JPS6412559A - Substrate of excellent thermal conductivity - Google Patents

Substrate of excellent thermal conductivity

Info

Publication number
JPS6412559A
JPS6412559A JP16905487A JP16905487A JPS6412559A JP S6412559 A JPS6412559 A JP S6412559A JP 16905487 A JP16905487 A JP 16905487A JP 16905487 A JP16905487 A JP 16905487A JP S6412559 A JPS6412559 A JP S6412559A
Authority
JP
Japan
Prior art keywords
substrate
thermal conductivity
type composite
particle dispersion
dispersion type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16905487A
Other languages
Japanese (ja)
Other versions
JPH0834265B2 (en
Inventor
Makoto Shirokane
Masako Nakabashi
Tatsuo Yamazaki
Hiromitsu Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP16905487A priority Critical patent/JPH0834265B2/en
Publication of JPS6412559A publication Critical patent/JPS6412559A/en
Publication of JPH0834265B2 publication Critical patent/JPH0834265B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To protect a ceramic against cracks so as to obtain a substrate of good thermal conductivity which is excellent in heat dissipation and thermal fatigue property by a method wherein a particle dispersion type composite material of porosity is bonded to a good thermal conductivity ceramic through the intermediary of a brazing material layer 0.5-10mum thick. CONSTITUTION:An AlN substrate 11 of aluminum nitride, silicon carbide and the like is used as a good thermal conductivity ceramic of a semiconductor module substrate 14 and a porous particle dispersion type composite material 12 is bonded to the substrate 11 through the intermediary of a brazing material layer 13 0.5-10mum thick. And, the particle dispersion type composite material 12 is composed of matrix metal such as aluminum or copper. A void ratio and a particle dispersed amount of the particle dispersion type composite material 12 are made to be less than 15 volume % and 1-12 volume % respectively. And, the brazing material layer 13 consists of one of metal alloys such as Ag- Cu-Ti, Ag-Ti, Cu-Mn, and Al-Si. Thereby, the semiconductor module substrate 14 and others are improved in a heat dissipation and a thermal fatigue property.
JP16905487A 1987-07-07 1987-07-07 Good thermal conductive substrate Expired - Lifetime JPH0834265B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16905487A JPH0834265B2 (en) 1987-07-07 1987-07-07 Good thermal conductive substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16905487A JPH0834265B2 (en) 1987-07-07 1987-07-07 Good thermal conductive substrate

Publications (2)

Publication Number Publication Date
JPS6412559A true JPS6412559A (en) 1989-01-17
JPH0834265B2 JPH0834265B2 (en) 1996-03-29

Family

ID=15879480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16905487A Expired - Lifetime JPH0834265B2 (en) 1987-07-07 1987-07-07 Good thermal conductive substrate

Country Status (1)

Country Link
JP (1) JPH0834265B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0422558A2 (en) * 1989-10-09 1991-04-17 Mitsubishi Materials Corporation Ceramic substrate used for fabricating electric or electronic circuit
EP0455229A2 (en) * 1990-05-02 1991-11-06 Mitsubishi Materials Corporation Ceramic substrate used for fabricating electric or electronic circuit
EP0822736A1 (en) * 1995-04-19 1998-02-04 Komatsu Ltd. Electrode for plasma arc torch

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0422558A2 (en) * 1989-10-09 1991-04-17 Mitsubishi Materials Corporation Ceramic substrate used for fabricating electric or electronic circuit
EP1020914A2 (en) * 1989-10-09 2000-07-19 Mitsubishi Materials Corporation Ceramic substrate used for fabricating electric or electronic circuit
EP0455229A2 (en) * 1990-05-02 1991-11-06 Mitsubishi Materials Corporation Ceramic substrate used for fabricating electric or electronic circuit
EP0822736A1 (en) * 1995-04-19 1998-02-04 Komatsu Ltd. Electrode for plasma arc torch
EP0822736A4 (en) * 1995-04-19 1998-05-06 Komatsu Mfg Co Ltd Electrode for plasma arc torch
US5908567A (en) * 1995-04-19 1999-06-01 Komatsu Ltd. Electrode for plasma arc torch

Also Published As

Publication number Publication date
JPH0834265B2 (en) 1996-03-29

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