JPS6413127U - - Google Patents
Info
- Publication number
- JPS6413127U JPS6413127U JP1987106625U JP10662587U JPS6413127U JP S6413127 U JPS6413127 U JP S6413127U JP 1987106625 U JP1987106625 U JP 1987106625U JP 10662587 U JP10662587 U JP 10662587U JP S6413127 U JPS6413127 U JP S6413127U
- Authority
- JP
- Japan
- Prior art keywords
- film
- protective film
- thermosetting
- lead
- insulating coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001681 protective effect Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987106625U JPH0442922Y2 (US20080094685A1-20080424-C00004.png) | 1987-07-10 | 1987-07-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987106625U JPH0442922Y2 (US20080094685A1-20080424-C00004.png) | 1987-07-10 | 1987-07-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6413127U true JPS6413127U (US20080094685A1-20080424-C00004.png) | 1989-01-24 |
| JPH0442922Y2 JPH0442922Y2 (US20080094685A1-20080424-C00004.png) | 1992-10-12 |
Family
ID=31340304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987106625U Expired JPH0442922Y2 (US20080094685A1-20080424-C00004.png) | 1987-07-10 | 1987-07-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442922Y2 (US20080094685A1-20080424-C00004.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02185051A (ja) * | 1989-01-12 | 1990-07-19 | Hitachi Cable Ltd | 両面保護コート型ｔａｂ用テープキャリア |
| JPH0382047A (ja) * | 1989-08-24 | 1991-04-08 | Nec Corp | フィルムキャリヤ半導体装置 |
| US7408242B2 (en) | 2001-05-15 | 2008-08-05 | Oki Electric Industry Co., Ltd. | Carrier with reinforced leads that are to be connected to a chip |
-
1987
- 1987-07-10 JP JP1987106625U patent/JPH0442922Y2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02185051A (ja) * | 1989-01-12 | 1990-07-19 | Hitachi Cable Ltd | 両面保護コート型ｔａｂ用テープキャリア |
| JPH0382047A (ja) * | 1989-08-24 | 1991-04-08 | Nec Corp | フィルムキャリヤ半導体装置 |
| US7408242B2 (en) | 2001-05-15 | 2008-08-05 | Oki Electric Industry Co., Ltd. | Carrier with reinforced leads that are to be connected to a chip |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0442922Y2 (US20080094685A1-20080424-C00004.png) | 1992-10-12 |
