JPS6384939U - - Google Patents
Info
- Publication number
- JPS6384939U JPS6384939U JP17991786U JP17991786U JPS6384939U JP S6384939 U JPS6384939 U JP S6384939U JP 17991786 U JP17991786 U JP 17991786U JP 17991786 U JP17991786 U JP 17991786U JP S6384939 U JPS6384939 U JP S6384939U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heating
- heating table
- pellets
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000008188 pellet Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims 6
- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 claims 1
- 239000006023 eutectic alloy Substances 0.000 claims 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17991786U JPS6384939U (cs) | 1986-11-21 | 1986-11-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17991786U JPS6384939U (cs) | 1986-11-21 | 1986-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6384939U true JPS6384939U (cs) | 1988-06-03 |
Family
ID=31123403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17991786U Pending JPS6384939U (cs) | 1986-11-21 | 1986-11-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6384939U (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002050643A (ja) * | 2000-07-03 | 2002-02-15 | Esec Trading Sa | 可撓性基板上への半導体チップの取り付け方法及び装置 |
-
1986
- 1986-11-21 JP JP17991786U patent/JPS6384939U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002050643A (ja) * | 2000-07-03 | 2002-02-15 | Esec Trading Sa | 可撓性基板上への半導体チップの取り付け方法及び装置 |