JPS6411539U - - Google Patents
Info
- Publication number
- JPS6411539U JPS6411539U JP1987103795U JP10379587U JPS6411539U JP S6411539 U JPS6411539 U JP S6411539U JP 1987103795 U JP1987103795 U JP 1987103795U JP 10379587 U JP10379587 U JP 10379587U JP S6411539 U JPS6411539 U JP S6411539U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- bump electrodes
- light transmission
- junctions
- melted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Electric Clocks (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987103795U JPH0517884Y2 (da) | 1987-07-08 | 1987-07-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987103795U JPH0517884Y2 (da) | 1987-07-08 | 1987-07-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6411539U true JPS6411539U (da) | 1989-01-20 |
| JPH0517884Y2 JPH0517884Y2 (da) | 1993-05-13 |
Family
ID=31334944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987103795U Expired - Lifetime JPH0517884Y2 (da) | 1987-07-08 | 1987-07-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0517884Y2 (da) |
-
1987
- 1987-07-08 JP JP1987103795U patent/JPH0517884Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0517884Y2 (da) | 1993-05-13 |