JPS6411353A - Electronic circuit device - Google Patents

Electronic circuit device

Info

Publication number
JPS6411353A
JPS6411353A JP16804787A JP16804787A JPS6411353A JP S6411353 A JPS6411353 A JP S6411353A JP 16804787 A JP16804787 A JP 16804787A JP 16804787 A JP16804787 A JP 16804787A JP S6411353 A JPS6411353 A JP S6411353A
Authority
JP
Japan
Prior art keywords
substrate
connection part
common terminal
resin
electronic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16804787A
Other languages
Japanese (ja)
Inventor
Yoshiro Takemoto
Yoshiyuki Kubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP16804787A priority Critical patent/JPS6411353A/en
Publication of JPS6411353A publication Critical patent/JPS6411353A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To connect a common terminal to a substrate surely and simply by a method wherein the common terminal is clamped mechanically to the substrate and a connection part for them is molded by using a resin. CONSTITUTION:An F-shaped clamping connection part 12a is formed at the tip of a common terminal 12; a conductor part of a substrate 11 is inserted forcibly into a gap between a pair of tongues of this clamping connection part 12a; as a result, both parts are connected. If this connection part is molded by using a thermoset resin 13 such as an epoxy resin or the like, the common terminal 12 can be fixed more firmly to the substrate 11 due to a contractile force generated while the resin 13 is hardended.
JP16804787A 1987-07-06 1987-07-06 Electronic circuit device Pending JPS6411353A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16804787A JPS6411353A (en) 1987-07-06 1987-07-06 Electronic circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16804787A JPS6411353A (en) 1987-07-06 1987-07-06 Electronic circuit device

Publications (1)

Publication Number Publication Date
JPS6411353A true JPS6411353A (en) 1989-01-13

Family

ID=15860842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16804787A Pending JPS6411353A (en) 1987-07-06 1987-07-06 Electronic circuit device

Country Status (1)

Country Link
JP (1) JPS6411353A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839018A (en) * 1981-09-02 1983-03-07 Mitsubishi Electric Corp Assembling method of hybrid integrated circuit
JPS60194550A (en) * 1984-03-16 1985-10-03 Nec Corp Hybrid ic
JPS625645B2 (en) * 1983-10-06 1987-02-05 Kawasaki Seitetsu Kk

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839018A (en) * 1981-09-02 1983-03-07 Mitsubishi Electric Corp Assembling method of hybrid integrated circuit
JPS625645B2 (en) * 1983-10-06 1987-02-05 Kawasaki Seitetsu Kk
JPS60194550A (en) * 1984-03-16 1985-10-03 Nec Corp Hybrid ic

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