JPS6387837U - - Google Patents
Info
- Publication number
- JPS6387837U JPS6387837U JP18126986U JP18126986U JPS6387837U JP S6387837 U JPS6387837 U JP S6387837U JP 18126986 U JP18126986 U JP 18126986U JP 18126986 U JP18126986 U JP 18126986U JP S6387837 U JPS6387837 U JP S6387837U
- Authority
- JP
- Japan
- Prior art keywords
- sealing resin
- mount
- resin
- semiconductor element
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims 1
- 230000008646 thermal stress Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18126986U JPS6387837U (enExample) | 1986-11-25 | 1986-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18126986U JPS6387837U (enExample) | 1986-11-25 | 1986-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6387837U true JPS6387837U (enExample) | 1988-06-08 |
Family
ID=31125982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18126986U Pending JPS6387837U (enExample) | 1986-11-25 | 1986-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6387837U (enExample) |
-
1986
- 1986-11-25 JP JP18126986U patent/JPS6387837U/ja active Pending