JPS6411908A - Binder for injection molding - Google Patents

Binder for injection molding

Info

Publication number
JPS6411908A
JPS6411908A JP62166297A JP16629787A JPS6411908A JP S6411908 A JPS6411908 A JP S6411908A JP 62166297 A JP62166297 A JP 62166297A JP 16629787 A JP16629787 A JP 16629787A JP S6411908 A JPS6411908 A JP S6411908A
Authority
JP
Japan
Prior art keywords
binder
polyoxyalkylene
injection molding
compound
series polyether
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62166297A
Other languages
Japanese (ja)
Other versions
JPH0686609B2 (en
Inventor
Tomoaki Nagai
Takeyuki Yamanashi
Hideo Hachimori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Adeka Fine Chemical Co Ltd
Original Assignee
Adeka Fine Chemical Co Ltd
Asahi Denka Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Fine Chemical Co Ltd, Asahi Denka Kogyo KK filed Critical Adeka Fine Chemical Co Ltd
Priority to JP62166297A priority Critical patent/JPH0686609B2/en
Priority to US07/211,756 priority patent/US4898902A/en
Publication of JPS6411908A publication Critical patent/JPS6411908A/en
Publication of JPH0686609B2 publication Critical patent/JPH0686609B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To improve moldability, degreasing property and sintering property by using polyoxyalkylene series polyether as binder. CONSTITUTION:The binder is blended in metal powder or ceramic powder to make compound and this compound is subjected to injection molding by applying to an injection molding machine and next, after removing the binder (degrease), the degreased molding material is calcined to obtain the product. In this case, the binder composing of the polyoxyalkylene series polyether is used. As the polyoxyalkylene series polyether, polyoxyalkylene condensate, etc., of compound of polyethylene glycol, alcohol, single nucleus phenol, polyamine, etc., is exemplified. In this binder, besides the polyoxyalkylene series polyether, suitable quantity of wax, fatty acid, fat and oil, metallic soap, etc., can be blended as auxiliary component.
JP62166297A 1987-07-03 1987-07-03 Binder for injection molding Expired - Fee Related JPH0686609B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP62166297A JPH0686609B2 (en) 1987-07-03 1987-07-03 Binder for injection molding
US07/211,756 US4898902A (en) 1987-07-03 1988-06-27 Binder composition for injection molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62166297A JPH0686609B2 (en) 1987-07-03 1987-07-03 Binder for injection molding

Publications (2)

Publication Number Publication Date
JPS6411908A true JPS6411908A (en) 1989-01-17
JPH0686609B2 JPH0686609B2 (en) 1994-11-02

Family

ID=15828731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62166297A Expired - Fee Related JPH0686609B2 (en) 1987-07-03 1987-07-03 Binder for injection molding

Country Status (1)

Country Link
JP (1) JPH0686609B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01301805A (en) * 1988-05-31 1989-12-06 Adeka Fine Chem Kk Binder composition for injection molding
JPH0421703A (en) * 1990-02-06 1992-01-24 Sanyo Chem Ind Ltd Moldable composition and manufacture of sintered body
JPH05186679A (en) * 1991-06-07 1993-07-27 Nalco Chem Co Ethylene oxide/propylene oxide block as green binder for ceramic
JP2005350332A (en) * 2004-06-14 2005-12-22 Sekisui Chem Co Ltd Thermally disappearing resin particles and method for producing the same
WO2006100806A1 (en) 2005-03-23 2006-09-28 Sekisui Chemical Co., Ltd. Thermally disappearing resin particle
JP2007168837A (en) * 2005-12-21 2007-07-05 Toyo Seikan Kaisha Ltd Heat sealing device
CN103381481A (en) * 2012-05-03 2013-11-06 湖南科技大学 Diamond fiber, as well as manufacturing method and application thereof
US8687473B2 (en) 2008-11-21 2014-04-01 International Business Machines Corporation Overwrite control for data in tape recording apparatus
CN111826540A (en) * 2020-07-21 2020-10-27 丽水学院 MAX phase metal ceramic injection molding process

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6134101A (en) * 1984-07-25 1986-02-18 Sumitomo Special Metals Co Ltd Molding improving agent of alloy powder for permanent magnet
JPS6311562A (en) * 1986-07-02 1988-01-19 日産自動車株式会社 Material for injection forming

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6134101A (en) * 1984-07-25 1986-02-18 Sumitomo Special Metals Co Ltd Molding improving agent of alloy powder for permanent magnet
JPS6311562A (en) * 1986-07-02 1988-01-19 日産自動車株式会社 Material for injection forming

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01301805A (en) * 1988-05-31 1989-12-06 Adeka Fine Chem Kk Binder composition for injection molding
JPH0421703A (en) * 1990-02-06 1992-01-24 Sanyo Chem Ind Ltd Moldable composition and manufacture of sintered body
JPH05186679A (en) * 1991-06-07 1993-07-27 Nalco Chem Co Ethylene oxide/propylene oxide block as green binder for ceramic
JP2005350332A (en) * 2004-06-14 2005-12-22 Sekisui Chem Co Ltd Thermally disappearing resin particles and method for producing the same
WO2006100806A1 (en) 2005-03-23 2006-09-28 Sekisui Chemical Co., Ltd. Thermally disappearing resin particle
EP1862482A1 (en) * 2005-03-23 2007-12-05 Sekisui Chemical Co., Ltd. Thermally disappearing resin particle
EP1862482A4 (en) * 2005-03-23 2010-05-26 Sekisui Chemical Co Ltd Thermally disappearing resin particle
JP2007168837A (en) * 2005-12-21 2007-07-05 Toyo Seikan Kaisha Ltd Heat sealing device
US8687473B2 (en) 2008-11-21 2014-04-01 International Business Machines Corporation Overwrite control for data in tape recording apparatus
CN103381481A (en) * 2012-05-03 2013-11-06 湖南科技大学 Diamond fiber, as well as manufacturing method and application thereof
CN111826540A (en) * 2020-07-21 2020-10-27 丽水学院 MAX phase metal ceramic injection molding process

Also Published As

Publication number Publication date
JPH0686609B2 (en) 1994-11-02

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees