JPS6388411U - - Google Patents
Info
- Publication number
- JPS6388411U JPS6388411U JP18390186U JP18390186U JPS6388411U JP S6388411 U JPS6388411 U JP S6388411U JP 18390186 U JP18390186 U JP 18390186U JP 18390186 U JP18390186 U JP 18390186U JP S6388411 U JPS6388411 U JP S6388411U
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- runner
- resin
- pot
- sealing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 4
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986183901U JPH0345781Y2 (fi) | 1986-11-28 | 1986-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986183901U JPH0345781Y2 (fi) | 1986-11-28 | 1986-11-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6388411U true JPS6388411U (fi) | 1988-06-08 |
| JPH0345781Y2 JPH0345781Y2 (fi) | 1991-09-27 |
Family
ID=31131063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986183901U Expired JPH0345781Y2 (fi) | 1986-11-28 | 1986-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0345781Y2 (fi) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58155727A (ja) * | 1982-03-10 | 1983-09-16 | Mitsubishi Electric Corp | 半導体装置の樹脂封止金型 |
-
1986
- 1986-11-28 JP JP1986183901U patent/JPH0345781Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58155727A (ja) * | 1982-03-10 | 1983-09-16 | Mitsubishi Electric Corp | 半導体装置の樹脂封止金型 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0345781Y2 (fi) | 1991-09-27 |