JPS6411908A - Binder for injection molding - Google Patents
Binder for injection moldingInfo
- Publication number
- JPS6411908A JPS6411908A JP62166297A JP16629787A JPS6411908A JP S6411908 A JPS6411908 A JP S6411908A JP 62166297 A JP62166297 A JP 62166297A JP 16629787 A JP16629787 A JP 16629787A JP S6411908 A JPS6411908 A JP S6411908A
- Authority
- JP
- Japan
- Prior art keywords
- binder
- polyoxyalkylene
- injection molding
- compound
- series polyether
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE:To improve moldability, degreasing property and sintering property by using polyoxyalkylene series polyether as binder. CONSTITUTION:The binder is blended in metal powder or ceramic powder to make compound and this compound is subjected to injection molding by applying to an injection molding machine and next, after removing the binder (degrease), the degreased molding material is calcined to obtain the product. In this case, the binder composing of the polyoxyalkylene series polyether is used. As the polyoxyalkylene series polyether, polyoxyalkylene condensate, etc., of compound of polyethylene glycol, alcohol, single nucleus phenol, polyamine, etc., is exemplified. In this binder, besides the polyoxyalkylene series polyether, suitable quantity of wax, fatty acid, fat and oil, metallic soap, etc., can be blended as auxiliary component.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62166297A JPH0686609B2 (en) | 1987-07-03 | 1987-07-03 | Binder for injection molding |
US07/211,756 US4898902A (en) | 1987-07-03 | 1988-06-27 | Binder composition for injection molding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62166297A JPH0686609B2 (en) | 1987-07-03 | 1987-07-03 | Binder for injection molding |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6411908A true JPS6411908A (en) | 1989-01-17 |
JPH0686609B2 JPH0686609B2 (en) | 1994-11-02 |
Family
ID=15828731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62166297A Expired - Fee Related JPH0686609B2 (en) | 1987-07-03 | 1987-07-03 | Binder for injection molding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0686609B2 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01301805A (en) * | 1988-05-31 | 1989-12-06 | Adeka Fine Chem Kk | Binder composition for injection molding |
JPH0421703A (en) * | 1990-02-06 | 1992-01-24 | Sanyo Chem Ind Ltd | Moldable composition and manufacture of sintered body |
JPH05186679A (en) * | 1991-06-07 | 1993-07-27 | Nalco Chem Co | Ethylene oxide/propylene oxide block as green binder for ceramic |
JP2005350332A (en) * | 2004-06-14 | 2005-12-22 | Sekisui Chem Co Ltd | Thermally disappearing resin particles and method for producing the same |
WO2006100806A1 (en) | 2005-03-23 | 2006-09-28 | Sekisui Chemical Co., Ltd. | Thermally disappearing resin particle |
JP2007168837A (en) * | 2005-12-21 | 2007-07-05 | Toyo Seikan Kaisha Ltd | Heat sealing device |
CN103381481A (en) * | 2012-05-03 | 2013-11-06 | 湖南科技大学 | Diamond fiber, as well as manufacturing method and application thereof |
US8687473B2 (en) | 2008-11-21 | 2014-04-01 | International Business Machines Corporation | Overwrite control for data in tape recording apparatus |
CN111826540A (en) * | 2020-07-21 | 2020-10-27 | 丽水学院 | MAX phase metal ceramic injection molding process |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6134101A (en) * | 1984-07-25 | 1986-02-18 | Sumitomo Special Metals Co Ltd | Molding improving agent of alloy powder for permanent magnet |
JPS6311562A (en) * | 1986-07-02 | 1988-01-19 | 日産自動車株式会社 | Material for injection forming |
-
1987
- 1987-07-03 JP JP62166297A patent/JPH0686609B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6134101A (en) * | 1984-07-25 | 1986-02-18 | Sumitomo Special Metals Co Ltd | Molding improving agent of alloy powder for permanent magnet |
JPS6311562A (en) * | 1986-07-02 | 1988-01-19 | 日産自動車株式会社 | Material for injection forming |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01301805A (en) * | 1988-05-31 | 1989-12-06 | Adeka Fine Chem Kk | Binder composition for injection molding |
JPH0421703A (en) * | 1990-02-06 | 1992-01-24 | Sanyo Chem Ind Ltd | Moldable composition and manufacture of sintered body |
JPH05186679A (en) * | 1991-06-07 | 1993-07-27 | Nalco Chem Co | Ethylene oxide/propylene oxide block as green binder for ceramic |
JP2005350332A (en) * | 2004-06-14 | 2005-12-22 | Sekisui Chem Co Ltd | Thermally disappearing resin particles and method for producing the same |
WO2006100806A1 (en) | 2005-03-23 | 2006-09-28 | Sekisui Chemical Co., Ltd. | Thermally disappearing resin particle |
EP1862482A1 (en) * | 2005-03-23 | 2007-12-05 | Sekisui Chemical Co., Ltd. | Thermally disappearing resin particle |
EP1862482A4 (en) * | 2005-03-23 | 2010-05-26 | Sekisui Chemical Co Ltd | Thermally disappearing resin particle |
JP2007168837A (en) * | 2005-12-21 | 2007-07-05 | Toyo Seikan Kaisha Ltd | Heat sealing device |
US8687473B2 (en) | 2008-11-21 | 2014-04-01 | International Business Machines Corporation | Overwrite control for data in tape recording apparatus |
CN103381481A (en) * | 2012-05-03 | 2013-11-06 | 湖南科技大学 | Diamond fiber, as well as manufacturing method and application thereof |
CN111826540A (en) * | 2020-07-21 | 2020-10-27 | 丽水学院 | MAX phase metal ceramic injection molding process |
Also Published As
Publication number | Publication date |
---|---|
JPH0686609B2 (en) | 1994-11-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |