JPS639114Y2 - - Google Patents

Description

[Detailed description of the invention] [Technical field of the invention] The invention relates to the improvement of sockets for semiconductor ICs,
A semiconductor that can be easily removed from a socket, especially pin grid array type semiconductor ICs.
This relates to IC sockets.

In recent years, electronic devices are becoming smaller and lighter.

Therefore, electronic circuit components mounted on wiring boards are also mounted with high density.

However, when a large number of pin grid array type semiconductor ICs (hereinafter referred to as ICs) are mounted at high density on the wiring board, the sockets for the semiconductor ICs are mounted in such a manner that the adjacent semiconductor ICs are almost in close contact with each other, so that it is difficult to remove the ICs. is extremely difficult.

Therefore, there is a strong demand for a socket for semiconductor ICs from which it is easy to extract high-density mounted ICs.

[Conventional technology and problems]

In a wiring board in which a large number of semiconductor IC sockets are arranged, it is relatively easy to attach the semiconductor IC sockets.

However, when an IC needs to be removed for some reason, a screwdriver or other tool must be inserted between the IC and the semiconductor IC socket to remove it.

This extraction operation is difficult due to the narrow space, and since the IC cannot be extracted in parallel, there is a problem in that excessive force is applied to the IC and semiconductor IC socket, damaging them. Ta.

[Purpose of invention]

In view of the above-mentioned conventional problems, the present invention is based on semiconductor IC.
The object of the present invention is to provide a semiconductor IC socket in which a lever for extracting an IC is attached to the socket.

[Structure of the idea]

The problem described above is that the pair of L-shaped levers for removing the inserted semiconductor IC face the center of the upper surface of the socket body, and are pivoted to the socket body at their respective L-shaped parts, and the levers protruding upward cannot be operated. By tilting the culm to open it on both sides, semiconductor IC
This problem is solved by making the tip of the operating culm of the lever located on the bottom surface of the main body push up the bottom surface of the semiconductor IC main body.

[Example of idea]

The semiconductor according to the present invention with reference to the drawings below:
An embodiment of the IC socket will be described in detail.

FIG. 1 shows an embodiment of the present invention, in which a is a front view and b is a side view.

In the figure, 1 is a wiring board, 2 is a socket for a semiconductor IC mounted on the wiring board 1, and 4 is a pin grid array type IC inserted into the socket 2 for semiconductor IC.

A pair of L-shaped levers 3 for removing the inserted IC 4 are provided facing each other at the center of the upper surface of the socket body.

The operating culm of the lever 3 is fitted into the vertical groove 21 of the socket body, as if inserted from the left and right, facing each other horizontally, and the operating culm, which projects at right angles, projects upward in parallel.

The working culm is located at the bottom of the IC, and its tip has a
A protrusion 31 is formed that comes into contact with the bottom surface of the IC.

Furthermore, a protrusion 22 is formed facing each other in the vertical groove 21 at the left and right ends, and a lever 3 is attached to this protrusion 22.
The recessed portions of the L-shaped portions are fitted together, and the lever 3 is pivotably mounted so as to be freely tiltable.

FIG. 3 is a plan view of such a state.

A large number of the semiconductor IC sockets 2 described above are arranged on the wiring board 1 and adhesively connected using solder dips or the like.

Then, the IC 4 is inserted into the semiconductor IC socket 2.

If you wish to remove the IC4 for some reason with the above configuration, as shown in Figure 2, by tilting the operating culm of the lever 3 that protrudes upward so as to open it to both sides in the direction shown by arrow A. , the protrusion 31 at the tip of the working culm located on the bottom of the IC4 body is the protrusion 2
Rotate around 2 and push up IC4.

In this way, IC4 connects to semiconductor IC socket 2.
It is pushed up into a substantially parallel state and can be easily removed.

The IC4 can be inserted with the working culm vertical and the working culm horizontal.

Since the operating culm is usually upright, it requires almost no plane space for mounting, and it is sufficient to provide space for one of the adjacent semiconductor IC sockets to tilt, and a pair of Since the IC is pulled out horizontally by the lever action of lever 3, no unreasonable force is applied.

Although the above embodiments have been described with respect to ICs, the present invention is not limited to ICs, and can be applied to other semiconductor devices, such as transistors and other elements.

Further, the pivot portion of the lever may be a penetrating pin.

[Effect of idea]

As is clear from the above description, according to the semiconductor IC socket according to the present invention, ICs can be extracted more easily and reliably even in narrow spaces than in the conventional case where a screwdriver or special tool is used. Therefore, high-density packaging is possible, which greatly contributes to the miniaturization of various electronic devices.

[Brief explanation of the drawing]

Fig. 1 is a front view a and a side view b of an embodiment of a semiconductor IC socket according to the present invention, Fig. 2 is a front view for explaining the extracted state, and Fig. 3 is a semiconductor IC socket.
FIG. 3 is a plan view of the IC socket. In the figure, 1 is a wiring board, 2 is a semiconductor IC socket, 3 is an L-shaped lever, 4 is an IC, 21 is a vertical groove, 22 is a protrusion, and 31 is a protrusion.

Claims (1)

[Scope of utility model registration request] A pair of L-shaped levers for removing the installed semiconductor IC face the center of the upper surface of the socket body, and each
By tilting the operating culm of the lever, which is pivotally connected to the socket body and protrudes upward, to open both sides, the tip of the operative culm of the lever located on the bottom of the semiconductor IC body is pivoted to the socket body. A socket for semiconductor IC, characterized in that the bottom surface of the socket is pushed up.