JPS6390383U - - Google Patents
Info
- Publication number
- JPS6390383U JPS6390383U JP1986183740U JP18374086U JPS6390383U JP S6390383 U JPS6390383 U JP S6390383U JP 1986183740 U JP1986183740 U JP 1986183740U JP 18374086 U JP18374086 U JP 18374086U JP S6390383 U JPS6390383 U JP S6390383U
- Authority
- JP
- Japan
- Prior art keywords
- solid
- imaging device
- state imaging
- spectroscopic prism
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Color Television Image Signal Generators (AREA)
- Studio Devices (AREA)
Description
第１図はプリズムに固体撮像素子を取付けた状
態を示す図、第２図から第５図は本考案の取付金
具の具体的構造を示す斜視図である。
１：分光プリズム、２，４：取付金具、３：固
体撮像素子、２ｂ，４ｂ：はんだ付部、２ｃ，４
ｃ：穴、２ｃ′：切り欠き、２ｄ，４ｄ：放熱フ
イン。
FIG. 1 is a diagram showing a state in which a solid-state imaging device is attached to a prism, and FIGS. 2 to 5 are perspective views showing the specific structure of the mounting bracket of the present invention. 1: Spectroscopic prism, 2, 4: Mounting bracket, 3: Solid-state image sensor, 2b, 4b: Soldering part, 2c, 4
c: hole, 2c': notch, 2d, 4d: heat dissipation fin.
Claims (1)
部に取付けるに当り、上記固体撮像素子および分
光プリズムの光射出部に各々固定された取付金具
の相対する接合部間を溶融金属で接合し取付ける
装置において、上記取付金具を、その接合部と上
記分光プリズムおよびまたは固体撮像素子の固定
部間の熱抵抗値を高くする構造としたことを特徴
とする固体撮像素子の取付装置。 ２ 上記取付金具の溶融金属接合部と上記分光プ
リズムおよびまたは固体撮像素子の固定部間に切
り欠き、穴等の熱伝導抑圧部を設けたことを特徴
とする実用新案登録請求の範囲第１項記載の固体
撮像素子の取付装置。 ３ 上記取付金具の溶融金属接合部と上記分光プ
リズムおよびまたは固体撮像素子の固定部間に放
熱フインを設けたことを特徴とする実用新案登録
請求の範囲第１項または第２項記載の固体撮像素
子の取付装置。[Scope of Claim for Utility Model Registration] 1. When attaching a plurality of solid-state image sensors to the light emitting part of a spectroscopic prism, between opposing joints of mounting brackets fixed to the solid-state image sensors and the light emitting part of the spectroscopic prism, respectively. of a solid-state imaging device, characterized in that the mounting bracket has a structure that increases the thermal resistance value between the joining part and the fixing part of the spectroscopic prism and/or the solid-state imaging device. Mounting device. 2. Scope of Utility Model Registration Claim 1, characterized in that a heat conduction suppressing portion such as a notch or hole is provided between the molten metal joint portion of the mounting bracket and the fixing portion of the spectroscopic prism and/or solid-state imaging device. A mounting device for the solid-state image sensor described above. 3. The solid-state imaging device according to claim 1 or 2 of the utility model registration claim, characterized in that a heat dissipation fin is provided between the molten metal joint of the mounting bracket and the fixing portion of the spectroscopic prism and/or the solid-state imaging device. Element mounting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986183740U JPS6390383U (en) | 1986-12-01 | 1986-12-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986183740U JPS6390383U (en) | 1986-12-01 | 1986-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6390383U true JPS6390383U (en) | 1988-06-11 |
Family
ID=31130758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986183740U Pending JPS6390383U (en) | 1986-12-01 | 1986-12-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6390383U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE38194E1 (en) | 1996-12-18 | 2003-07-22 | Seiko Epson Corporation | Projection display device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6190459A (en) * | 1984-10-11 | 1986-05-08 | Canon Inc | Package of solid-state image pickup element |
| JPS61135279A (en) * | 1984-12-05 | 1986-06-23 | Sony Corp | Attachment device for solid-state image pickup element |
| JPS6130953B2 (en) * | 1978-09-28 | 1986-07-17 | Suzuki Motor Co |
-
1986
- 1986-12-01 JP JP1986183740U patent/JPS6390383U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6130953B2 (en) * | 1978-09-28 | 1986-07-17 | Suzuki Motor Co | |
| JPS6190459A (en) * | 1984-10-11 | 1986-05-08 | Canon Inc | Package of solid-state image pickup element |
| JPS61135279A (en) * | 1984-12-05 | 1986-06-23 | Sony Corp | Attachment device for solid-state image pickup element |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE38194E1 (en) | 1996-12-18 | 2003-07-22 | Seiko Epson Corporation | Projection display device |