JPS6413749U - - Google Patents
Info
- Publication number
- JPS6413749U JPS6413749U JP1987110393U JP11039387U JPS6413749U JP S6413749 U JPS6413749 U JP S6413749U JP 1987110393 U JP1987110393 U JP 1987110393U JP 11039387 U JP11039387 U JP 11039387U JP S6413749 U JPS6413749 U JP S6413749U
- Authority
- JP
- Japan
- Prior art keywords
- housing
- attached
- conductive pattern
- outer lens
- substitute
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987110393U JPH0536293Y2 (es) | 1987-07-17 | 1987-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987110393U JPH0536293Y2 (es) | 1987-07-17 | 1987-07-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6413749U true JPS6413749U (es) | 1989-01-24 |
| JPH0536293Y2 JPH0536293Y2 (es) | 1993-09-14 |
Family
ID=31347509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987110393U Expired - Lifetime JPH0536293Y2 (es) | 1987-07-17 | 1987-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0536293Y2 (es) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04119592U (ja) * | 1991-04-11 | 1992-10-26 | 株式会社シブタニ | 片開き扉の間隙閉鎖装置 |
| US7264456B2 (en) | 2001-10-10 | 2007-09-04 | Micron Technology, Inc. | Leadframe and method for reducing mold compound adhesion problems |
-
1987
- 1987-07-17 JP JP1987110393U patent/JPH0536293Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04119592U (ja) * | 1991-04-11 | 1992-10-26 | 株式会社シブタニ | 片開き扉の間隙閉鎖装置 |
| US7264456B2 (en) | 2001-10-10 | 2007-09-04 | Micron Technology, Inc. | Leadframe and method for reducing mold compound adhesion problems |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0536293Y2 (es) | 1993-09-14 |