JPS6387847U - - Google Patents
Info
- Publication number
- JPS6387847U JPS6387847U JP18304286U JP18304286U JPS6387847U JP S6387847 U JPS6387847 U JP S6387847U JP 18304286 U JP18304286 U JP 18304286U JP 18304286 U JP18304286 U JP 18304286U JP S6387847 U JPS6387847 U JP S6387847U
- Authority
- JP
- Japan
- Prior art keywords
- film
- utility
- single layer
- model registration
- conductive wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002356 single layer Substances 0.000 claims 2
- 239000011810 insulating material Substances 0.000 claims 1
- 239000011229 interlayer Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18304286U JPS6387847U (ko) | 1986-11-27 | 1986-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18304286U JPS6387847U (ko) | 1986-11-27 | 1986-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6387847U true JPS6387847U (ko) | 1988-06-08 |
Family
ID=31129410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18304286U Pending JPS6387847U (ko) | 1986-11-27 | 1986-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6387847U (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03116860A (ja) * | 1989-09-29 | 1991-05-17 | Hitachi Ltd | 半導体装置 |
-
1986
- 1986-11-27 JP JP18304286U patent/JPS6387847U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03116860A (ja) * | 1989-09-29 | 1991-05-17 | Hitachi Ltd | 半導体装置 |