JPS6393548A - Monitoring system for manufacturing equipment - Google Patents

Monitoring system for manufacturing equipment

Info

Publication number
JPS6393548A
JPS6393548A JP61238075A JP23807586A JPS6393548A JP S6393548 A JPS6393548 A JP S6393548A JP 61238075 A JP61238075 A JP 61238075A JP 23807586 A JP23807586 A JP 23807586A JP S6393548 A JPS6393548 A JP S6393548A
Authority
JP
Japan
Prior art keywords
value
deviation
result
manufacturing equipment
allowable limit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61238075A
Other languages
Japanese (ja)
Other versions
JPH0761599B2 (en
Inventor
Toshimasa Harada
原田 敏正
Jun Nakazato
中里 純
Tsutomu Tsuyama
津山 努
Takemasa Iwasaki
岩崎 武正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP23807586A priority Critical patent/JPH0761599B2/en
Publication of JPS6393548A publication Critical patent/JPS6393548A/en
Publication of JPH0761599B2 publication Critical patent/JPH0761599B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30Computing systems specially adapted for manufacturing

Landscapes

  • General Factory Administration (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Machine Tool Sensing Apparatuses (AREA)

Abstract

PURPOSE:To detect the fine variation of the processing result with high sensitivity by obtaining the deviation from the management center value which is previously set for each processing result and adding said deviation onto the accumulative deviation value and comparing said deviation value with the upper and lower allowable limit values which are obtained from the number of processing results and the center value variation allowable limit width value. CONSTITUTION:A processing result is input and the deviation is obtained in the first calculator 103, and the accumulation sum is obtained in an accumulator, and the number of input of the result is obtained in a counter 102. The upper and lower allowable limit values of the accumulation sum are obtained in the second calculator 105, and the accumulation sum and the limit value are compared in a comparator 106. When the comparison result is within the both limit values, the accumulation sum and the limit value are renewed to each prescribed value, and when the comparison result is outside the both limit values, the counter 102 and an accumulator 104 are reset, and the circuit state is initialized. With such constitution, even if the variation tendency is not constant, and the average value varies more finely in comparison with the magnitude of the dispersion, the state can be detected with high sensitivity.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、一般的には製造設備の監視方式に係り、特に
半導体ウェハの処理結果からウェハ処理条件の変動を検
知するのに好適とされた製造設備監視方式に関するもの
である。
[Detailed Description of the Invention] [Field of Industrial Application] The present invention generally relates to a monitoring method for manufacturing equipment, and is particularly suitable for detecting changes in wafer processing conditions from the processing results of semiconductor wafers. This relates to a manufacturing equipment monitoring method.

〔従来の技術〕[Conventional technology]

製造設備の変化を把握し、ワークなどの加工精度等の品
質を一定の許容範囲から外れないように管理する方法と
しては、これまでに例えば特開昭50−15985号公
報に示されたものが知られている。
As a method of grasping changes in manufacturing equipment and managing quality such as machining accuracy of workpieces so that they do not deviate from a certain tolerance range, for example, the method shown in Japanese Patent Application Laid-Open No. 15985-1985 is known. Are known.

この方法は第4図に示すように、製造設備によるワーク
の処理結果、例えば加工寸法xl(t;ワークロットの
着工順)等のデータ401が、通常用いられる統計的上
方管理限界(UCL) 403および下方管理限界(L
CL) 404により管理されるようになっている。更
に、直前のロットに至るまでのワークの処理結果の変動
傾向を回帰直線405およびバラツキ(σm)406に
より近似的に表現し、次期着工のワークの予測上限値4
08および予測下限値409を求め、これら予測(直が
IIcL 403 、あるいはLCL 404より外れ
ているか否かが管理されるようになっている。管理外れ
が生じた場合には、製造設備のワーク処理条件の調整量
が直前のロフトまでのデータを用いて算出されたうえ製
造設備のワーク処理条件の変更を行なった後は、上述し
た方法を同様に繰り返すことによって、製造設備の条件
変動や経時変化等の管理が行なわれるようになっている
ものである。
In this method, as shown in FIG. 4, data 401 such as processing results of workpieces by manufacturing equipment, for example, processing dimensions xl (t; work start order of work lots), etc., are determined by a commonly used statistical upper control limit (UCL) 403. and the lower control limit (L
CL) 404. Furthermore, the fluctuation trend of the processing results of the workpieces up to the immediately preceding lot is approximately expressed by a regression line 405 and the variation (σm) 406, and the predicted upper limit value 4 of the workpieces to be started next time is calculated.
08 and predicted lower limit value 409 are calculated, and it is managed whether these predictions (direction) deviate from IIcL 403 or LCL 404. If a deviation from control occurs, work processing of the manufacturing equipment After the amount of adjustment of the conditions has been calculated using the data up to the previous loft and the workpiece processing conditions of the manufacturing equipment have been changed, the above method can be repeated in the same way to adjust the condition fluctuations and changes over time of the manufacturing equipment. etc. are managed.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ところで、例えば半導体デバイスの製造を行なううえで
は材料や環境、更には半導製造設備の状態等、管理を困
難にする変動要因が極めて多く存在するものとなってい
る。このため、半導体製造設備により処理されたパター
ン転写後の寸法等のウェハ処理結果は通常大きなバラツ
キを持ち、変動も一定した傾向を示さない場合が多いが
、その反面、平均値が管理中心値より微小に変化した場
合には、半導体デバイスの特性不良や機能不良の増大に
結び付く可能性が非常に高くなっている。
By the way, when manufacturing semiconductor devices, for example, there are an extremely large number of variable factors that make management difficult, such as materials, environment, and even the state of semiconductor manufacturing equipment. For this reason, wafer processing results such as dimensions after pattern transfer processed by semiconductor manufacturing equipment usually have large variations, and the fluctuations often do not show a constant trend. If there is a minute change, there is a very high possibility that it will lead to an increase in defective characteristics or malfunctions of semiconductor devices.

即ち、半導体製造設備の監視を行なうには、バラツキ幅
の大きさに比して微小な平均値の変化を感度良好にして
検出することが必要となっている。
That is, in order to monitor semiconductor manufacturing equipment, it is necessary to detect changes in the average value, which are minute compared to the magnitude of the variation width, with good sensitivity.

上記従来技術による場合、変動が直線的な傾向で増加、
あるいは減少する場合には、微小な平均値の変化を感度
良好に検出することが可能であるが、変動傾向が必ずし
も一定していない場合には、微小な平均値の変化を検出
するのに適合したちのとは云えないものとなっている。
In the case of the above conventional technology, the fluctuation increases in a linear trend,
Or, if it decreases, it is possible to detect small changes in the average value with good sensitivity, but if the fluctuation trend is not necessarily constant, it is suitable for detecting small changes in the average value. It has become something that cannot be said to be the same.

本発明の目的は、変動傾向が必ずしも一定しておらず、
しかもバラツキの大きさに比し平均値の微小な変化の高
感度検出が可能とされた製造設備監視方式を捉供するに
ある。
The purpose of the present invention is to prevent fluctuation trends from being necessarily constant.
Moreover, the present invention provides a manufacturing equipment monitoring method that is capable of highly sensitive detection of minute changes in the average value compared to the magnitude of variation.

〔問題点を解決するための手段〕[Means for solving problems]

上記目的は、基本的にはワークの処理結果X。 The above purpose is basically the processing result of the workpiece.

(作用〕 ワークの処理結果xtが平均値に、標準偏差σの正規分
布に従ってランダムにばらつくと仮定しまた、ワークの
処理結果X、の平均値がΔにだけ増加、あるいは減少し
た場合、累積和Stは平均値t・Δk、あるいは−t・
Δに、標準偏差tσの正規分布に従う6 tの増加に伴
い平均値がt・Δにといった具合にtに比例して増加し
て行くのに対し、標準偏差は t・σといった具合にt
の平方根でしか増加しないことから、累積が行なねれな
い場合に比し、累積が進むのに従い分布間の分離度が向
上される結果、バラツキの大きさに比し微小な平均値の
変化も容易に検出することが可能となるものである。
(Effect) Assuming that the average value of the workpiece processing result xt varies randomly according to a normal distribution with standard deviation σ, and if the average value of the workpiece processing result X increases or decreases by Δ, then the cumulative sum St is the average value t・Δk, or −t・
Δ follows a normal distribution with standard deviation tσ.6 As t increases, the average value increases in proportion to t, such as t・Δ, whereas the standard deviation increases as t・σ, etc.
Since it only increases by the square root of can also be easily detected.

〔実施例〕〔Example〕

以下、本発明を第1図から第4図により説明する。 The present invention will be explained below with reference to FIGS. 1 to 4.

先ず本発明の原理について説明すれば、ワークの処理結
果xtが平均値に、標準偏差σの正規分布に従ってラン
ダムにばらつくと仮定した場合、を 差 t・σの正規分布に従うようになっている。
First, the principle of the present invention will be explained. If it is assumed that the processing result xt of the workpiece is randomly distributed according to the average value and a normal distribution with a standard deviation σ, then xt follows a normal distribution with a difference t·σ.

また、ワークの処理結果Xtの平均値がΔにだけ増力U
、あるいは減少した場合、累積和S、は分布209、あ
るいは分布210として示すように、平均値がt・Δに
あるいは−t・Δに、標準偏差がt・σの正規分布に従
うものとなっている。tの増加に伴い平均値がt・Δに
といった具合にtに比例して増加して行くのに対し、標
準偏差はt・σといった具合にtの平方根でしか増加し
ないことから、累積が行なわれない場合での分布201
〜203に比し、累積が進むのに従い分布間の分離度が
向上されるところとなるものである。このため、バラツ
キの大きさに比し微小な平均値の変化も容易に検出可能
となるわけである。
In addition, the average value of the processing result Xt of the workpiece is increased by only Δ
, or decreases, the cumulative sum S, as shown in distribution 209 or distribution 210, follows a normal distribution with a mean value of t・Δ or −t・Δ and a standard deviation of t・σ. There is. As t increases, the average value increases in proportion to t, such as t・Δ, whereas the standard deviation increases only by the square root of t, such as t・σ, so accumulation is not performed. Distribution 201 when
-203, the degree of separation between distributions is improved as the accumulation progresses. Therefore, even changes in the average value that are minute compared to the magnitude of the dispersion can be easily detected.

ところで、累積和Stを実際の管理に適用するに際して
は平均値の変化が発生したか否かの判断基準が必要であ
るが、この基準の一例としては直線204.205を用
いることが考えられる。直線204゜205はワークの
処理結果xtの平均値が変化していない場合での累積和
Stの分布208と、ワークの処理結果X、の平均値が
Δにだけ増減した場合での累積和S、の分布209.2
10各々との交点、更には分布201 と分布202.
203各々との交点にもとづいて定められたものである
。よって、直vA204゜205間に累積和Stが存在
する場合にはワークの処理結果xtの平均値に変化は発
生していないとして、また、直線204の上側に累積和
Stが存在する場合にはワークの処理結果Xtの平均値
がΔに以上増加したとして、更に直線205の下側に存
在する場合にはワークの処理結果xtの平均値がΔに以
上減少したとしてそれぞれ判定されることになるもので
ある。なお、直線206.207はtの変化に対する分
布209.210各々の中心の推移を示す。
By the way, when applying the cumulative sum St to actual management, a criterion for determining whether or not a change in the average value has occurred is required, and as an example of this criterion, it is possible to use straight lines 204 and 205. Straight lines 204 and 205 represent the distribution 208 of the cumulative sum St when the average value of the workpiece processing results xt has not changed, and the cumulative sum S when the average value of the workpiece processing results X increases or decreases by only Δ. , the distribution of 209.2
10, and further the distributions 201 and 202.
203, respectively. Therefore, if the cumulative sum St exists between the straight line 204 and 205, it is assumed that no change has occurred in the average value of the workpiece processing result xt, and if the cumulative sum St exists above the straight line 204, then If the average value of the workpiece processing results It is something. Note that straight lines 206 and 207 indicate changes in the center of each of the distributions 209 and 210 with respect to changes in t.

さて、本発明に係る基本的な製造設備監視装置について
説明すれば、第1図はその構成を示したものである。こ
れによると全体は累積和演算手段100Aと変動検知演
算手段100 Bよりなるものとなっている。累積和演
算手段100Aでは例えばウェハの処理結果Xtを入力
データとして第1演算器103では(Xt−k)が、ま
た、既述の累積和Stが累積器104で求められると同
時に、処理結果同期信号P、がカウンタ102でカウン
トされることによっては処理結果Xtの人力数tが求め
られるようになっている。処理結果Xtの入力数tにも
とづいてはその累積和Stの上側、下側の許容限界値U
t、Ltが変動検知演算手段100B内の第2演算器1
05で以下のように求められるものである。
Now, to explain the basic manufacturing equipment monitoring device according to the present invention, FIG. 1 shows its configuration. According to this, the entire system consists of cumulative sum calculation means 100A and fluctuation detection calculation means 100B. In the cumulative sum calculating means 100A, for example, the wafer processing result Xt is input data, and the first calculating unit 103 calculates (Xt-k), and at the same time, the cumulative sum St described above is calculated in the accumulator 104, and at the same time, the processing result is synchronized. By counting the signal P by the counter 102, the number of manpower t for the processing result Xt can be determined. Based on the number of inputs t of the processing result Xt, the upper and lower allowable limit values U of the cumulative sum St
t and Lt are the second computing unit 1 in the fluctuation detection computing means 100B.
05 is obtained as follows.

U、=−・Δに−t    ・・・・・・・・・・・・
 fi+Lt”−一・Δに−t   ・・・・・・・・
・・・・ (2+弐(11,(21より求められた上側
、下側の許容限界値U t、 L tは比較器106で
累積器104からの累積和Stと比較されることによっ
て、処理条件の変動の有無が判定されるようになってい
るものである。
U, =-・Δ to -t ・・・・・・・・・・・・
fi+Lt”-1・Δ−t・・・・・・・・・
(2+2(11, (21) The upper and lower allowable limit values U t and L t are compared with the cumulative sum St from the accumulator 104 in the comparator 106, and are then processed. The presence or absence of a change in conditions is determined.

即ち、累積和S1が上側許容限界値Utより大きい場合
には、ウェハの処理結果の平均値は管理中心値よりΔに
以上増加と判定され、また、累積和Stが下側許容限界
値Ltより小さい場合には、ウェハの処理結果の平均値
は管理中心値よりΔに以上減少と判定されるものである
。累積和Stが上側許容限界値U、と下側許容限界値L
tとの間にある場合は、ウェハの処理結果の平均値は変
動していないと判定されるわけである。これらの判定結
果は外部に表示されるが、処理結果の平均値が上側、下
側の何れかに変動している場合は併せてその旨の警告表
示も行なわれるようになっている。なお、カウンター0
2からの入力数tとこれに対する累積和Stを記録して
おく場合は、累積和SLの推移が容易に知れることにな
る。
That is, when the cumulative sum S1 is larger than the upper allowable limit value Ut, it is determined that the average value of the wafer processing results has increased by more than Δ than the control center value, and the cumulative sum St is larger than the lower allowable limit value Lt. If it is small, it is determined that the average value of the wafer processing results is reduced by Δ or more from the control center value. The cumulative sum St is the upper allowable limit value U and the lower allowable limit value L.
If it is between t and t, it is determined that the average value of the wafer processing results has not changed. These determination results are displayed externally, and if the average value of the processing results fluctuates either upward or downward, a warning to that effect is also displayed. In addition, counter 0
If the number t of inputs from 2 and the cumulative sum St corresponding thereto are recorded, the transition of the cumulative sum SL can be easily known.

以上のように処理結果が入力される度に累積和Stと許
容限界値Ut、Ltとが比較されるが、比較結果が許容
限界値U t、 L を内にある限り累積和Stおよび
許容限界値U、、LLは所定に更新されるものとなって
いる。しかしながら、許容限界値Ut、Ltより外れた
場合には比較器106からのリセット要求がリセット信
号発生器101を介しカウンタ102、累積器104を
リセットすることによって、回路状態は初期化されるよ
うになっている。
As described above, each time a processing result is input, the cumulative sum St and the allowable limit values Ut, Lt are compared, but as long as the comparison result is within the allowable limit values Ut, L, the cumulative sum St and the allowable limit are The values U,, LL are updated in a predetermined manner. However, if the value deviates from the allowable limit values Ut and Lt, a reset request from the comparator 106 is sent via the reset signal generator 101 to reset the counter 102 and the accumulator 104, so that the circuit state is initialized. It has become.

次の処理結果が入力された時点から再び同様な処理が繰
り返されるところとなるものである。
The same process is repeated again from the time when the next process result is input.

因みに以上の処理をコンピュータが行なうとしてそのフ
ローを示せば第3図に示すようである。
Incidentally, if the above processing is performed by a computer, the flow is shown in FIG. 3.

即ち、製造設備の監視に先立っては先ず処理301で管
理中心値にや中心値変動許容限界幅値△にの設定、入力
数tおよび累積和SLのゼロ設定といった初期設定が行
なわれるようになっている。初期設定後は処理302と
して半導体製造設備のウェハの処理結果xtの入力が処
理結果周期信号P。
That is, prior to monitoring the manufacturing equipment, initial settings such as setting the management center value, center value variation allowable limit width value Δ, and setting the number of inputs t and cumulative sum SL to zero are performed in step 301. ing. After the initial setting, in step 302, the processing result xt of the wafer of the semiconductor manufacturing equipment is input as the processing result periodic signal P.

を割込みとして開始されるが、処理302に引き続いて
は処理303によって入力データ数tが+1更新される
ものとなっている。この後は処理304゜305で偏差
(xt  h)と累積和Σ(xt  k)が求められ、
更に処理306によっては、その累積和に対する許容限
界値が求められるようになっている。処理307ではそ
の累積和の許容限界値との比較が行なわれ、その比較結
果によって処理308゜309.311の何れか1つに
処理は分岐されるものとなっている。即ち、累積和が許
容限界値の範囲内にある場合は処理311で変動無しの
表示のための処理が行なわれた後は、次の処理結果Xt
の入力に備えるようになっている。もしもその範囲内に
ない場合は処理308 、309の何れかでその旨を警
告表示するための処理が行なわれた後は、処理310で
入力数tおよび累積和がクリアされるようになっている
。処理310の後は次の処理結果xtO入力に備えるよ
うになっているものである。
is started as an interrupt, but subsequent to process 302, the number t of input data is updated by +1 in process 303. After this, in steps 304 and 305, the deviation (xt h) and the cumulative sum Σ(xt k) are calculated.
Furthermore, depending on the process 306, a permissible limit value for the cumulative sum is determined. In process 307, the cumulative sum is compared with an allowable limit value, and depending on the comparison result, the process branches to one of processes 308, 309, and 311. That is, if the cumulative sum is within the allowable limit value, after the process for displaying no change is performed in process 311, the next process result Xt
It is now ready for input. If it is not within that range, a process is performed to display a warning to that effect in either process 308 or 309, and then the input number t and cumulative sum are cleared in process 310. . After processing 310, preparations are made for inputting the next processing result xtO.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明による場合は、変動傾向が必
ずしも一定していなく、しかもバラツキの大きさに比し
平均値が管理中心値より微小に変動した場合でもその旨
を高感度に検出し得るという効果がある。
As explained above, in the case of the present invention, even if the fluctuation trend is not necessarily constant and the average value fluctuates minutely from the control center value compared to the magnitude of the dispersion, it can be detected with high sensitivity. There is an effect.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明に係る基本的な製造設備監視装置の構
成を示す図、第2図は、本発明の詳細な説明するための
図、第3図は、コンピュータによって製造設備を監視す
る場合での処理のフローを示す図、第4図は、従来技術
に係る製造設備監視方法を説明するための図である。 101・・・リセット信号発生器、102・・・カウン
タ、103・・・第1演算器、104・・・累積器、1
05・・・第2演算器、106・・・比較器 代理人 弁理士 秋 本 正 実 第1図 +00A 第2図 口、7ト 第3図
Fig. 1 is a diagram showing the configuration of a basic manufacturing equipment monitoring device according to the present invention, Fig. 2 is a diagram for explaining the invention in detail, and Fig. 3 is a diagram showing the configuration of a basic manufacturing equipment monitoring device according to the present invention. FIG. 4 is a diagram illustrating a manufacturing equipment monitoring method according to the prior art. 101... Reset signal generator, 102... Counter, 103... First arithmetic unit, 104... Accumulator, 1
05...Second arithmetic unit, 106...Comparator agent Patent attorney Tadashi Akimoto Figure 1+00A Figure 2 opening, 7th Figure 3

Claims (1)

【特許請求の範囲】[Claims] 1、対象物に対する処理の結果が得られる度に該結果の
予め設定された管理中心値との偏差を求めたうえ累積偏
差値に加算し、加算結果としての累積偏差値が、取込さ
れた処理の結果の数と中心値変動許容限界幅値とにもと
づき求められる上、下限許容限界値と比較されつつ、対
象物に対する処理の結果が監視される製造設備監視方式
1. Every time a processing result for a target object is obtained, the deviation of the result from a preset control center value is calculated and added to the cumulative deviation value, and the cumulative deviation value as the addition result is imported. A manufacturing equipment monitoring method in which the results of processing on a target object are monitored while being determined based on the number of processing results and the center value variation allowable limit width value and compared with the lower limit allowable limit value.
JP23807586A 1986-10-08 1986-10-08 Manufacturing equipment monitoring method Expired - Fee Related JPH0761599B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23807586A JPH0761599B2 (en) 1986-10-08 1986-10-08 Manufacturing equipment monitoring method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23807586A JPH0761599B2 (en) 1986-10-08 1986-10-08 Manufacturing equipment monitoring method

Publications (2)

Publication Number Publication Date
JPS6393548A true JPS6393548A (en) 1988-04-23
JPH0761599B2 JPH0761599B2 (en) 1995-07-05

Family

ID=17024783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23807586A Expired - Fee Related JPH0761599B2 (en) 1986-10-08 1986-10-08 Manufacturing equipment monitoring method

Country Status (1)

Country Link
JP (1) JPH0761599B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04315557A (en) * 1990-08-31 1992-11-06 American Teleph & Telegr Co <Att> Pattern postitioning and analysis device and method in panel manufacturing process
CN114459713A (en) * 2022-01-30 2022-05-10 宁波舜宇智能科技有限公司 Method, system and device for detecting broken cutter and readable storage medium

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52113651A (en) * 1976-03-19 1977-09-22 Nippon Denso Co Ltd Quality information display unit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52113651A (en) * 1976-03-19 1977-09-22 Nippon Denso Co Ltd Quality information display unit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04315557A (en) * 1990-08-31 1992-11-06 American Teleph & Telegr Co <Att> Pattern postitioning and analysis device and method in panel manufacturing process
CN114459713A (en) * 2022-01-30 2022-05-10 宁波舜宇智能科技有限公司 Method, system and device for detecting broken cutter and readable storage medium

Also Published As

Publication number Publication date
JPH0761599B2 (en) 1995-07-05

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