JPS6413724U - - Google Patents
Info
- Publication number
- JPS6413724U JPS6413724U JP1987110231U JP11023187U JPS6413724U JP S6413724 U JPS6413724 U JP S6413724U JP 1987110231 U JP1987110231 U JP 1987110231U JP 11023187 U JP11023187 U JP 11023187U JP S6413724 U JPS6413724 U JP S6413724U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- conductive layer
- semiconductor device
- semiconductor chip
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987110231U JPS6413724U (enExample) | 1987-07-17 | 1987-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987110231U JPS6413724U (enExample) | 1987-07-17 | 1987-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6413724U true JPS6413724U (enExample) | 1989-01-24 |
Family
ID=31347201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987110231U Pending JPS6413724U (enExample) | 1987-07-17 | 1987-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6413724U (enExample) |
-
1987
- 1987-07-17 JP JP1987110231U patent/JPS6413724U/ja active Pending