JPS6397240U - - Google Patents
Info
- Publication number
- JPS6397240U JPS6397240U JP1986191533U JP19153386U JPS6397240U JP S6397240 U JPS6397240 U JP S6397240U JP 1986191533 U JP1986191533 U JP 1986191533U JP 19153386 U JP19153386 U JP 19153386U JP S6397240 U JPS6397240 U JP S6397240U
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- heat dissipation
- entire surface
- conductor
- except
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986191533U JPS6397240U (US07709020-20100504-C00041.png) | 1986-12-12 | 1986-12-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986191533U JPS6397240U (US07709020-20100504-C00041.png) | 1986-12-12 | 1986-12-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6397240U true JPS6397240U (US07709020-20100504-C00041.png) | 1988-06-23 |
Family
ID=31145762
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986191533U Pending JPS6397240U (US07709020-20100504-C00041.png) | 1986-12-12 | 1986-12-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6397240U (US07709020-20100504-C00041.png) |
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1986
- 1986-12-12 JP JP1986191533U patent/JPS6397240U/ja active Pending