JPH0167749U - - Google Patents
Info
- Publication number
- JPH0167749U JPH0167749U JP1987161462U JP16146287U JPH0167749U JP H0167749 U JPH0167749 U JP H0167749U JP 1987161462 U JP1987161462 U JP 1987161462U JP 16146287 U JP16146287 U JP 16146287U JP H0167749 U JPH0167749 U JP H0167749U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- electrode pattern
- solder bump
- connection part
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 4
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
Landscapes
- Wire Bonding (AREA)
- Electric Clocks (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161462U JPH0167749U (da) | 1987-10-23 | 1987-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161462U JPH0167749U (da) | 1987-10-23 | 1987-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0167749U true JPH0167749U (da) | 1989-05-01 |
Family
ID=31444419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987161462U Pending JPH0167749U (da) | 1987-10-23 | 1987-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0167749U (da) |
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1987
- 1987-10-23 JP JP1987161462U patent/JPH0167749U/ja active Pending