JPS6413796U - - Google Patents
Info
- Publication number
- JPS6413796U JPS6413796U JP1987108644U JP10864487U JPS6413796U JP S6413796 U JPS6413796 U JP S6413796U JP 1987108644 U JP1987108644 U JP 1987108644U JP 10864487 U JP10864487 U JP 10864487U JP S6413796 U JPS6413796 U JP S6413796U
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- sealing resin
- shield
- circuit board
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987108644U JPS6413796U (,) | 1987-07-15 | 1987-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987108644U JPS6413796U (,) | 1987-07-15 | 1987-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6413796U true JPS6413796U (,) | 1989-01-24 |
Family
ID=31344171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987108644U Pending JPS6413796U (,) | 1987-07-15 | 1987-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6413796U (,) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017199752A (ja) * | 2016-04-26 | 2017-11-02 | ローム株式会社 | パワーモジュールおよびその製造方法 |
-
1987
- 1987-07-15 JP JP1987108644U patent/JPS6413796U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017199752A (ja) * | 2016-04-26 | 2017-11-02 | ローム株式会社 | パワーモジュールおよびその製造方法 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0278372U (,) | ||
| JPS6413796U (,) | ||
| JPH0511Y2 (,) | ||
| JPS625673U (,) | ||
| JPS6343495U (,) | ||
| JPS6218049Y2 (,) | ||
| JPS61199051U (,) | ||
| JPH0134360Y2 (,) | ||
| JPS63114095U (,) | ||
| JPH0415257U (,) | ||
| JPH038464U (,) | ||
| JPS58168141U (ja) | リ−ドレスパツケ−ジ | |
| JPH0325244U (,) | ||
| JPS5897896U (ja) | シ−ルド兼用チツプ回路 | |
| JPH0241471U (,) | ||
| JPH0397999U (,) | ||
| JPS6413141U (,) | ||
| JPS6343494U (,) | ||
| JPH0231177U (,) | ||
| JPS61146977U (,) | ||
| JPS59128797U (ja) | シ−ルド装置 | |
| JPS58175661U (ja) | 高集積混成集積回路 | |
| JPS61106072U (,) | ||
| JPS6175158U (,) | ||
| JPS6183386U (,) |