JPS6384941U - - Google Patents

Info

Publication number
JPS6384941U
JPS6384941U JP1986178957U JP17895786U JPS6384941U JP S6384941 U JPS6384941 U JP S6384941U JP 1986178957 U JP1986178957 U JP 1986178957U JP 17895786 U JP17895786 U JP 17895786U JP S6384941 U JPS6384941 U JP S6384941U
Authority
JP
Japan
Prior art keywords
electrode pad
conductive adhesive
substrate
groove
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986178957U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0440277Y2 (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986178957U priority Critical patent/JPH0440277Y2/ja
Publication of JPS6384941U publication Critical patent/JPS6384941U/ja
Application granted granted Critical
Publication of JPH0440277Y2 publication Critical patent/JPH0440277Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view

Landscapes

  • Wire Bonding (AREA)
JP1986178957U 1986-11-20 1986-11-20 Expired JPH0440277Y2 (cg-RX-API-DMAC7.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986178957U JPH0440277Y2 (cg-RX-API-DMAC7.html) 1986-11-20 1986-11-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986178957U JPH0440277Y2 (cg-RX-API-DMAC7.html) 1986-11-20 1986-11-20

Publications (2)

Publication Number Publication Date
JPS6384941U true JPS6384941U (cg-RX-API-DMAC7.html) 1988-06-03
JPH0440277Y2 JPH0440277Y2 (cg-RX-API-DMAC7.html) 1992-09-21

Family

ID=31121578

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986178957U Expired JPH0440277Y2 (cg-RX-API-DMAC7.html) 1986-11-20 1986-11-20

Country Status (1)

Country Link
JP (1) JPH0440277Y2 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007103439A (ja) * 2005-09-30 2007-04-19 Optrex Corp 半導体集積回路

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW456075B (en) 1999-03-31 2001-09-21 Seiko Epson Corp Connector used for small spacing, static actuator, piezoelectric actuator, ink jet head, ink jet printer, micro machine, liquid display plate, and electronic machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007103439A (ja) * 2005-09-30 2007-04-19 Optrex Corp 半導体集積回路

Also Published As

Publication number Publication date
JPH0440277Y2 (cg-RX-API-DMAC7.html) 1992-09-21

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