JPS6387292A - Portable medium - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention [Object of the Invention] (Industrial Application Field) The present invention relates to a portable medium such as an IC card.

(Prior art) Taking an example of an IC card as a portable medium, (A) in FIG.
, (B) and FIG. 5.

As shown in FIG. 4A, the IC card has an IC chip constituting a microcomputer and memory embedded in a pocket-sized plastic card base 11, and a reader is mounted on the surface of the card base 11. - Several external terminals 10 are provided for transmitting and receiving data to and from external devices such as writers. The IC chip is embedded in the edge of the card base material 11 so that it will not be damaged when the card base material is bent.

This configuration is the standard format of an IC card.

According to the standards of the International Organization for Standardization, the length of the card base material 11,
The width and thickness are each regulated to predetermined dimensions.

In contrast to the above-mentioned standard format, IC cards have recently been equipped with a keyboard 17 and an LCD ( A device is being considered that incorporates a liquid crystal display (LCD) 14 so that the internal microcomputer can be operated manually to check the stored contents without using a reader/writer or the like.

Therefore, as shown in FIG. 5, an IC chip 13, an LCD chip 1
4. Necessary members such as a battery 16 and keys 18 for configuring the keyboard are embedded.

The IC chip 12 is a general-purpose LSI, and a large number of connection pads 13 are provided on its four sides, and an LC
The D chip 14 is also provided with a large number of connection pads on both its upper and lower sides.

Then, wire 19 is connected between these connection pads, etc.
This is done to connect each member.

Arrangement 19 is formed on a flexible substrate such as a film carrier.

(Problems to be Solved by the Invention) However, in an IC card using an IC chip 12 with connection pads 13 provided on the four sides and an LCD chip 14 provided on both the upper and lower sides, the connection pads 13 are The problem is that the routing of the wiring 19 becomes complicated and the space for routing increases, making it difficult to mount a large number of required components at high density in the card base material 11 having a limited size and shape. There was a point.

This invention was made based on the above-mentioned circumstances, and is portable, which reduces the space for connecting wiring and allows easy high-density mounting in card base materials with limited dimensions and shapes. The purpose is to provide a medium.

[Structure of the Invention] (Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention provides a card base material in which a rectangular chip component including an IC is embedded. The gist is that the pads for the chip component are provided only on the sides of the chip component other than at least one side.

(Function) Since the wiring for the chip component including the IC chip is drawn out only from the side other than at least one side such as the negative side or two adjacent sides, it is easy to route the wiring. At the same time, the turning space becomes smaller.

In addition, each chip component, including an IC chip, can be embedded with the side on which no pads are provided closer to the edge of the card base material, making it easier to route the wiring as described above. In combination, high-density mounting into card base materials with limited dimensions and shapes becomes easy.

(Example) Hereinafter, an example of the present invention will be described based on FIGS. 1 to 3.

This embodiment is applied to an IC card having multiple functions.

FIG. 1 is a plan view showing the internal structure, FIG. 2 is an enlarged plan view of the IC chip, and FIG. 3 is an enlarged plan view of the LCD chip.

In this embodiment, the I
Each chip component of the C chip 2 and the LCD chip 4 is configured as follows.

That is, the IC chip 2 has a plurality of pads 3 for connection thereto.
are two adjacent sides 2a of the IC chip 2.

It is arranged only on the 2b side. Depending on the number of pads 3, etc., the plurality of pads 3 are arranged, for example, only on one side on the 2b side.

Then, the other two sides 2C on the side where the pad 3 is not provided
, 2d is rounded as appropriate in an R (curved) shape or in an inclined shape.

Regarding the LCD chip 4, a plurality of pads 5 for connection are arranged only on the two adjacent sides 4a and 4b of the LCD chip 4 in substantially the same manner. Depending on the number of pads 5, etc., the plurality of pads 5 may be, for example, 4.
It is arranged only on one side of the a side.

In addition, the other two sides 4C1 on the side where the pad 5 is not provided
The corner portion 4e formed by 4d is appropriately rounded as described above.

The IC chip 2 is embedded close to the edge of the card base material 1 so that the corner portion 2e thereof is close to the corner portion 1a of the card base material 1. Similarly to this, LC
The D-chip 4 is also embedded close to the edge of the card base material 1 so that its rounded corner 4e is close to the other corner portion 1b of the card base material 1.

6 is a battery, and 8 is a key for configuring the keyboard.

Each member of the chip component 2.4.6@ is embedded in the card base material 1 in this way, and includes the pad 3 of the IC chip 2, the pad 5 of the LCD chip 4, the terminal 7 of the battery 6, and the key. Necessary connections between each of the elements 8 and the like are made by wiring 9.

Next, the action will be explained.

In the IC chip 2 and the LD chip 4, the corners 2e and 4e formed by the two sides 2c and 2d and 4c and 4d on the side where the pad 3.5 is not provided are cut off, respectively. Since each corner 2e14e is embedded so as to be close to each corner 1a11b of the card base material 1, the IC chip 2 and the LCD chip 4 are each embedded even closer to the edge of the card base material 1.

Therefore, a large space can be secured on the side of the IC chip 2 where the pad 3 is provided and on the side where the pad 5 of the LCD chip 4 is provided.

On the other hand, since the wiring 9 of both the IC chip 2 and the LCD chip 4 is drawn out only from the two sides 2a and 2b, 4a and 4b, or each side, the wiring a9 can be easily routed. , the turning space becomes smaller.

As a result, there is more space for the pads 3.4 in chip components such as the IC chip 2 and the LCD chip 4, and this also makes it easier to route the wiring 9 and further reduces the space for routing. High-density mounting is facilitated.

[Effects of the Invention] As explained above, according to the configuration of the present invention, wiring for a chip component including an IC chip can be connected to other sides excluding at least one side such as the - side or two adjacent sides. Since it is pulled out only from the side, it is easier to route the wiring, the space for routing is reduced, and the IC
Each chip component including a chip can be embedded with the side on which no pads are provided closer to the edge of the card base material. Therefore, in combination with the above-mentioned simplification of wiring, there is an advantage that high-density packaging can be easily realized in a card base material having a limited size and shape.

[Brief explanation of the drawing]

1 to 3 show an embodiment of a portable medium according to the present invention, in which FIG. 1 is a plan view showing the internal structure, FIG. 2 is an enlarged plan view of an IC chip, and FIG. 3 is an LCD. FIG. 4 is an enlarged plan view of the chip, FIG. 4 is a perspective view showing a conventional portable medium, and FIG. 5 is a plan view showing the internal structure of the conventional example. 1: Card base material, 2: IC chip, 2e, 4e: corner portions with cut corners, 3: connection pads in IC chip, 4: LCD chip. 5: Connection pads on the LCD chip, 6: Battery, 8: Keys for configuring the keyboard, 9: Wiring.

Claims (3)

[Claims] (1) In cases where a rectangular chip component containing an IC is embedded in a card base material, connection pads on the chip component must be placed only on at least one side of the chip component. A portable medium featuring: (2) The portable medium according to claim 1, wherein the connection pads are provided only on two adjacent sides. (3) The corners formed by the two sides of the chip component on which the pads are not provided are cut off, and the chip component is buried so that the cut corners are close to the corners of the card base material. The second claim characterized in that
PORTABLE MEDIA AS DESCRIBED IN SECTION.