JPS6386520A - Photoresist film forming equipment - Google Patents
Photoresist film forming equipmentInfo
- Publication number
- JPS6386520A JPS6386520A JP23269686A JP23269686A JPS6386520A JP S6386520 A JPS6386520 A JP S6386520A JP 23269686 A JP23269686 A JP 23269686A JP 23269686 A JP23269686 A JP 23269686A JP S6386520 A JPS6386520 A JP S6386520A
- Authority
- JP
- Japan
- Prior art keywords
- photoresist
- cup
- exhaust
- coating
- photoresist film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 52
- 239000011248 coating agent Substances 0.000 claims abstract description 20
- 238000000576 coating method Methods 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000004065 semiconductor Substances 0.000 claims abstract description 14
- 239000002904 solvent Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 2
- 239000000428 dust Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体集積回路製造装置、特にフォトレジスト
膜形成装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor integrated circuit manufacturing apparatus, and particularly to a photoresist film forming apparatus.
従来、この種のフォトレジト膜形成装置では第３図に示
すように半導体基板Ｗ」−にフォトレジストを滴下した
後、半導体基板を回転させ、回転数や回転時間を制御す
ることによって所望するフカ１−レジスト膜を形成して
いたが、半導体基板の回転時に飛散するフォトレジスト
を受けるカップ２に入る空気１０は特に制御されておら
ず、またカップ２からの排気についても単に排気ホース
９を通して行うのみで特別に厳しく制御されていなかっ
た。Conventionally, in this type of photoresist film forming apparatus, as shown in FIG. 3, after dropping a photoresist onto a semiconductor substrate W'-, the semiconductor substrate is rotated and a desired film 1 is formed by controlling the number of rotations and the rotation time. - Although a resist film was formed, the air 10 entering the cup 2, which receives the photoresist scattered when the semiconductor substrate is rotated, is not particularly controlled, and the exhaust from the cup 2 is simply carried out through an exhaust hose 9. was not particularly tightly controlled.
上述した従来のフォトレジスト膜形成装置のフォトレジ
スト受はカップ２は、空気の流れが制御されていない構
造となっているため、カップ内部で乱気流が発生しフォ
トレジストを滴下し、回転している半導体栽板上に形成
されつつあるフォトレジスト膜表面から乾燥・気化して
いくフォトレジスト中の溶剤の量が面内で一様とならな
くなり、フォトレジス１へ膜厚の均一性が悪くなるとい
う欠点がある。The photoresist receiver of the conventional photoresist film forming apparatus described above has a structure in which the air flow is not controlled in the cup 2, so turbulence occurs inside the cup, causing the photoresist to drop and rotate. The amount of solvent in the photoresist that dries and evaporates from the surface of the photoresist film that is being formed on the semiconductor board becomes uneven within the surface, resulting in poor film thickness uniformity on the photoresist 1. There are drawbacks.
また、フォトレジスト塗布カップ部の内壁に付着したフ
ォトレジストが半導体基板Ｗの回転によって乾燥し、ゴ
ミとなって群上がった場合、半導体基板」−にゴミが多
社に付着するという欠点がある。Furthermore, if the photoresist attached to the inner wall of the photoresist coating cup dries due to the rotation of the semiconductor substrate W and gathers up as dust, there is a drawback that a lot of dust will adhere to the semiconductor substrate.
本発明の目的は」１記欠点を解消するフォトレジスト膜
形成装置を提供することにある。An object of the present invention is to provide a photoresist film forming apparatus that eliminates the drawbacks mentioned above.
上述した従来のフォトレジスト膜形成装置に対し、本発
明はフォトレジスト塗布カップ部へ人出する空気の流れ
を制御することができるという独創的内容を有する。In contrast to the conventional photoresist film forming apparatus described above, the present invention has an original content in that the flow of air to the photoresist coating cup portion can be controlled.
本発明は半導体基板上にフォトレジストを滴下し、基板
を回転させて該基板上にフォトレジスト膜を形成する装
置において、半導体基板の側方を覆う塗布カップ内にダ
ウンフローを形成し、カップ内に飛散するフォトレジス
トを強制的に排除する給排気機構を有することを特徴と
するフォトレジスト膜形成装置である。The present invention is an apparatus that drops photoresist onto a semiconductor substrate and rotates the substrate to form a photoresist film on the substrate. This is a photoresist film forming apparatus characterized by having an air supply/exhaust mechanism for forcibly removing photoresist that is scattered.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
（実施例１） 第１−図は本発明の実施例１を示す断面図である。(Example 1) FIG. 1 is a sectional view showing Embodiment 1 of the present invention.
給気装置１はフォトレジスト塗布カップ２の−Ｌ部に設
置され、排気装置３はフォトレジスト塗布カップ２の底
部に排気ホース５を介して接続され、さらに刊気ホース
６を通して装置外へ排気する構造となっている。The air supply device 1 is installed at the -L portion of the photoresist coating cup 2, and the exhaust device 3 is connected to the bottom of the photoresist coating cup 2 via an exhaust hose 5, and further exhausts the air to the outside of the device through an air hose 6. It has a structure.
給気装置１から供給される空気１０はフィルター４を通
りフォトレジスト塗布カップ２へ供給される。そして供
給された空気１０は排気ホース５を介して排気装置３に
よって強制的に排気ホース６を通して装置外へ排気され
る。このため、フォトレジスト塗布カップ２に一定のダ
ウンフローを作ることができ、またその給排気量を制御
することができる。例えば、給気量をｉ Ｎｉ／ｈ、排
気斌を１．２ＮＩ／ｈ程度に設定し、所望する膜厚を１
００００人とした場合、フォトレジス１へ膜均一性は（
最大値）−（最小値）で３０人程度にすることができる
。Air 10 supplied from the air supply device 1 passes through a filter 4 and is supplied to the photoresist coating cup 2. The supplied air 10 is then forcibly exhausted by the exhaust device 3 through the exhaust hose 5 to the outside of the device through the exhaust hose 6. Therefore, a constant downflow can be created in the photoresist coating cup 2, and the amount of air supply and exhaust can be controlled. For example, the supply air amount is set to i Ni/h, the exhaust gas is set to about 1.2 Ni/h, and the desired film thickness is set to 1 Ni/h.
0,000 people, the film uniformity of photoresist 1 is (
Maximum value) - (Minimum value) The number of participants can be approximately 30.
（実施例２） 第２図は本発明の実施例２を示す断面図である。(Example 2) FIG. 2 is a sectional view showing a second embodiment of the present invention.
本実施例はクリーンルームの空調装置７からのダランフ
ローを天井７ａからフィルター４を通して供給される空
気１０をエアーガイド８によってフォトレジスト塗布カ
ップ２へ供給する構造となっている。排気系統は第１図
で示したものと同様である。In this embodiment, air 10 from a clean room air conditioner 7 is supplied from a ceiling 7a through a filter 4, and the air 10 is supplied to the photoresist coating cup 2 by an air guide 8. The exhaust system is similar to that shown in FIG.
この実施例では、実施例１で設置した給気装置として、
クリーンルームの空調装置７を用い、この空調装置７か
らのダウンフローを利用することによって、実施例１−
と同様の効果を得ることができるため、装置が安価であ
るという利点がある。In this example, as the air supply device installed in Example 1,
Example 1-
Since it is possible to obtain the same effect as that, the device has the advantage of being inexpensive.
以上説明したように本発明はフォトレジスト膜形成装置
のフォトレジスト塗布カップの上部に給気装置を、また
その下部に排気装置を有することにより、フォトレジス
ト塗布カップ部に一定のダウンフローを作ることができ
る。このため、フォトレジストを半導体基板上に滴下し
、その半導体基板を回転させフォトレジスト膜を形成す
る過程において、フォトレジスト膜表面から乾燥気化し
ていくフォトレジスト中の溶剤の量を制御することがで
き、フォトレジスト膜厚の均一性の向」―が可能となる
。As explained above, the present invention provides a photoresist film forming apparatus with an air supply device above the photoresist coating cup and an exhaust device below the air supply device, thereby creating a constant downflow in the photoresist coating cup portion. Can be done. Therefore, in the process of dropping photoresist onto a semiconductor substrate and rotating the semiconductor substrate to form a photoresist film, it is possible to control the amount of solvent in the photoresist that dries and evaporates from the surface of the photoresist film. This makes it possible to improve the uniformity of the photoresist film thickness.
また、フォトレジスト塗布カップ部の底に付着し乾燥し
たフォトレジストが、半導体基板の回転よってゴミとな
って舞」二がろうとしても、ダウンフローによりすみや
かに排気側へ送られるため、半導体基板上にゴミが付着
することを防止できる効果を有するものである。In addition, even if the dried photoresist that adheres to the bottom of the photoresist coating cup becomes dust due to the rotation of the semiconductor substrate and tries to fly away, it is quickly sent to the exhaust side by the downflow, so that This has the effect of preventing dust from adhering to the surface.
第１図、第２図は本発明のフォトレジスト膜形成装置の
フォトレジスト塗布カップ部周辺の断面図、第３図は従
来のフォトレジスト膜形成装置のフォトレジスト塗布カ
ップ部周辺の断面図である。1 and 2 are cross-sectional views around the photoresist coating cup portion of the photoresist film forming apparatus of the present invention, and FIG. 3 is a cross-sectional view around the photoresist coating cup portion of a conventional photoresist film forming apparatus. .
Claims (1)
回転させて該基板上にフォトレジスト膜を形成する装置
において、半導体基板の側方を覆う塗布カップ内にダウ
ンフローを形成し、塗布カップ内に飛散するフォトレジ
ストを強制的に排除する給排気機構を有することを特徴
とするフォトレジスト膜形成装置。(1) In an apparatus that drops photoresist onto a semiconductor substrate and rotates the substrate to form a photoresist film on the substrate, a downflow is formed in a coating cup that covers the sides of the semiconductor substrate, and the coating cup A photoresist film forming apparatus characterized by having an air supply/exhaust mechanism for forcibly removing photoresist scattered therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23269686A JPS6386520A (en) | 1986-09-30 | 1986-09-30 | Photoresist film forming equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23269686A JPS6386520A (en) | 1986-09-30 | 1986-09-30 | Photoresist film forming equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6386520A true JPS6386520A (en) | 1988-04-16 |
Family
ID=16943338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23269686A Pending JPS6386520A (en) | 1986-09-30 | 1986-09-30 | Photoresist film forming equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6386520A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01186618A (en) * | 1988-01-14 | 1989-07-26 | Seiko Epson Corp | Substrate surface treatment equipment |
| JPH04150972A (en) * | 1990-10-11 | 1992-05-25 | Tokyo Electron Ltd | Coating apparatus |
-
1986
- 1986-09-30 JP JP23269686A patent/JPS6386520A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01186618A (en) * | 1988-01-14 | 1989-07-26 | Seiko Epson Corp | Substrate surface treatment equipment |
| JPH04150972A (en) * | 1990-10-11 | 1992-05-25 | Tokyo Electron Ltd | Coating apparatus |
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