JPS6415412U - - Google Patents
Info
- Publication number
- JPS6415412U JPS6415412U JP11083587U JP11083587U JPS6415412U JP S6415412 U JPS6415412 U JP S6415412U JP 11083587 U JP11083587 U JP 11083587U JP 11083587 U JP11083587 U JP 11083587U JP S6415412 U JPS6415412 U JP S6415412U
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric
- semiconductor device
- oscillator
- built
- fixedly connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000003466 welding Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 1
- 230000010355 oscillation Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000013078 crystal Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図ａ，ｂは本考案の圧電発振器の一実施例
としての水晶発振器を示す。ａは平面図、ｂは正
面断面図。
１……水晶振動片、２……ステム、３……ハー
メチツクガラス、４……リード線、５……金属キ
ヤツプ、６……水晶振動子、７……ダイパツド、
８……半導体素子、９……Ａｕワイヤー、１０…
…リード端子、１１，１２……リード端子の内の
水晶振動子接続用リード端子、１３……トランス
フアーモールド樹脂によるパツケージ、１４……
半導体装置、１５……溶接による固着接続。
第２図は本考案による水晶発振器の水晶振動子
と半導体装置の接続位置の応用例で半導体装置パ
ツケージング形状がＳＯＰタイプの実施例を示す
図。第３図ａ，ｂは本考案による水晶発振器の水
晶振動子と半導体装置の接続位置の応用例で半導
体装置のパツケージング形状がＤＩＰタイプの実
施例を示す図。第４図は本考案による水晶発振器
の水晶振動子の固着位置の応用例を示す図。第５
図は本考案による一例としての水晶発振器の半導
体装置と水晶振動子の固着接続部を説明する拡大
図。第６図は従来の圧電発振器の一例としての金
属パツケージタイプの水晶発振器を示す正面断面
図。第７図は従来の圧電発振器の一例としてのト
ランスフアーモールド樹脂によるパツケージング
タイプの水晶発振器を示す正面断面図。
FIGS. 1a and 1b show a crystal oscillator as an embodiment of the piezoelectric oscillator of the present invention. A is a plan view, and b is a front sectional view. 1... Crystal resonator piece, 2... Stem, 3... Hermetic glass, 4... Lead wire, 5... Metal cap, 6... Crystal resonator, 7... Die pad,
8...Semiconductor element, 9...Au wire, 10...
... Lead terminals, 11, 12 ... Lead terminals for connecting crystal resonators among lead terminals, 13 ... Package made of transfer mold resin, 14 ...
Semiconductor device, 15...Fixed connection by welding. FIG. 2 is a diagram showing an example of the application of the connection position between the crystal oscillator of the crystal oscillator and the semiconductor device according to the present invention, and the semiconductor device packaging shape is an SOP type. FIGS. 3a and 3b are diagrams showing an application example of the connection position between the crystal oscillator of the crystal oscillator and the semiconductor device according to the present invention, and the packaging shape of the semiconductor device is a DIP type. FIG. 4 is a diagram showing an application example of the fixing position of the crystal resonator of the crystal oscillator according to the present invention. Fifth
The figure is an enlarged view illustrating a fixed connection portion between a semiconductor device of a crystal oscillator and a crystal resonator as an example of the present invention. FIG. 6 is a front sectional view showing a metal package type crystal oscillator as an example of a conventional piezoelectric oscillator. FIG. 7 is a front sectional view showing a packaging type crystal oscillator made of transfer mold resin as an example of a conventional piezoelectric oscillator.
Claims (1)
た半導体素子を内蔵してパツケージングされた半
導体装置の外部リードと、圧電発振片を内蔵して
パツケージングされた圧電振動子の予めハンダを
被覆した外部引き出し電極とを、溶接法によつて
固着接続し、前記固着接続部分が、溶接およびハ
ンダ付けの二重構造となつていることを特徴とす
る圧電発振器。 External leads of a packaged semiconductor device containing at least a built-in semiconductor element that has the function of oscillating a piezoelectric vibrator, and an external lead coated with solder in advance of a packaged piezoelectric vibrator with a built-in piezoelectric oscillation piece. 1. A piezoelectric oscillator, wherein the piezoelectric oscillator is fixedly connected to an electrode by a welding method, and the fixedly connected portion has a double structure of welding and soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11083587U JPS6415412U (en) | 1987-07-20 | 1987-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11083587U JPS6415412U (en) | 1987-07-20 | 1987-07-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6415412U true JPS6415412U (en) | 1989-01-26 |
Family
ID=31348353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11083587U Pending JPS6415412U (en) | 1987-07-20 | 1987-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6415412U (en) |
-
1987
- 1987-07-20 JP JP11083587U patent/JPS6415412U/ja active Pending
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