JPS6395261U - - Google Patents

Info

Publication number
JPS6395261U
JPS6395261U JP1986189793U JP18979386U JPS6395261U JP S6395261 U JPS6395261 U JP S6395261U JP 1986189793 U JP1986189793 U JP 1986189793U JP 18979386 U JP18979386 U JP 18979386U JP S6395261 U JPS6395261 U JP S6395261U
Authority
JP
Japan
Prior art keywords
light emitting
emitting device
light source
source light
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986189793U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986189793U priority Critical patent/JPS6395261U/ja
Publication of JPS6395261U publication Critical patent/JPS6395261U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示すライン光源発
光装置の断面図、第２図は指向性の広いＬＥＤの
側面図、第３図は指向性の鋭いＬＥＤの側面図、
第４図は第２図のＬＥＤの指向特性図、第５図は
第３図のＬＥＤの指向特性図、第６図は本考案の
ライン光源発光装置の光強度分布特性図、第７図
は従来のライン光源発光装置の光強度分布特性図
、第８図は本考案の他の実施例を示す面光源発光
装置の概略斜視図、第９図は第８図の―線断
面図、第１０図は第８図の発光装置のＬＥＤの配
置図である。 １……ライン光源発光装置、２，１２……指向
性の広いＬＥＤ、３，１３……指向性の鋭いＬＥ
Ｄ、４，１４……基板、５，１５……ケース、６
，１６……ガラス、７，７′……セラミツクヘツ
ダー、８，８′……ＬＥＤチツプ、９，９′……
配線用金線、１０，１０′……エポキシ系樹脂、
１１……面光源発光装置。

Claims (1)

  1. 【実用新案登録請求の範囲】 単体の発光体を複数個配設した光源発光装置に
    おいて、 指向性の異なる複数種類の単体の発光体を用い
    、前記光源発光装置の外側部に中央部に比べて指
    向性の鋭い発光体を配置することを特徴とする単
    体の発光を複数個有する光源発光装置。
JP1986189793U 1986-12-11 1986-12-11 Pending JPS6395261U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986189793U JPS6395261U (ja) 1986-12-11 1986-12-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986189793U JPS6395261U (ja) 1986-12-11 1986-12-11

Publications (1)

Publication Number Publication Date
JPS6395261U true JPS6395261U (ja) 1988-06-20

Family

ID=31142407

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986189793U Pending JPS6395261U (ja) 1986-12-11 1986-12-11

Country Status (1)

Country Link
JP (1) JPS6395261U (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0492660U (ja) * 1990-12-28 1992-08-12
JP2009260174A (ja) * 2008-04-21 2009-11-05 Sharp Corp 発光装置、バックライト装置および液晶表示装置
WO2010098349A1 (ja) * 2009-02-25 2010-09-02 ローム株式会社 Ｌｅｄランプ
WO2023008158A1 (ja) * 2021-07-29 2023-02-02 株式会社日立ハイテク 吸光光度測定装置およびそれを備えた生化学分析装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0492660U (ja) * 1990-12-28 1992-08-12
JP2009260174A (ja) * 2008-04-21 2009-11-05 Sharp Corp 発光装置、バックライト装置および液晶表示装置
WO2010098349A1 (ja) * 2009-02-25 2010-09-02 ローム株式会社 Ｌｅｄランプ
JP2010198919A (ja) * 2009-02-25 2010-09-09 Rohm Co Ltd Ｌｅｄランプ
CN102333987A (zh) * 2009-02-25 2012-01-25 罗姆股份有限公司 Led灯
WO2023008158A1 (ja) * 2021-07-29 2023-02-02 株式会社日立ハイテク 吸光光度測定装置およびそれを備えた生化学分析装置

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