粒子 50 〃
（粒径平均0.3μm，ダイキン工業社製）
（固形分）
PH 4.0〜4.5
めつき温度 55℃
陰極電流密度 4A／ｄm2
陽極 ニツケル
撹拌 プロペラ
なお、形成されためつき被膜中には約15容量％
のポリテトラフルオロエチレン（４フツ化エチレ
ン樹脂）の粒子が共析されており、また被膜のビ
ツカーズ硬度は580であつた。Plating liquid composition, plating conditions NiSO 4・6H 2 O 280g/ NiC 2・6H 2 O 45 〃 H 3 BO 3 40 〃 Primary brightening agent 2 〃 Secondary brightening agent 0.2 〃 Tetrafluoroethylene resin particles 50 〃 ( Average particle size: 0.3 μm, manufactured by Daikin Industries, Ltd.) (Solid content) PH 4.0 to 4.5 Plating temperature 55℃ Cathode current density 4A/dm 2 Anode Nickel Stirring propeller Approximately 15% by volume of the formed plating film
Particles of polytetrafluoroethylene (tetrafluoroethylene resin) were eutectoid, and the coating had a Vickers hardness of 580.
次に、キヤビテイ面に共析めつき被膜が形成さ
れた金型を370℃の加熱炉に20分間入れ、共析め
つき被膜表面に露頭している４フツ化エチレン樹
脂粒子を溶融して、めつき被膜表面を４フツ化エ
チレン樹脂で被覆した。 Next, the mold with the eutectoid plating film formed on the cavity surface is placed in a heating furnace at 370°C for 20 minutes to melt the tetrafluoroethylene resin particles exposed on the surface of the eutectoid plating film. The surface of the plating film was coated with a tetrafluoroethylene resin.
かくして得られた金型（本考案品）と、キヤビ
テイ面に硬質クロムめつき被膜が形成されている
金型（従来品）とを使用し、実際にエチレン−酢
酸ビニル共重合樹脂の成形を行なつたが、本考案
品の場合、離型剤を用いずに連続10回の成形を行
なつてもエチレン−酢酸ビニル共重合樹脂成形品
が粘付着せず、簡単に離型できた。これに対し、
キヤビテイ面に硬質クロムめつき被膜を形成した
従来品の場合は、離型剤を用いずに成形すると樹
脂が直ちにキヤビテイ面に粘付着してきれいに離
型することができなかつた。 Using the thus obtained mold (product of the present invention) and a mold (conventional product) in which a hard chrome plating film is formed on the cavity surface, ethylene-vinyl acetate copolymer resin was actually molded. However, in the case of the product of the present invention, the ethylene-vinyl acetate copolymer resin molded product did not stick and could be easily released from the mold even after 10 consecutive moldings without using a mold release agent. On the other hand,
In the case of conventional products with a hard chrome plating film formed on the cavity surface, when molded without using a mold release agent, the resin immediately adhered to the cavity surface and could not be released cleanly from the mold.
本考案の金型は、以上述べたように成形品形成
空間に面する表面にフツ素樹脂粒子を共析させた
めつき被膜を形成すると共に、このフツ素樹脂粒
子を共析させためつき被膜表面に露頭するフツ素
樹脂粒子を軟化もしくは溶融することにより前記
めつき被膜表面の一部もしくは全部にフツ素樹脂
被覆層を形成したことを特徴とするものである。 As described above, the mold of the present invention has a structure in which the fluororesin particles are eutectoided to form a taming film on the surface facing the molded product forming space, and the fluororesin particles are eutectoided to form the taming film on the surface facing the molded product forming space. The present invention is characterized in that a fluororesin coating layer is formed on part or all of the surface of the plating film by softening or melting the fluororesin particles exposed on the surface.
従つて、本考案に係る金型は、キヤビテイ面に
フツ素樹脂の粒子を共析させためつき被膜を形成
し、かつその表面に露頭するフツ素樹脂を軟化も
しくは溶融することによつてフツ素樹脂被覆層を
形成していることにより、非常に型離れ性の良い
ものである。このため、熱可塑性プラスチツク、
ゴム、ガラスを成形する場合、離型剤を用いずに
或いは用いる場合でも少量を簡単に塗布するだけ
で、充分離型することができる。従つて、離型剤
の塗布作業、金型キヤビテイ面に粘付着した熱可
塑性プラスチツク等を除去する作業などの点で作
業性の改善を計ることができる。 Therefore, the mold according to the present invention forms a tough coating by eutectoiding fluororesin particles on the cavity surface, and softens or melts the fluororesin exposed on the surface to form a fluorine-containing coating. By forming a resin coating layer, it has very good mold release properties. For this reason, thermoplastics,
When molding rubber or glass, sufficient separation molding can be achieved without using a mold release agent, or even when a mold release agent is used, simply applying a small amount of the mold release agent. Therefore, it is possible to improve the workability in terms of the work of applying a mold release agent, the work of removing thermoplastic plastic, etc. stuck to the mold cavity surface, and the like.
また、本考案の金型は、そのキヤビテイ面にフ
ツ素樹脂粒子を懸濁するめつき液を用いてめつき
を行ない、更にフツ素樹脂粒子を加熱溶融するだ
けで簡単に製造できる。また、得られるめつき被
膜は、フツ素樹脂粒子がマトリツクス中にしつか
りと埋め込まれていると共に、キヤビテイ面もし
くは下地めつき膜に対して金属マトリツクスや密
着よく強固に結合しているものである。従つて、
素材（金型本体）との密着性が良く、繰り返しの
使用によつてもめつき被膜が剥離する不都合を防
止できる。かつフツ素樹脂粒子はマトリツクス金
属に支えられており、フツ素樹脂被覆層はめつき
被膜の表面側に共析されたフツ素樹脂粒子（表面
露頭粒子）と一体であるから密着性もよく、また
機械的強度も高い上、耐摩耗性も優れ、金型の消
耗も非常に少なく、しかも上述したように成形時
に熱可塑性プラスチツク等が粘付着することが防
止され、その除去作業時における損傷なども防止
されるので、本考案の金型は非常に耐久性の高い
ものである。 Furthermore, the mold of the present invention can be easily manufactured by simply plating the cavity surface using a plating solution that suspends fluororesin particles and then heating and melting the fluororesin particles. In addition, in the resulting plating film, the fluororesin particles are firmly embedded in the matrix, and are firmly bonded to the metal matrix and the cavity surface or the underlying plating film with good adhesion. Therefore,
It has good adhesion to the material (mold body) and can prevent the inconvenience of the plating film peeling off due to repeated use. In addition, the fluororesin particles are supported by the matrix metal, and since the fluororesin coating layer is integrated with the fluororesin particles (surface exposed particles) eutectoided on the surface side of the plating film, it has good adhesion. It has high mechanical strength, excellent abrasion resistance, and very little wear and tear on the mold.Moreover, as mentioned above, it prevents thermoplastics from sticking during molding, and prevents damage when removing them. This makes the mold of the present invention very durable.
第１図は本考案の一実施例を示す概略断面図、
第２図は同例の一部を拡大して示した断面図、第
３図は本考案の他の実施例を示す概略断面図であ
る。
１……金型本体、２……キヤビテイ面、３……
めつき被膜、４……マトリツクス、５……フツ素
樹脂粒子、６……フツ素樹脂被覆層。
FIG. 1 is a schematic sectional view showing an embodiment of the present invention;
FIG. 2 is an enlarged sectional view of a part of the same example, and FIG. 3 is a schematic sectional view showing another embodiment of the present invention. 1... Mold body, 2... Cavity surface, 3...
Plating film, 4... Matrix, 5... Fluorine resin particles, 6... Fluorine resin coating layer.
Claims (1)
形する金型の成形品形成空間に面する表面にフ
ツ素樹脂粒子を共析させためつき被膜を形成す
ると共に、このめつき被膜表面に露頭するフツ
素樹脂粒子を軟化もしくは溶融することにより
めつき被膜表面の一部もしくは全部をフツ素樹
脂で被覆してなることを特徴とする金型。 ２ フツ素樹脂が４フツ化エチレン樹脂、４フツ
化エチレン−６フツ化プロピレン共重合樹脂、
３フツ化塩化エチレン樹脂、フツ化ビニリデン
樹脂又はフツ化ビニル樹脂である実用新案登録
請求の範囲第１項記載の金型。 ３ フツ素樹脂粒子が共析するめつき被膜のマト
リツクスがニツケルもしくはニツケル合金であ
る実用新案登録請求の範囲第１項又は第２項記
載の金型。[Claims for Utility Model Registration] 1. Forming a plating film by eutectoiding fluororesin particles on the surface facing the molded product forming space of a mold for molding thermoplastic plastic, rubber or glass, and A mold characterized in that a part or all of the surface of a plating film is coated with a fluororesin by softening or melting the fluororesin particles exposed on the surface of the film. 2 The fluororesin is a tetrafluoroethylene resin, a tetrafluoroethylene-hexafluoropropylene copolymer resin,
The mold according to claim 1, which has been registered as a utility model and is made of trifluorochlorinated ethylene resin, vinylidene fluoride resin, or vinyl fluoride resin. 3. The mold according to claim 1 or 2, wherein the matrix of the plating film on which the fluororesin particles are eutectoid is nickel or a nickel alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7107784U JPS6053522U (en) | 1984-05-17 | 1984-05-17 | Mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7107784U JPS6053522U (en) | 1984-05-17 | 1984-05-17 | Mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6053522U JPS6053522U (en) | 1985-04-15 |
| JPH0133296Y2 true JPH0133296Y2 (en) | 1989-10-09 |
Family
ID=30201230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7107784U Granted JPS6053522U (en) | 1984-05-17 | 1984-05-17 | Mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6053522U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006059580A1 (en) * | 2004-11-30 | 2006-06-08 | Asahi Glass Company, Limited | Mold and process for production of substrates having transferred micropatterns thereon |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6088878B2 (en) * | 2013-03-26 | 2017-03-01 | 住友理工株式会社 | Manufacturing method of molding die and molding die |
| JP6343514B2 (en) * | 2014-07-31 | 2018-06-13 | 住友理工株式会社 | Manufacturing method of molding die and molding die |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6010816U (en) * | 1983-07-04 | 1985-01-25 | 本田技研工業株式会社 | Heat-resistant sound-absorbing material |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6010816Y2 (en) * | 1979-12-05 | 1985-04-12 | 上村工業株式会社 | Mold |
-
1984
- 1984-05-17 JP JP7107784U patent/JPS6053522U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6010816U (en) * | 1983-07-04 | 1985-01-25 | 本田技研工業株式会社 | Heat-resistant sound-absorbing material |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006059580A1 (en) * | 2004-11-30 | 2006-06-08 | Asahi Glass Company, Limited | Mold and process for production of substrates having transferred micropatterns thereon |
| JPWO2006059580A1 (en) * | 2004-11-30 | 2008-06-05 | 旭硝子株式会社 | Mold, and method for producing substrate having transfer fine pattern |
| JP4655043B2 (en) * | 2004-11-30 | 2011-03-23 | 旭硝子株式会社 | Mold, and method for producing substrate having transfer fine pattern |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6053522U (en) | 1985-04-15 |
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