JPS6413729A - Flush tank - Google Patents

Flush tank

Info

Publication number
JPS6413729A
JPS6413729A JP17012487A JP17012487A JPS6413729A JP S6413729 A JPS6413729 A JP S6413729A JP 17012487 A JP17012487 A JP 17012487A JP 17012487 A JP17012487 A JP 17012487A JP S6413729 A JPS6413729 A JP S6413729A
Authority
JP
Japan
Prior art keywords
flush
cage
water
tank
discharged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17012487A
Other languages
Japanese (ja)
Inventor
Yasusada Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP17012487A priority Critical patent/JPS6413729A/en
Publication of JPS6413729A publication Critical patent/JPS6413729A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE:To securely flush a wafer surface by directing poured water to the wafer surface immersed in a flush cage after substantially aligning the bottom of the flush cage with a flow ordering region flush cage with a flow ordering plate. CONSTITUTION:A region of holes 2a in a mesh plate 2 is substantially aligned with the bottom of a flush cage 3, and water is poured into a flush tank 1 through a water inlet 19. And, the surface of a wafer 4 placed in the flush cage 3 is flushed without fail because of close contact of a rib 1b with an edge 3a by water uniformly discharged from many hales formed in the mesh plate 2 disposed in the flush tank 1. The water flow thereafter is discharged from the upper of the flush cage 3 and discharged from the lower discharge hole 1c of the flush tank 1, whereby the outside of the flush cage 3 is flushed. Additionally, another fraction of the water is overflowed from the upper of the flush tank 1.
JP17012487A 1987-07-07 1987-07-07 Flush tank Pending JPS6413729A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17012487A JPS6413729A (en) 1987-07-07 1987-07-07 Flush tank

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17012487A JPS6413729A (en) 1987-07-07 1987-07-07 Flush tank

Publications (1)

Publication Number Publication Date
JPS6413729A true JPS6413729A (en) 1989-01-18

Family

ID=15899088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17012487A Pending JPS6413729A (en) 1987-07-07 1987-07-07 Flush tank

Country Status (1)

Country Link
JP (1) JPS6413729A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5087114A (en) * 1988-12-12 1992-02-11 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal device wherein the most optimum ratio of spacing between substrates in which the liquid crystal is disposed and before disposing of the liquid crystal is 0.77-0.87
JP2011018780A (en) * 2009-07-09 2011-01-27 Toppan Printing Co Ltd Surface roughening device of build-up substrate insulating layer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5087114A (en) * 1988-12-12 1992-02-11 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal device wherein the most optimum ratio of spacing between substrates in which the liquid crystal is disposed and before disposing of the liquid crystal is 0.77-0.87
JP2011018780A (en) * 2009-07-09 2011-01-27 Toppan Printing Co Ltd Surface roughening device of build-up substrate insulating layer

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