JPS6390839U - - Google Patents
Info
- Publication number
- JPS6390839U JPS6390839U JP18746386U JP18746386U JPS6390839U JP S6390839 U JPS6390839 U JP S6390839U JP 18746386 U JP18746386 U JP 18746386U JP 18746386 U JP18746386 U JP 18746386U JP S6390839 U JPS6390839 U JP S6390839U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- stage
- tape
- semiconductor
- thrusting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 4
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18746386U JPS6390839U (xx) | 1986-12-04 | 1986-12-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18746386U JPS6390839U (xx) | 1986-12-04 | 1986-12-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6390839U true JPS6390839U (xx) | 1988-06-13 |
Family
ID=31137966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18746386U Pending JPS6390839U (xx) | 1986-12-04 | 1986-12-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6390839U (xx) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010171201A (ja) * | 2009-01-22 | 2010-08-05 | Mitsubishi Electric Corp | ピックアップ装置及び半導体チップの製造方法 |
JP4649066B2 (ja) * | 2001-06-14 | 2011-03-09 | 太平洋セメント株式会社 | 真空チャック |
-
1986
- 1986-12-04 JP JP18746386U patent/JPS6390839U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4649066B2 (ja) * | 2001-06-14 | 2011-03-09 | 太平洋セメント株式会社 | 真空チャック |
JP2010171201A (ja) * | 2009-01-22 | 2010-08-05 | Mitsubishi Electric Corp | ピックアップ装置及び半導体チップの製造方法 |
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