JPS6393646U - - Google Patents
Info
- Publication number
- JPS6393646U JPS6393646U JP1986189362U JP18936286U JPS6393646U JP S6393646 U JPS6393646 U JP S6393646U JP 1986189362 U JP1986189362 U JP 1986189362U JP 18936286 U JP18936286 U JP 18936286U JP S6393646 U JPS6393646 U JP S6393646U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor pellet
- semiconductor
- molded
- covered
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986189362U JPS6393646U (Direct) | 1986-12-08 | 1986-12-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986189362U JPS6393646U (Direct) | 1986-12-08 | 1986-12-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6393646U true JPS6393646U (Direct) | 1988-06-17 |
Family
ID=31141593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986189362U Pending JPS6393646U (Direct) | 1986-12-08 | 1986-12-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6393646U (Direct) |
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1986
- 1986-12-08 JP JP1986189362U patent/JPS6393646U/ja active Pending