JPS639165U - - Google Patents

Info

Publication number
JPS639165U
JPS639165U JP1986102017U JP10201786U JPS639165U JP S639165 U JPS639165 U JP S639165U JP 1986102017 U JP1986102017 U JP 1986102017U JP 10201786 U JP10201786 U JP 10201786U JP S639165 U JPS639165 U JP S639165U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
lens
optical semiconductor
pedestal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986102017U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0427177Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986102017U priority Critical patent/JPH0427177Y2/ja
Publication of JPS639165U publication Critical patent/JPS639165U/ja
Application granted granted Critical
Publication of JPH0427177Y2 publication Critical patent/JPH0427177Y2/ja
Priority to US08/305,777 priority patent/USRE35713E/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
    • G11B33/125—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a plurality of recording/reproducing devices, e.g. modular arrangements, arrays of disc drives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP1986102017U 1986-07-04 1986-07-04 Expired JPH0427177Y2 (enrdf_load_stackoverflow)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1986102017U JPH0427177Y2 (enrdf_load_stackoverflow) 1986-07-04 1986-07-04
US08/305,777 USRE35713E (en) 1986-07-04 1994-09-14 Disc recording and/or reproducing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986102017U JPH0427177Y2 (enrdf_load_stackoverflow) 1986-07-04 1986-07-04

Publications (2)

Publication Number Publication Date
JPS639165U true JPS639165U (enrdf_load_stackoverflow) 1988-01-21
JPH0427177Y2 JPH0427177Y2 (enrdf_load_stackoverflow) 1992-06-30

Family

ID=30973280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986102017U Expired JPH0427177Y2 (enrdf_load_stackoverflow) 1986-07-04 1986-07-04

Country Status (2)

Country Link
US (1) USRE35713E (enrdf_load_stackoverflow)
JP (1) JPH0427177Y2 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002374005A (ja) * 2001-04-10 2002-12-26 Toshiba Corp 光半導体装置
JP2008258414A (ja) * 2007-04-05 2008-10-23 Rohm Co Ltd 半導体パッケージ
JP2022125901A (ja) * 2021-02-17 2022-08-29 日亜化学工業株式会社 発光装置及び光源装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5748404A (en) * 1995-09-18 1998-05-05 Alps Electric Co., Ltd. Magnetic recording/reproducing device with chassis support structure

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4367502A (en) * 1980-04-11 1983-01-04 Shugart Technology Fixed hard disc drive assembly and clean air system
JPS59177760A (ja) * 1983-03-28 1984-10-08 Toshiba Corp 磁気デイスク装置
US4754397A (en) * 1985-02-15 1988-06-28 Tandem Computers Incorporated Fault tolerant modular subsystems for computers

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002374005A (ja) * 2001-04-10 2002-12-26 Toshiba Corp 光半導体装置
JP2008258414A (ja) * 2007-04-05 2008-10-23 Rohm Co Ltd 半導体パッケージ
JP2022125901A (ja) * 2021-02-17 2022-08-29 日亜化学工業株式会社 発光装置及び光源装置

Also Published As

Publication number Publication date
JPH0427177Y2 (enrdf_load_stackoverflow) 1992-06-30
USRE35713E (en) 1998-01-13

Similar Documents

Publication Publication Date Title
JPS639165U (enrdf_load_stackoverflow)
JPS5930540Y2 (ja) 発光ダイオ−ドランプ
JPS63101990U (enrdf_load_stackoverflow)
JPH0367461U (enrdf_load_stackoverflow)
JPH0546710B2 (enrdf_load_stackoverflow)
JPH0133888B2 (enrdf_load_stackoverflow)
JPS648761U (enrdf_load_stackoverflow)
JPS6057022U (ja) 発光ダイオ−ド付押釦スイツチ
JPS6232558U (enrdf_load_stackoverflow)
JPH0241461U (enrdf_load_stackoverflow)
JPH0518814Y2 (enrdf_load_stackoverflow)
JPS59195882A (ja) インタラプタ
JPS642447U (enrdf_load_stackoverflow)
JPH03130577U (enrdf_load_stackoverflow)
JPH023617U (enrdf_load_stackoverflow)
JPS6240854U (enrdf_load_stackoverflow)
JPH0732266B2 (ja) ホトインタラプタ
JPH0486963U (enrdf_load_stackoverflow)
JPS6269340U (enrdf_load_stackoverflow)
JPH0267750A (ja) 光半導体集積回路素子
JPH0163140U (enrdf_load_stackoverflow)
JPS6233128U (enrdf_load_stackoverflow)
JPH0468563U (enrdf_load_stackoverflow)
JPH0369259U (enrdf_load_stackoverflow)
JPS6364057U (enrdf_load_stackoverflow)