JPS6397523U - - Google Patents
Info
- Publication number
- JPS6397523U JPS6397523U JP1986193174U JP19317486U JPS6397523U JP S6397523 U JPS6397523 U JP S6397523U JP 1986193174 U JP1986193174 U JP 1986193174U JP 19317486 U JP19317486 U JP 19317486U JP S6397523 U JPS6397523 U JP S6397523U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- pot
- plunger
- mold
- cull
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/58—Details
- B29C45/586—Injection or transfer plungers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
第1図は本考案の一実施例を示す平面図、第2
図は第1図のA―A線に沿う断面図、第3図は第
1図の装置におけるプランジヤの部分拡大斜視図
、第4図はそのプランジヤの底面図、第5図は従
来の樹脂モールド装置の平面図、第6図は第5図
のB―B線に沿う断面図である。
11…上金型、12…ポツト、13…下金型、
14…カル、15…樹脂タブレツト、16…プラ
ンジヤ、16a…ヘツド部、16b…渦巻溝、1
7…ランナ、18…ゲート、19…キヤビテイ。
Figure 1 is a plan view showing one embodiment of the present invention;
The figure is a sectional view taken along line A-A in Figure 1, Figure 3 is a partially enlarged perspective view of the plunger in the device of Figure 1, Figure 4 is a bottom view of the plunger, and Figure 5 is a conventional resin mold. The plan view of the device, FIG. 6, is a sectional view taken along line BB in FIG. 5. 11... Upper mold, 12... Pot, 13... Lower mold,
14... Cull, 15... Resin tablet, 16... Plunger, 16a... Head part, 16b... Spiral groove, 1
7...Runner, 18...Gate, 19...Cavity.
Claims (1)
熱しながらプランジヤで加圧し、溶融した樹脂を
金型のカルからランナ、ゲートを介して被樹脂モ
ールド部品のあるキヤビテイに圧送する装置にお
いて、前記プランジヤのヘツド部に、前記ポツト
で加圧される樹脂タブレツトにポツトの中心線を
中心に回転力を付与する渦巻状の溝或いは突起を
形成すると共に、前記ランナを前記カルの周縁か
らその接線方向に延びるように形成したことを特
徴とする樹脂モールド装置。 In a device that pressurizes a resin tablet supplied to a pot of a mold with a plunger while heating it, and force-feeds the molten resin from the cull of the mold through a runner and a gate to a cavity in which a molded part to be resin is located, the plunger is heated. A spiral groove or protrusion is formed in the head portion to apply a rotational force about the center line of the pot to the resin tablet pressurized by the pot, and the runner is formed to extend from the periphery of the cull in a tangential direction thereof. A resin molding device characterized in that it is formed as follows.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986193174U JPS6397523U (en) | 1986-12-15 | 1986-12-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986193174U JPS6397523U (en) | 1986-12-15 | 1986-12-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6397523U true JPS6397523U (en) | 1988-06-24 |
Family
ID=31148952
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986193174U Pending JPS6397523U (en) | 1986-12-15 | 1986-12-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6397523U (en) |
-
1986
- 1986-12-15 JP JP1986193174U patent/JPS6397523U/ja active Pending