JPS6413776U - - Google Patents
Info
- Publication number
- JPS6413776U JPS6413776U JP10982987U JP10982987U JPS6413776U JP S6413776 U JPS6413776 U JP S6413776U JP 10982987 U JP10982987 U JP 10982987U JP 10982987 U JP10982987 U JP 10982987U JP S6413776 U JPS6413776 U JP S6413776U
- Authority
- JP
- Japan
- Prior art keywords
- package
- circuit board
- printed circuit
- electronic component
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10982987U JPS6413776U (sv) | 1987-07-17 | 1987-07-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10982987U JPS6413776U (sv) | 1987-07-17 | 1987-07-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6413776U true JPS6413776U (sv) | 1989-01-24 |
Family
ID=31346434
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10982987U Pending JPS6413776U (sv) | 1987-07-17 | 1987-07-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6413776U (sv) |
-
1987
- 1987-07-17 JP JP10982987U patent/JPS6413776U/ja active Pending