JPS6413750U - - Google Patents

Info

Publication number
JPS6413750U
JPS6413750U JP1987110394U JP11039487U JPS6413750U JP S6413750 U JPS6413750 U JP S6413750U JP 1987110394 U JP1987110394 U JP 1987110394U JP 11039487 U JP11039487 U JP 11039487U JP S6413750 U JPS6413750 U JP S6413750U
Authority
JP
Japan
Prior art keywords
housing
resistor
conductive pattern
substitute
serve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987110394U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0514531Y2 (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987110394U priority Critical patent/JPH0514531Y2/ja
Publication of JPS6413750U publication Critical patent/JPS6413750U/ja
Application granted granted Critical
Publication of JPH0514531Y2 publication Critical patent/JPH0514531Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP1987110394U 1987-07-17 1987-07-17 Expired - Lifetime JPH0514531Y2 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987110394U JPH0514531Y2 (zh) 1987-07-17 1987-07-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987110394U JPH0514531Y2 (zh) 1987-07-17 1987-07-17

Publications (2)

Publication Number Publication Date
JPS6413750U true JPS6413750U (zh) 1989-01-24
JPH0514531Y2 JPH0514531Y2 (zh) 1993-04-19

Family

ID=31347511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987110394U Expired - Lifetime JPH0514531Y2 (zh) 1987-07-17 1987-07-17

Country Status (1)

Country Link
JP (1) JPH0514531Y2 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0665525U (ja) * 1991-10-11 1994-09-16 株式会社マルハチ 開閉式天窓
JP2002009349A (ja) * 2000-06-26 2002-01-11 Koha Co Ltd Ｌｅｄ面発光装置およびその製造方法
JP3125289U (ja) * 2006-07-03 2006-09-14 株式会社シンプル マウント用チップｌｅｄを利用するミニチュアライトキット

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0665525U (ja) * 1991-10-11 1994-09-16 株式会社マルハチ 開閉式天窓
JP2002009349A (ja) * 2000-06-26 2002-01-11 Koha Co Ltd Ｌｅｄ面発光装置およびその製造方法
JP3125289U (ja) * 2006-07-03 2006-09-14 株式会社シンプル マウント用チップｌｅｄを利用するミニチュアライトキット

Also Published As

Publication number Publication date
JPH0514531Y2 (zh) 1993-04-19

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